Abstract: The present disclosure provides, for example, a compound represented by the general formula below or a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable solvate of the compound or salt: wherein X1, X2, X3 and X4 are each independently —CR2? or N?, R2 is, for example, a halogen atom, R1 is, for example, —S(?O)2—NH—R8, R8 is, for example, a C1-6 alkyl group, R3 is, for example, a hydrogen atom, R5 is, for example, a halogen atom, R6 is, for example, a hydrogen atom, and R4 is, for example, a cyclopropyl group. The compounds, salts or solvates provided by the present disclosure exhibit high RAF/MEK complex-stabilizing activity and can be used for the treatment or prevention of cell proliferative disorders, particularly cancers.

Abstract: In one embodiment, a charged particle beam writing apparatus includes a deflector deflecting a charged particle beam, a first correcting lens and a second correcting lens correcting a focus position of the charged particle beam, a focus correction amount calculator calculating a first correction amount for the focus position according to a change in a height position of a sample surface, and calculating a second correction amount for the focus position according to a change in shot size of the charged particle beam, a first DAC (digital to analog converter) amplifier applying a voltage for a ground potential based on the first correction amount to the first correcting lens, and a second DAC amplifier applying a voltage for a ground potential based on the second correction amount to the second correcting lens, an output of the second DAC amplifier being smaller than an output of the first DAC amplifier.

Abstract: In one embodiment, a charged particle beam writing apparatus includes a deflector deflecting a charged particle beam, a first correcting lens and a second correcting lens correcting a focus position of the charged particle beam, a focus correction amount calculator calculating a first correction amount for the focus position according to a change in a height position of a sample surface, and calculating a second correction amount for the focus position according to a change in shot size of the charged particle beam, a first DAC (digital to analog converter) amplifier applying a voltage for a ground potential based on the first correction amount to the first correcting lens, and a second DAC amplifier applying a voltage for a ground potential based on the second correction amount to the second correcting lens, an output of the second DAC amplifier being smaller than an output of the first DAC amplifier.

Abstract: A nanometer-size-particle production apparatus and method are provided which can prevent the occurrence of waste fluids, and which makes quick and continuous syntheses feasible while suppressing damages to the electrode. The nanometer-size-particle production apparatus is for synthesizing nanometer size particles in a liquid by means of plasma in the liquid.

Abstract: A wire straightening apparatus that straightens kinks of a wire that is fed along a wire feeding path includes one or a plurality of straightening mechanisms. Each straightening mechanism includes a plurality of first straightening rollers and one or a plurality of second straightening rollers. Each roller has a groove along its outer periphery, the groove gradually deepening toward a bottom portion. The bottom portion of the groove of each first straightening roller is spaced from the wire feeding path in a first direction, and the bottom portion of the groove of each second straightening roller is spaced from the wire feeding path in a second direction opposite to the first direction. With this structure, the wire can be made to follow a path that meanders as viewed from a direction perpendicular to axes of the straightening rollers.

Abstract: A nanometer-size-particle production apparatus is provided which can prevent the occurrence of waste fluids, and which makes quick and continuous syntheses feasible while suppressing damages to the electrode.

Abstract: A nanometer-size-particle production apparatus is provided which can prevent the occurrence of waste fluids, and which makes quick and continuous syntheses feasible while suppressing damages to the electrode.

Abstract: A wire straightening apparatus that straightens kinks of a wire that is fed along a wire feeding path includes one or a plurality of straightening mechanisms. Each straightening mechanism includes a plurality of first straightening rollers and one or a plurality of second straightening rollers. Each roller has a groove along its outer periphery, the groove gradually deepening toward a bottom portion. The bottom portion of the groove of each first straightening roller is spaced from the wire feeding path in a first direction, and the bottom portion of the groove of each second straightening roller is spaced from the wire feeding path in a second direction opposite to the first direction. With this structure, the wire can be made to follow a path that meanders as viewed from a direction perpendicular to axes of the straightening rollers.

Abstract: A nanometer-size-particle production apparatus is provided which can prevent the occurrence of waste fluids, and which makes quick and continuous syntheses feasible while suppressing damages to the electrode.

Abstract: Provided is a method of continuously producing a phosphorus-containing copper alloy wire by adding phosphorus or an element which is less soluble than phosphorus to molten copper. The method includes: adding an element less soluble into a heating furnace for maintaining molten copper sent from a melting furnace at a predetermined high temperature; transferring the molten copper sent from the heating furnace to a tundish; adding phosphorus to the molten copper after decreasing the temperature of the molten copper in the tundish; supplying the molten copper from the tundish to a belt wheel-type continuous casting apparatus; and rolling a cast copper material output from the belt wheel-type continuous casting apparatus, thereby continuously producing a phosphorus-containing copper alloy wire.

Abstract: Provided is a method of continuously producing a phosphorus-containing copper alloy wire by adding phosphorus or an element which is less soluble than phosphorus to molten copper. The method includes: adding an element less soluble into a heating furnace for maintaining molten copper sent from a melting furnace at a predetermined high temperature; transferring the molten copper sent from the heating furnace to a tundish; adding phosphorus to the molten copper after decreasing the temperature of the molten copper in the tundish; supplying the molten copper from the tundish to a belt wheel-type continuous casting apparatus; and rolling a cast copper material output from the belt wheel-type continuous casting apparatus, thereby continuously producing a phosphorus-containing copper alloy wire.

Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.

Abstract: A fine feldspathic earthenware including a body and a glaze layer covering surfaces of the body. The body has water absorption percentage of not lower than 3% and lower than 15% and includes an annular bottom formed on a bottom portion of the body. The glaze layer is absent on a surface of the annular bottom, and the surface of the annular bottom is covered with an annular vitrified layer which has substantially no water absorbing property. The vitrified layer is formed by coating the surface of the annular bottom with a composition having lower refractoriness than the body, and biscuit-firing the composition together with the body.

Abstract: A fine feldspathic earthenware including a body and a glaze layer covering surfaces of the body. The body has water absorption percentage of not lower than 3% and lower than 15% and includes an annular bottom formed on a bottom portion of the body. The glaze layer is absent on a surface of the annular bottom, and the surface of the annular bottom is covered with an annular vitrified layer which has substantially no water absorbing property. The vitrified layer is formed by coating the surface of the annular bottom with a composition having lower refractoriness than the body, and biscuit-firing the composition together with the body.

Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.

Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.

Abstract: A fine feldspathic earthenware including a body and a glaze layer covering surfaces of the body. The body has water absorption percentage of not lower than 3% and lower than 15% and includes an annular bottom formed on a bottom portion of the body. The glaze layer is absent on a surface of the annular bottom, and the surface of the annular bottom is covered with an annular vitrified layer which has substantially no water absorbing property. The vitrified layer is formed by coating the surface of the annular bottom with a composition having lower refractoriness than the body, and biscuit-firing the composition together with the body.

Abstract: An adhesion-resistant oxygen-free roughly drawn copper wire having an oxygen concentration of 1 to 10 ppm and a hydrogen concentration of 1 ppm or less, has a surface oxide film having a total thickness of 50 to 500 angstroms, in which 0.2 to 90% of the total thickness of the oxide film is Cu2O. The adhesion-resistant oxygen-free roughly drawn copper wire is prepared using a continuous casting process, in which the molten copper is agitated and dehydrogenated in a casting trough containing weirs, and the thickness of the oxide layer is controlled by alcohol cleaning the cast copper bar material prior to rolling.

Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a holding furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the holding furnace in a non-oxidizing atmosphere and for transferring the molten copper to a tundish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the tundish, and a cutter for cutting the cast copper into a predetermined length. The apparatus permits a dehydrogenating treatment to be performed without requiring a long moving distance of molten copper, and in which the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire having superior surface quality can be obtained.

Abstract: A work management method and system which manage a project executed by individuals or groups belonging to an organization. In response to a phase transition request from a task management unit, a workflow management unit performs transition and activation of a business phase included in a process definition, sets a work in work management table, and issues a task addition request. In response to an event addition request or a deletion request, an event management unit adds or deletes events to or from an event queue, monitors an occurrence of the event and, when the event occurs, sends a task status transition request to the task management unit. In response to the task addition request, the task management unit sets a task name and a task status name in the work management table, generates the event associated with the task name, issues the event addition request.