Abstract: An apparatus and method for peeling, and an apparatus and method for laminating which are preferable to reduce the overall size of the apparatus are provided. When a transport means 8 transports a wafer W with glass plate G, and a holding roller 2, in synchronization with the transportation, rotates around its central axis, the holding roller 2 contacts the wafer W to peel it and hold it thereon, and after the peeling is completed, the transport means 8 transports a ring frame F in a direction opposite to the direction for peeling. In synchronization with the transportation, the holding roller 2 rotates around its central axis in a direction opposite to the direction for peeling, so that the holding roller 2 sticks the wafer W held on the holding roller to the ring frame F by means of a dicing tape T2.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.

Abstract: The label making apparatus of the invention comprises a guide plate 17 for guiding a raw sheet M in a predetermined feeding direction, an inspecting device 15 for inspecting a label L on a release liner S constituting the raw sheet M, a transfer device 25 for partially bypassing the feeding direction of the release liner to peel off a label from the release liner and temporarily sticking the non-defective label at a position on the release liner advanced toward the downstream side in the feeding direction by a predetermined distance, and a collecting device 22 for collecting a defective when a defective label is detected. The transfer device 25 adjusts the bypass length of the release liner so that a certain interval is kept between the non-defective label after a defective label is detected with respect to the preceding non-defective label.

Abstract: A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held by a peeling head 13. The peeling head 13 and the table 20 perform a relative movement along guide rails 25, the table 20 rotates a predetermined angle in clockwise and counterclockwise directions alternately via a swing mechanism 21 thereby peeling off the sheet S from the wafer W accompanying a zigzag movement.