Abstract: The invention relates to an optical connector which is used in the field of the optical communication. As a counter optical connector 100 for the optical connector, a plug of the square or round type is used. In the optical connector, a cover 30 is attached in an openable and closable manner to the body 10 having a fitting hole portion 17 into which the counter optical connector 100 is to be inserted. The fitting hole portion 17 is formed by an internal space which is surrounded by a cylindrical wall 15 disposed in the body 10. The cover 30 has a covering wall portion 31 which is fittable to and detachable from an outside of the body 10. The optical connector performs functions that, even when the counter optical connector 100 is wrenched during an inserting or extracting operation, the wrenching force is not transmitted to the cover, and that the external appearance can be changed only by changing the design of the cover.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: To enable soldering with high efficiency, high temperature and short time or reflow soldering without using baking or moisture-proof packaging.

Abstract: There is provided an optical connector adapted to be used as an optical input terminal or optical output terminal. A plug guide hole passing through a generally square-shaped insulation body is formed. An element folder for accommodating an optical element is made of a sheet metal. The element holder comprises a top plate, opposed side plates and a rear plate covering the top surface, the opposed side surfaces and the rear surface of the optical element mounted in the element holder, and a size between the inner surfaces of the opposed side plates is set to a value substantially equal to the maximum value of the corresponding external size of the optical element.

Abstract: To economically and easily fabricate a single crystal silicon carbide thin film. The apparatus for fabricating a single crystal silicon carbide thin film comprises a film-formation chamber 200 adapted to receive a SOI substrate 100 for film-formation, a gas supply means 300 for supplying various gases G1 to G4 necessary to fabricate a single crystal silicon carbide thin film to the film-formation chamber 200, a gas treatment means 500 for treating argon gas as an inert gas G1, propane gas as a hydrocarbon-based gas G2, hydrogen gas as a carrier gas, and oxygen gas G4 supplied to the film-formation chamber 200, and a temperature control means 400 for controlling the temperature of the film-formation chamber 200.

Abstract: A semiconductor electret capacitor microphone including a vibration membrane 200, a semiconductor chip 100 on which are formed a necessary electronic circuit 130, a fixed electrode 110, and a spacer 120 for preserving a predetermined space between the fixed electrode 110 and the vibration membrane 200, and a case for enclosing the semiconductor chip 100 and the vibration membrane 200, in such a configuration that the fixed electrode 110 is connected to the ground and the vibration membrane 200 is connected to an input electrode 143 of the semiconductor chip 100.

Abstract: A stationary electrode layer 12 is formed on a semiconductor substrate 11, and a vibrating diaphragm 16 is disposed on spacers 14. The vibrating diaphragm 16 is placed so as to protrude from an end of the semiconductor substrate 11, and terminal pads 20 to 23 are placed with being exposed from the vibrating diaphragm 16.

Abstract: A metal cover 21 is mounted on the rear end side of a body 11 to cover its top, both side surfaces and read end face, and the metal cover 21 has a pair of soldering portions 25, which are soldered to a circuit board so that the body 11 is pressed and fixed to the circuit board.

Abstract: There is provided a subminiature optical connector comprising a subminiature single head optical plug having its sleeve of 2.5 mm in outside diameter corresponding to a subminiature single head plug for only electric signal use and having its sleeve of 2.5 mm in outside diameter which is in practical use, the optical plug being able to use together with a receptacle in practical use.

Abstract: Explosion of rechargeable battery can be prevented in a relatively simple structure, at low cost, and without allowing spouting of electrolyte.

Abstract: The present invention relates to etching for removing a carbon thin film formed on a surface of a sample, to prevent a damage on a sample and eliminate the necessity of providing a special device (such as vacuum pump) as is required in plasma etching. A sealed reaction chamber 100A in which a sample 500 formed with a carbon thin film 510 on its surface is to be set, a gas feed means 200A for feeding argon gas which is an inert gas Ar into which a predetermined proportion of oxygen gas O2 has been mixed from one end to the interior of the reaction chamber 100A, an exhaust means 300A for discharging carbon dioxide gas CO2 from the downstream side of the inert gas Ar fed from the gas feed means 200A, and a heating means 400A for heating the sample 500 to 550° C. or higher are provided.

Abstract: An optical connector with a shutter is provided which has functions of, when a plug (P) is not inserted, preventing dust from entering through an insertion and extraction port (12), and preventing light from leaking through the insertion and extraction port (12). In the invention, a shutter (5) is placed in an insertion space (13) of the body (1) in which an optical device (2) is disposed, and the shutter (5) is elastically urged in a closing direction. The shutter (5) is attached to a support shaft (4) which is placed in the vacant space (15) on a lateral side of the insertion and extraction port (12). When the plug (P) is not inserted, the shutter (5) closes the insertion and extraction port (12) to prevent ingress of dust and light leakage from occurring. The axial direction of the support shaft (4) coincides with the thickness direction of the body, whereby the height of the optical connector with a shutter can be reduced.

Abstract: A stationary electrode layer 12 is formed on a semiconductor substrate 11, and a vibrating diaphragm 16 is disposed on spacers 14. The vibrating diaphragm 16 is placed so as to protrude from an end of the semiconductor substrate 11, and terminal pads 20 to 23 are placed with being exposed from the vibrating diaphragm 16.

Abstract: A fixed electrode layer 12 is formed on a semiconductor substrate 11. A vibrating film is formed on the fixed electrode layer through a spacer 14. Since the vibrating film is a light-permeable film, in order to prevent the malfunction of an electronic circuit formed in the semiconductor substrate by incident light, the region where the electronic circuit is to be formed is covered with a shield metal 33.

Abstract: To attain an impact sensor designed compact and to be readily assembled. The impact sensor comprises main part 100 of sensor involving cavity 110, of which bottom surface serves as the fracture part 120; impact force transfer member 130 provided on said fracture part 120; weight 200 being confined in said cavity 110; and seal member 300 to close the cavity 110 with the weight 200 left confined therein, whereby the fracture part 120 is apt to be broken up by the weight 200, when an impact exceeding the predetermined value has been encountered.

Abstract: A metal cover 21 is mounted on the rear end side of a body 11 to cover its top, both side surfaces and read end face, and the metal cover 21 has a pair of soldering portions 25, which are soldered to a circuit board so that the body 11 is pressed and fixed to the circuit board.

Abstract: A stationary electrode layer 12 is formed on a semiconductor substrate 11, and a vibrating diaphragm 16 is disposed on spacers 14. The vibrating diaphragm 16 is placed so as to protrude from an end of the semiconductor substrate 11, and terminal pads 20 to 23 are placed with being exposed from the vibrating diaphragm 16.

Abstract: A liquid crystal display having an injection hole post structures compatible with liquid crystal are formed in an area near an injection hole to prevent pollutants seeped from an end-sealing material from penetrating into a display area, thereby suppressing the occurrence of picture quality trouble which easily occurs in the display area. The liquid crystal display includes a first substrate 11 and a second substrate 12 which are disposed with a predetermined gap therebetween, in which liquid crystal is sealed in the gap.