Abstract: A system for a semiconductor fabrication facility comprises a transporting tool configured to move a carrier, a first manufacturing tool configured to accept the carrier facing in a first direction, a second manufacturing tool configured to accept the carrier facing in the second direction, and an orientation tool. The carrier is moved to the orientation tool by the transporting tool prior to being moved to the first manufacturing tool or the second manufacturing tool by the transporting tool. The orientation tool rotates the carrier so that the carrier is accepted by the first manufacturing tool or the second manufacturing tool. The transporting tool, the first manufacturing tool, the second manufacturing tool and the orientation tool are physically separated from each other.

Abstract: A cable connector assembly includes a connector and a cable electrically connected thereto. The connector includes a metal shell, a metal cage enclosing a rear end of the metal shell, and an outer housing enclosing the metal cage therein. The connector has a front end for inserting into a mating connector and a rear end. The diametrical dimension of the front end is smaller than the diametrical dimension of the rear end. The outer housing includes a front portion extending forwardly beyond the metal cage to prevent the cable connector mistakenly inserted into an unintended receptacle connector.

Abstract: A cable connector assembly includes a connector and a cable electrically connected thereto. The connector includes a metal shell, a metal cage enclosing a rear end of the metal shell, and an outer housing enclosing the metal cage therein. The connector has a front end for inserting into a mating connector and a rear end. The diametrical dimension of the front end is smaller than the diametrical dimension of the rear end. The outer housing includes a front portion extending forwardly beyond the metal cage to prevent the cable connector mistakenly inserted into an unintended receptacle connector.

Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.