Abstract: An airbag includes a high pressure expansion chamber, a low pressure expansion chamber, and a communication passage, which connects the high pressure expansion chamber and the low pressure expansion chamber to each other. A gas supply port, which supplies inflation gas into the airbag, is located inside the low pressure expansion chamber to discharge the inflation gas toward the inside of the communication passage. The communication passage extends from the edge of a communication port, which connects the high pressure expansion chamber and the low pressure expansion chamber, toward the inside of the high pressure expansion chamber. At deployment and inflation of the airbag, the communication passage is located between a seam formed at the outer periphery of the base fabric sheet of the airbag and the gas supply port.

Abstract: An airbag is manufactured as follows. In a first joining step, peripheral portions of structural fabric portions that are located closer to the main body fabric portions at the installation are joined to the main body fabric portions in a spread state. In a second joining step, a part that is not overlaid onto the structural fabric portions is joined to the main body fabric portions, and a part that is overlaid onto the structural fabric portions is joined only to the structural portions. In a third joining step, peripheral portions of the structural fabric portions that are separated away from the main body fabric portions at the installation are joined to each other.

Abstract: An inflation portion of an airbag main body is divided into a first inflation chamber, a second inflation chamber in front of and adjacent to the first inflation chamber with a vertical partition in between, and a third inflation chamber below the first inflation chamber with a lateral partition in between. The vertical partition has a pressure regulator valve. Before the first inflation chamber restrains an occupant, the pressure regulator valve restricts flow of inflation gas from the first inflation chamber to the second inflation chamber. When the first inflation chamber restrains the occupant, the pressure regulator valve opens in response to a change in the tensed state of the vertical partition due to the applied external force generated by the restraint, thereby cancelling the restraint. The lateral partition has a check valve, which restricts flow of inflation gas from the third inflation chamber to the first inflation chamber.

Abstract: A lateral partition is formed by a pair of structural fabric portions, each of which has a first peripheral portion and a second peripheral portion. The first peripheral portions of the structural fabric portions are each joined to one of main body fabric portions. The second peripheral portions of the structural fabric portions are joined to each other by a joint portion provided along the second peripheral portions. An inner tube extends over the upper inflation chamber and the lower inflation chamber, while intersecting with the lateral partition. A rear peripheral portion of a part of the inner tube is joined to the main body fabric portions by a part of the peripheral joint portion, and a front peripheral portion of the part is joined to the structural fabric portions by the joint portion.

Abstract: An airbag includes an airbag body and an inner tube. The inner tube includes a gas upstream section located in an upstream region of an inflation gas stream fed from a gas generator and a gas outlet section that opens toward an inflatable region of the airbag body and feeds an inflation gas to the inflatable region. The gas outlet section includes a check valve section. The check valve section has a flexible and a generally tubular shape extending and opening toward the inflatable region due to pressure of an inflation gas so as to stream the inflation gas into the inflatable region. After the gas generator has finished discharging the inflation gas, the check valve section folds back toward the gas upstream section due to an internal pressure of the inflatable region and closes off the gas outlet section.

Abstract: A gas generator includes an inflator and a retainer. The retainer includes a holding portion, which partially covers the inflator. The inflator has an attaching protrusion for determining the position relative to the retainer. The retainer includes an engagement base and a tongue piece. The tongue piece extends in an axial direction of the inflator and from a position separated from the engagement base in the circumferential direction of the holding portion. The engagement base and the tongue piece each have an engagement portion. The engagement portions face each other to form an engagement space therebetween, into which the attaching protrusion enters. The engagement space has an inlet the width of which is less than the size of the positioning protrusion. When the inflator causes the positioning protrusion to increase the width of the inlet, the tongue piece is elastically deformed about a basal end of the tongue piece.

Abstract: An airbag apparatus includes an airbag, a retainer secured to the airbag, and an elongated inflator attached to the retainer. The inflator discharges gas for inflating the airbag. The retainer includes an attaching protrusion, which protrudes in a direction intersecting an axis of the inflator and secures the retainer to a vehicle together with the airbag. The inflator includes an attaching protrusion, which protrudes in the direction intersecting the axis and secures the inflator to the vehicle together with the retainer.

Abstract: A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner lead portion has first inner leads connected to the first outer leads and second inner leads connected to the second outer leads. At least either the first or second inner leads are routed in the element-mounting region. An insulation resin is filled in the gaps between the inner leads located on the element-mounting region. A semiconductor device is configured with semiconductor elements mounted on both the top and bottom surfaces of the lead frame.

Abstract: An airbag includes a high pressure expansion chamber, a low pressure expansion chamber, and a communication passage, which connects the high pressure expansion chamber and the low pressure expansion chamber to each other. A gas supply port, which supplies inflation gas into the airbag, is located inside the low pressure expansion chamber to discharge the inflation gas toward the inside of the communication passage. The communication passage extends from the edge of a communication port, which connects the high pressure expansion chamber and the low pressure expansion chamber, toward the inside of the high pressure expansion chamber. At deployment and inflation of the airbag, the communication passage is located between a seam formed at the outer periphery of the base fabric sheet of the airbag and the gas supply port.

Abstract: A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner lead portion has first inner leads connected to the first outer leads and second inner leads connected to the second outer leads. At least either the first or second inner leads are routed in the element-mounting region. An insulation resin is filled in the gaps between the inner leads located on the element-mounting region. A semiconductor device is configured with semiconductor elements mounted on both the top and bottom surfaces of the lead frame.

Abstract: A gas generator includes an inflator and a retainer. The retainer includes a holding portion, which partially covers the inflator. The inflator has an attaching protrusion for determining the position relative to the retainer. The retainer includes an engagement base and a tongue piece. The tongue piece extends in an axial direction of the inflator and from a position separated from the engagement base in the circumferential direction of the holding portion. The engagement base and the tongue piece each have an engagement portion. The engagement portions face each other to form an engagement space therebetween, into which the attaching protrusion enters. The engagement space has an inlet the width of which is less than the size of the positioning protrusion. When the inflator causes the positioning protrusion to increase the width of the inlet, the tongue piece is elastically deformed about a basal end of the tongue piece.

Abstract: A side airbag apparatus includes an airbag 50 that is inflated and deployed in a space between an occupant seated in a vehicle seat 12 and a vehicle body side portion by inflation gas that is supplied from an inflator 41 in response to an impact applied to the vehicle from a side. The airbag 50 has a lumbar region protecting portion 54 that is inflated and deployed beside at least the lumbar region PP of the occupant, thereby protecting the lumbar region PP. In the side airbag apparatus, the lumbar region protecting portion 54 has a part A at which the thickness in the vehicle widthwise direction is the greatest. The position in the vertical direction of the part A is lower than a highest point B in a front portion of the seat cushion 13 of the vehicle seat 12. These settings allow the part A to be inflated and deployed at a position that is spaced downward from the upper end 63U of an ilium of the occupant P.

Abstract: A semiconductor device according to the embodiment is provided with an inner lead. The inner lead includes a first surface and a second surface opposite thereto. A semiconductor chip is mounted on the first surface. A first resin portion seals the semiconductor chip on the first surface. A second resin portion is provided on the second surface. An outer lead is connected to the inner lead, and configured to project outside from the first and second resin portions. A width of the second resin portion in a first direction where the outer lead projects is smaller than that of the first resin portion in the first direction.

Abstract: A semiconductor device includes a lead frame including inner lead portion having inner leads connected to outer leads and relay inner leads not connected to the outer leads. A semiconductor element is mounted on a lower surface of the lead frame. Electrode pads of the semiconductor element are connected to the inner lead portion via metal wire. One end of the relay inner lead is connected to the electrode pad via the metal wire, and the other end is connected to the outer lead via a relay metal wire disposed to step over the inner lead.

Abstract: A semiconductor device includes a circuit base including an inner lead portion and an outer lead portion. The inner lead portion has a plurality of inner leads. At least part of the inner leads is routed inside a chip mounting area. On both upper and lower surfaces of the circuit base, a first and a second semiconductor chip are mounted. At least part of electrode pads of the first semiconductor chip are electrically connected to electrode pads of the second semiconductor chip via the inner leads.

Abstract: A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner lead portion has first inner leads connected to the first outer leads and second inner leads connected to the second outer leads. At least either the first or second inner leads are routed in the element-mounting region. An insulation resin is filled in the gaps between the inner leads located on the element-mounting region. A semiconductor device is configured with semiconductor elements mounted on both the top and bottom surfaces of the lead frame.

Abstract: A semiconductor device includes a lead frame including inner lead portion having inner leads connected to outer leads and relay inner leads not connected to the outer leads. A semiconductor element is mounted on a lower surface of the lead frame. Electrode pads of the semiconductor element are connected to the inner lead portion via metal wire. One end of the relay inner lead is connected to the electrode pad via the metal wire, and the other end is connected to the outer lead via a relay metal wire disposed to step over the inner lead.

Abstract: The damper unit 10 is applicable to structures for seismic energy dissipation. The damper unit 10 comprises, a lower beam 11, an upper beam 12, a left column 21, a right column 22, axially yielding dampers 41, 42 functioning as an energy dissipating means, a left post-tensioned steel bar 31, and a right post-tensioned steel bar 32. The left and right post-tensioned steel bars 31 and 32 are inserted in the left and right columns 21 and 22, respectively. Upper ends of the steel bars 31 and 32 are connected with the upper beam 12. Lower ends of the steel bars 31 and 32 are connected with the lower beam 11. The columns 31 and 32 are semi-rigid connected with the upper beam 12 and the lower beam 11 by compressive forces generated from the steel bars 31 and 32. Therefore, the damper unit 10 possesses both self-centering and seismic energy dissipation characteristics.

Abstract: According to one embodiment, a semiconductor device includes: a lead group including a plurality of leads; a plurality of semiconductor memory chips stacked in a step shape on the lead group; and a resin mold section that seals the semiconductor memory chips. One end of a third lead and the other end of a second lead is connected by a metal wire for relay crossing over a first lead section included in the lead group. The metal wire for relay is provided in a space between the semiconductor memory chips stacked in the step shape and the lead group.

Abstract: A semiconductor device includes a lead frame including inner lead portion having inner leads connected to outer leads and relay inner leads not connected to the outer leads. A semiconductor element is mounted on a lower surface of the lead frame. Electrode pads of the semiconductor element are connected to the inner lead portion via metal wire. One end of the relay inner lead is connected to the electrode pad via the metal wire, and the other end is connected to the outer lead via a relay metal wire disposed to step over the inner lead.