Patents by Inventor Yoon-chul Son

Yoon-chul Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9037063
    Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 19, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, Ha-jin Kim, Dong-earn Kim, Dong-ouk Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Kun-mo Chu
  • Patent number: 9002253
    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Sang-eui Lee, Kun-mo Chu
  • Publication number: 20140205336
    Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.
    Type: Application
    Filed: December 2, 2013
    Publication date: July 24, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kun-mo CHU, Dong-earn KIM, Sang-eui LEE, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON
  • Publication number: 20140127558
    Abstract: A composite anode active material, a method of preparing the composite anode active material, and a lithium battery including the lithium battery. According to the method of preparing the composite anode active material, carbon nanotubes are formed on a Si particle without a separate operation of applying a catalyst. Furthermore, high adherence is provided between the Si particle and carbon nanotubes, and therefore the composite anode active material is used as an anode material of the lithium battery.
    Type: Application
    Filed: January 15, 2014
    Publication date: May 8, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ho-suk KANG, Jeong-hee LEE, Yoon-chul SON, Jeong-na HEO
  • Publication number: 20140126940
    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 8, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul SON, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Sang-eui LEE, Kun-mo CHU
  • Patent number: 8691685
    Abstract: In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions can be achieved through a reaction-preventative or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: April 8, 2014
    Assignee: International Business Machines Corporation
    Inventors: Sung Kwon Kang, Da-Yuan Shih, Yoon-Chul Son
  • Patent number: 8679964
    Abstract: In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: March 25, 2014
    Assignee: International Business Machines Corporation
    Inventors: Sung Kwon Kang, Da-Yuan Shih, Yoon-Chul Son
  • Publication number: 20140072353
    Abstract: A fusing apparatus including a heating unit including a heater having a substantially flat shape; a nip forming unit which faces the heating unit and forms a fusing nip with the heating unit; and a driving unit which moves the heating unit to alternately repeat a forward motion whereby the heating unit moves forward in a moving direction of the recording medium, when the fusing nip is formed, and a returning motion whereby the heating unit moves backward in a direction opposite to the moving direction of the recording medium, when the fusing nip is released.
    Type: Application
    Filed: June 21, 2013
    Publication date: March 13, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Sang-eui LEE, Kun-mo CHU, In-taek HAN
  • Patent number: 8663836
    Abstract: A composite anode active material, a method of preparing the composite anode active material, and a lithium battery including the lithium battery. According to the method of preparing the composite anode active material, carbon nanotubes are formed on a Si particle without a separate operation of applying a catalyst. Furthermore, high adherence is provided between the Si particle and carbon nanotubes, and therefore the composite anode active material is used as an anode material of the lithium battery.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: March 4, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-suk Kang, Jeong-hee Lee, Yoon-chul Son, Jeong-na Heo
  • Publication number: 20140053393
    Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
    Type: Application
    Filed: June 28, 2013
    Publication date: February 27, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui LEE, Ha-jin KIM, Dong-earn KIM, Dong-ouk KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Kun-mo CHU
  • Patent number: 8593049
    Abstract: A field electron emitter including a metal electrode; and a plurality of carbon nanotubes, wherein a portion of the plurality of carbon nanotubes protrude from a surface of the metal electrode and a portion of the plurality of carbon nanotubes are in the metal electrode. Also disclosed is a field electron emission device including the field electron emitter and a method of manufacturing the field electron emitter.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: November 26, 2013
    Assignees: Samsung Electronics Co., Ltd., Korea University Research and Business Foundation
    Inventors: Yoon-chul Son, Yong-chul Kim, Jeong-na Heo, Woo-sung Cho, Byeong-kwon Ju
  • Publication number: 20130302074
    Abstract: A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.
    Type: Application
    Filed: May 8, 2013
    Publication date: November 14, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui LEE, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Kun-mo CHU, In-taek HAN
  • Publication number: 20130251425
    Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 26, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul SON, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Sang-eui LEE, Kun-mo CHU, In-taek HAN
  • Patent number: 8531096
    Abstract: A field emission device includes; a substrate including at least one groove, at least one metal electrode disposed respectively in the at least one groove, and carbon nanotube (“CNT”) emitters disposed respectively on the at least one metal electrode, wherein each of the CNT emitters includes a composite of Sn and CNTs.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: September 10, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Yong-chul Kim, In-taek Han, Ho-suk Kang
  • Publication number: 20130222510
    Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 29, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-ouk KIM, Dong-earn KIM, Ha-Jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Sang-eui LEE, Kun-mo CHU, In-taek HAN
  • Patent number: 8517249
    Abstract: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: August 27, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Won-kyoung Choi, Chang-youl Moon, Yoon-chul Son, Young-ho Kim, Hee-ra Roh, Chang-yul Oh
  • Patent number: 8344606
    Abstract: A field emission device includes a substrate including a groove; a metal electrode disposed on a bottom surface of the groove; and a carbon nanotube (“CNT”) emitter. The CNT emitter includes an intermetallic compound layer disposed on the metal electrode and CNTs disposed on the intermetallic compound layer.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: January 1, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Yong-chul Kim, In-taek Han, Ho-suk Kang
  • Publication number: 20120294659
    Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
    Type: Application
    Filed: May 18, 2012
    Publication date: November 22, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-eui LEE, In-taek HAN, Yoon-chul SON, Ha-jin KIM, Dong-ouk KIM, Dong-earn KIM, Kun-mo CHU
  • Patent number: 8314539
    Abstract: A field electron emitter includes a thin film layer including a carbon nanotube (“CNT”) disposed on a substrate, wherein the thin film layer includes nucleic acid.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: November 20, 2012
    Assignees: Samsung Electronics Co., Ltd., Korea University Industrial & Academic Collaboration Foundation
    Inventors: Yoon-chul Son, Yong-chul Kim, Jeong-na Heo, Byeong-kwon Ju
  • Publication number: 20120207525
    Abstract: A resistance heating composition including carbon nanotubes, an ionic liquid, and a binder resin.
    Type: Application
    Filed: February 13, 2012
    Publication date: August 16, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-ouk KIM, Ha-Jin KIM, In-taek HAN, Yoon-chul SON, Sang-soo JEE, Dong-earn KIM, Sang-eui LEE, Kun-mo CHU