Patents by Inventor Yong-Wei Chen

Yong-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9780490
    Abstract: A cable connector assembly includes a connector and a cable electrically connected thereto. The connector includes a metal shell, a metal cage enclosing a rear end of the metal shell, and an outer housing enclosing the metal cage therein. The connector has a front end for inserting into a mating connector and a rear end. The diametrical dimension of the front end is smaller than the diametrical dimension of the rear end. The outer housing includes a front portion extending forwardly beyond the metal cage to prevent the cable connector mistakenly inserted into an unintended receptacle connector.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: October 3, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Da-Wei Xing, Yong-Wei Chen, Jun Chen, Jerry Wu
  • Patent number: 9271087
    Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: February 23, 2016
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Chih-Hsien Chung, Yong-Wei Chen, Jhyy-Cheng Liou