Patents by Inventor Yoon-ki Min
Yoon-ki Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11908733Abstract: Provided are a substrate processing method and a device manufactured by using the same, which may improve etch selectivity of an insulating layer deposited on a stepped structure. The substrate processing method includes: forming a first layer on a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; weakening at least a portion of the first layer; forming a second layer on the first layer; and performing an isotropic etching process on the first layer and the second layer.Type: GrantFiled: May 10, 2022Date of Patent: February 20, 2024Assignee: ASM IP Holding B.V.Inventor: Yoon Ki Min
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Publication number: 20220270920Abstract: Provided are a substrate processing method and a device manufactured by using the same, which may improve etch selectivity of an insulating layer deposited on a stepped structure. The substrate processing method includes: forming a first layer on a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; weakening at least a portion of the first layer; forming a second layer on the first layer; and performing an isotropic etching process on the first layer and the second layer.Type: ApplicationFiled: May 10, 2022Publication date: August 25, 2022Inventor: Yoon Ki Min
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Patent number: 11361990Abstract: Provided are a substrate processing method and a device manufactured by using the same, which may improve etch selectivity of an insulating layer deposited on a stepped structure. The substrate processing method includes: forming a first layer on a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; weakening at least a portion of the first layer; forming a second layer on the first layer; and performing an isotropic etching process on the first layer and the second layer.Type: GrantFiled: May 23, 2019Date of Patent: June 14, 2022Assignee: ASM IP Holding B.V.Inventor: Yoon Ki Min
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Patent number: 11195845Abstract: Provided is a substrate processing method that may prevent the non-uniformity of the thickness of landing pads deposited on each step in a vertical NAND device having a stepped structure. The substrate processing method includes stacking, a plurality of times, a stack structure including an insulating layer and a sacrificial layer and etching the stack structure to form a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface. The method also includes forming a barrier layer on the stepped structure, forming a mask layer on the barrier layer and exposing at least a portion of the barrier layer by etching at least a portion of the mask layer with a first etching solution The method further includes etching the exposed barrier layer with a second etching solution and etching the mask layer with a third etching solution.Type: GrantFiled: October 16, 2020Date of Patent: December 7, 2021Assignee: ASM IP HOLDING B.V.Inventors: Tae Hee Yoo, Yoon Ki Min, Yong Min Yoo
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Patent number: 10959452Abstract: The present invention relates to a composition and a healthy food product for inducing bowel movements and promoting weight loss comprising 47-57 parts by weight of a psyllium husk powder, 18-28 parts by weight of a rice bran powder, 5-6 parts by weight of a kelp powder, 4-5 parts by weight of a fructooligosaccharide, 3.5-4.5 parts by weight of chicory fiber, 3-4 parts of weight of glasswort, 2.5-3.5 parts by weight of yeast powder, 1.5-2.5 parts by weight of lactulose powder, 0.5-1.5 parts by weight of lactic acid bacteria powder, 0.05-0.15 parts by weight of complex amino acid, 0.4-0.6 parts by weight of Aloe arborescens, and 0.5-1.5 parts by weight of garlic powder. The composition and health food product for inducing bowel movements and promoting weight loss of the present invention comprise nutritional ingredients such as vegetable dietary fiber, vitamins, minerals, etc. which feed beneficial intestinal bacteria.Type: GrantFiled: February 11, 2019Date of Patent: March 30, 2021Assignee: RG BIO CO., LTDInventors: Se Jin Park, Yoon Ki Min
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Publication number: 20210035988Abstract: Provided is a substrate processing method that may prevent the non-uniformity of the thickness of landing pads deposited on each step in a vertical NAND device having a stepped structure. The substrate processing method includes stacking, a plurality of times, a stack structure including an insulating layer and a sacrificial layer and etching the stack structure to form a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface.Type: ApplicationFiled: October 16, 2020Publication date: February 4, 2021Inventors: Tae Hee Yoo, Yoon Ki Min, Yong Min Yoo
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Publication number: 20200375236Abstract: The present invention relates to a composition and a healthy food product for inducing bowel movements and promoting weight loss comprising 47-57 parts by weight of a psyllium husk powder, 18-28 parts by weight of a rice bran powder, 5-6 parts by weight of a kelp powder, 4-5 parts by weight of a fructooligosaccharide, 3.5-4.5 parts by weight of chicory fiber, 3-4 parts of weight of glasswort, 2.5-3.5 parts by weight of yeast powder, 1.5-2.5 parts by weight of lactulose powder, 0.5-1.5 parts by weight of lactic acid bacteria powder, 0.05-0.15 parts by weight of complex amino acid, 0.4-0.6 parts by weight of Aloe arborescens, and 0.5-1.5 parts by weight of garlic powder. The composition and health food product for inducing bowel movements and promoting weight loss of the present invention comprise nutritional ingredients such as vegetable dietary fiber, vitamins, minerals, etc. which feed beneficial intestinal bacteria.Type: ApplicationFiled: February 11, 2019Publication date: December 3, 2020Inventors: Se Jin PARK, Yoon Ki MIN
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Patent number: 10847529Abstract: Provided is a substrate processing method that may prevent the non-uniformity of the thickness of landing pads deposited on each step in the process of selectively depositing a landing pad in a vertical NAND device having a stepped structure. The substrate processing method includes stacking, a plurality of times, a stack structure including an insulating layer and a sacrificial layer and etching the stack structure to form a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface. The method also includes forming a barrier layer on the stepped structure, forming a mask layer on the barrier layer and exposing at least a portion of the barrier layer by etching at least a portion of the mask layer with a first etching solution The method further includes etching the exposed barrier layer with a second etching solution and etching the mask layer with a third etching solution.Type: GrantFiled: April 12, 2018Date of Patent: November 24, 2020Assignee: ASM IP Holding B.V.Inventors: Tae Hee Yoo, Yoon Ki Min, Yong Min Yoo
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Publication number: 20200283887Abstract: An effusion cell for evaporating a thin film forming material, including: a case with an inner space; a crucible provided in the inner space and containing the thin film forming material; and a nozzle provided on a top of the crucible so that the thin film forming material is discharged to the outside of the crucible therethrough, in which the nozzle includes an upwardly upwardly reduced inclination formed to be inclined toward an inside of the crucible from one end of a lower of the nozzle; a first upwardly enlarged inclination formed to be inclined toward an edge of the crucible from an upper end portion of the upwardly reduced inclination; and a second upwardly enlarged inclination formed to be inclined toward the edge of the crucible at an upper end portion of the first upwardly enlarged inclination.Type: ApplicationFiled: November 8, 2017Publication date: September 10, 2020Inventors: Il Kwon Moon, Su Young Cha, Yoon Ki Min, Do Weon Hwang
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Patent number: 10644025Abstract: A method of processing a substrate by omitting a photolithographic process is disclosed. The method includes forming at least one layer on a stepped structure having an upper surface, a lower surface, and a side surface that connects the upper surface to the lower surface, selectively densifying portions of the at least one layer respectively on the upper surface and the lower surface via asymmetric plasma application, and performing an isotropic etching process on the at least one layer. During the isotropic etching process, the portion of the at least one layer formed on the upper surface is separated from the portion of the at least one layer formed on the lower surface.Type: GrantFiled: September 28, 2018Date of Patent: May 5, 2020Assignee: ASM IP Holding B.V.Inventors: Seung Ju Chun, Yong Min Yoo, Jong Wan Choi, Young Jae Kim, Sun Ja Kim, Wan Gyu Lim, Yoon Ki Min, Hae Jin Lee, Tae Hee Yoo
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Patent number: 10622375Abstract: A method of processing a substrate by omitting a photolithographic process is disclosed. The method includes forming at least one layer on a stepped structure having an upper surface, a lower surface, and a side surface that connects the upper surface to the lower surface, selectively densifying portions of the at least one layer respectively on the upper surface and the lower surface via asymmetric plasma application, and performing an isotropic etching process on the at least one layer. During the isotropic etching process, the portion of the at least one layer formed on the upper surface is separated from the portion of the at least one layer formed on the lower surface.Type: GrantFiled: November 13, 2018Date of Patent: April 14, 2020Assignee: ASM IP Holding B.V.Inventors: Seung Ju Chun, Yong Min Yoo, Jong Wan Choi, Young Jae Kim, Sun Ja Kim, Wan Gyu Lim, Yoon Ki Min, Hae Jin Lee, Tae Hee Yoo
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Patent number: 10504901Abstract: A substrate processing method includes stacking a plurality of stack structures each including an insulating layer and a sacrificial layer, on one another. The method also includes generating a stair structure by etching the stack structures and generating a separation layer on a side surface of the stair structure. The method further includes removing the sacrificial layer and generating conductive word line structures in spaces from which the sacrificial layer is removed. The separation layer is provided between the conductive word line structures.Type: GrantFiled: April 12, 2018Date of Patent: December 10, 2019Assignee: ASM IP HOLDING B.V.Inventors: Tae Hee Yoo, Yoon Ki Min, Yong Min Yoo
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Publication number: 20190363006Abstract: Provided are a substrate processing method and a device manufactured by using the same, which may improve etch selectivity of an insulating layer deposited on a stepped structure. The substrate processing method includes: forming a first layer on a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; weakening at least a portion of the first layer; forming a second layer on the first layer; and performing an isotropic etching process on the first layer and the second layer.Type: ApplicationFiled: May 23, 2019Publication date: November 28, 2019Inventor: Yoon Ki Min
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Publication number: 20190081072Abstract: A method of processing a substrate by omitting a photolithographic process is disclosed. The method includes forming at least one layer on a stepped structure having an upper surface, a lower surface, and a side surface that connects the upper surface to the lower surface, selectively densifying portions of the at least one layer respectively on the upper surface and the lower surface via asymmetric plasma application, and performing an isotropic etching process on the at least one layer. During the isotropic etching process, the portion of the at least one layer formed on the upper surface is separated from the portion of the at least one layer formed on the lower surface.Type: ApplicationFiled: November 13, 2018Publication date: March 14, 2019Inventors: Seung Ju Chun, Yong Min Yoo, Jong Wan Choi, Young Jae Kim, Sun Ja Kim, Wan Gyu Lim, Yoon Ki Min, Hae Jin Lee, Tae Hee Yoo
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Publication number: 20190035810Abstract: A method of processing a substrate by omitting a photolithographic process is disclosed. The method includes forming at least one layer on a stepped structure having an upper surface, a lower surface, and a side surface that connects the upper surface to the lower surface, selectively densifying portions of the at least one layer respectively on the upper surface and the lower surface via asymmetric plasma application, and performing an isotropic etching process on the at least one layer. During the isotropic etching process, the portion of the at least one layer formed on the upper surface is separated from the portion of the at least one layer formed on the lower surface.Type: ApplicationFiled: September 28, 2018Publication date: January 31, 2019Inventors: Seung Ju Chun, Yong Min Yoo, Jong Wan Choi, Young Jae Kim, Sun Ja Kim, Wan Gyu Lim, Yoon Ki Min, Hae Jin Lee, Tae Hee Yoo
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Patent number: 10134757Abstract: A method of processing a substrate by omitting a photolithographic process is disclosed. The method includes forming at least one layer on a stepped structure having an upper surface, a lower surface, and a side surface that connects the upper surface to the lower surface, selectively densifying portions of the at least one layer respectively on the upper surface and the lower surface via asymmetric plasma application, and performing an isotropic etching process on the at least one layer. During the isotropic etching process, the portion of the at least one layer formed on the upper surface is separated from the portion of the at least one layer formed on the lower surface.Type: GrantFiled: June 30, 2017Date of Patent: November 20, 2018Assignee: ASM IP Holding B.V.Inventors: Seung Ju Chun, Yong Min Yoo, Jong Wan Choi, Young Jae Kim, Sun Ja Kim, Wan Gyu Lim, Yoon Ki Min, Hae Jin Lee, Tae Hee Yoo
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Publication number: 20180315758Abstract: A substrate processing method includes stacking a plurality of stack structures each including an insulating layer and a sacrificial layer, on one another. The method also includes generating a stair structure by etching the stack structures and generating a separation layer on a side surface of the stair structure. The method further includes removing the sacrificial layer and generating conductive word line structures in spaces from which the sacrificial layer is removed. The separation layer is provided between the conductive word line structures.Type: ApplicationFiled: April 12, 2018Publication date: November 1, 2018Inventors: Tae Hee Yoo, Yoon Ki Min, Yong Min Yoo
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Publication number: 20180301460Abstract: Provided is a substrate processing method that may prevent the non-uniformity of the thickness of landing pads deposited on each step in the process of selectively depositing a landing pad in a vertical NAND device having a stepped structure. The substrate processing method includes stacking, a plurality of times, a stack structure including an insulating layer and a sacrificial layer and etching the stack structure to form a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface. The method also includes forming a barrier layer on the stepped structure, forming a mask layer on the barrier layer and exposing at least a portion of the barrier layer by etching at least a portion of the mask layer with a first etching solution The method further includes etching the exposed barrier layer with a second etching solution and etching the mask layer with a third etching solution.Type: ApplicationFiled: April 12, 2018Publication date: October 18, 2018Inventors: Tae Hee Yoo, Yoon Ki Min, Yong Min Yoo
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Patent number: D880437Type: GrantFiled: May 3, 2018Date of Patent: April 7, 2020Assignee: ASM IP Holding B.V.Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min
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Patent number: D913980Type: GrantFiled: March 4, 2020Date of Patent: March 23, 2021Assignee: ASM IP Holding B.V.Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min