Abstract: A sheet pasting device EA includes: a sheet feed unit 10 that feeds an adhesive sheet AS; and a press unit 20 that has a press roller 22 for pressing the adhesive sheet AS against a work WK and that pastes the adhesive sheet AS on the work WK by pressing the adhesive sheet AS against the work WK moving relative to the press roller 22, the press unit 20 bringing the press roller 22 into contact with an attachment surface WK1 of the work WK and rotating the press roller 22 on the attachment surface WK1, at a stage before pressing the adhesive sheet AS against the work WK using the press roller 22.

Abstract: A sheet pasting device EA includes: a sheet feed unit 10 that feeds an adhesive sheet AS; and a press unit 20 that has a press roller 25 for pressing the adhesive sheet AS against a work WK and that pastes the adhesive sheet AS on the work WK by pressing the adhesive sheet AS against the work WK moving relative to the press roller 25, the press unit 20 bringing the press roller 25 into contact with an attachment surface WK1 of the work WK to displace the press roller 25 and rotating the press roller 25 on the attachment surface WK1, at a stage before pressing the adhesive sheet AS against the work WK using the press roller 25.

Abstract: A discrete piece forming device that forms discrete pieces by dividing a work. The device includes a modified part forming unit which forms modified parts in the work having a pre-pasted adhesive sheet containing swell grains which swell by application of a predetermined energy, to form, in the work, predefined discrete piece areas each surrounded by the modified parts. The device further includes a dividing unit which divides the work into pieces by forming, in the work, cracks starting from the modified parts by applying external force to the work, to form the discrete pieces. The dividing unit applies the energy to parts of the adhesive sheet to swell the swell grains contained in adhesive sheet parts to which the energy has been applied, thereby displacing the predefined discrete piece areas pasted on the adhesive sheet parts to form the discrete pieces.

Abstract: A mounting method includes: a stacking step PC1 of stacking an adhesive layer AL containing swell grains SG that swell when predetermined energy HT is applied, on a projection-formed surface WF1 of a work WF, the projection-formed surface WF1 having projections BP formed thereon; a mounting step PC4 of bringing the projections BP into contact with a support LF to attach, to the support LF, the work WF on which the adhesive layer AL is stacked; and an energy applying step PC5 of applying the energy HT to the adhesive layer AL to swell the swell grains SG, thereby making contact regions of the adhesive layer AL with the support LF larger than before swelling the swell grains SG.

Abstract: A discrete piece forming device EA that forms discrete pieces CP by dividing a work WF into pieces includes: a sheet pasting unit 10 which pastes, on the work WF, an adhesive sheet AS containing swell grains SG that swell when predetermined energy IR is applied; a modified part forming unit 20 which forms modified parts MT in the work WF to form, in the work WF, predefined discrete piece areas WFP each surrounded by the modified parts MT; and a dividing unit 30 which divides the work WF into pieces by forming, in the work WF, cracks CK starting from the modified parts MT by applying external force to the work WF, to form the discrete pieces CP. The dividing unit 30 applies the energy IR to parts of the adhesive sheet AS to swell the swell grains SG contained in adhesive sheet parts ASP to which the energy IR has been applied, thereby displacing the predefined discrete piece areas WFP pasted on the adhesive sheet parts ASP to form the discrete pieces CP.

Abstract: A discrete piece forming device EA that forms discrete pieces CP by dividing a work WF includes: a modified part forming unit 10 which forms modified parts MT in the work WF having a pre-pasted adhesive sheet AS containing swell grains SG that are swollen by the application of predetermined energy IR, to form, in the work WF, predefined discrete piece areas WFP each surrounded by the modified parts MT; and a dividing unit 20 which divides the work WF into pieces by forming, in the work WF, cracks CK starting from the modified parts MT by applying external force to the work WF, to form the discrete pieces CP. The dividing unit 20 applies the energy IR to parts of the adhesive sheet AS to swell the swell grains SG contained in adhesive sheet parts ASP to which the energy IR has been applied, thereby displacing the predefined discrete piece areas WFP pasted on the adhesive sheet parts ASP to form the discrete pieces CP.

Abstract: A discrete piece manufacturing method capable of simplifying a discrete piece manufacturing process includes: a sheet pasting step PC1 of pasting, on a work WF, an adhesive sheet AS containing swell grains SG that swell when predetermined energy IR is applied; a modified part forming step PC2 of, on a subsequent stage of the sheet pasting step PC1, forming modified parts MT in the work WF to form, in the work WF, predefined discrete piece areas WFP each surrounded by the modified parts MT; and an adhesion reducing step PC3 of reducing adhesion of the adhesive sheet AS to the work WF.

Abstract: A cutting device that, after a sheet is stuck on a wafer on a sticking table, cuts the sheet along the outer edge of the wafer. The cutting device includes a robot body disposed besides the sticking table and a cutter blade supported by a tool holding chuck positioned at the front end of the robot body. The cutter blade is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet in a state that the posture thereof is adjusted along a preset movement track.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.

Abstract: A tape sticking apparatus includes a feed-out device for feeding out a raw sheet in which a strip-shaped tape base material is temporarily stuck on one surface of a strip-shaped release liner. A cutting device is configured to form a closed-loop-shaped cut-line on the tape base material to form a sticking tape. The apparatus further includes a peeling device for peeling the sticking tape from the release liner, and a sticking device for sticking the sticking tape to a workpiece. A collecting device collects the raw sheet after being peeled off the sticking tape by the peeling device.

Abstract: A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

Abstract: A sheet cutting apparatus includes a cutting device and at least one cutter blade to be mounted detachably on the cutting device. The cutter blade has a blade holder and a blade fixed to the blade holder. The apparatus further includes a stocking device for storing the at least one cutter blade. The stocking device includes a case body, a receiving section in the case body, and a heater. The receiving section has a blade holder receiving portion for storing the blade holder and a blade receiving portion for storing the blade. The heater is arranged for heating the blade holder and the blade of the cutter blade in the receiving section. The cutting device is arranged for using the cutter blade heated by the heater.

Abstract: The label making apparatus of the invention comprises a guide plate 17 for guiding a raw sheet M in a predetermined feeding direction, an inspecting device 15 for inspecting a label L on a release liner S constituting the raw sheet M, a transfer device 25 for partially bypassing the feeding direction of the release liner to peel off a label from the release liner and temporarily sticking the non-defective label at a position on the release liner advanced toward the downstream side in the feeding direction by a predetermined distance, and a collecting device 22 for collecting a defective when a defective label is detected. The transfer device 25 adjusts the bypass length of the release liner so that a certain interval is kept between the non-defective label after a defective label is detected with respect to the preceding non-defective label.

Abstract: A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held by a peeling head 13. The peeling head 13 and the table 20 perform a relative movement along guide rails 25, the table 20 rotates a predetermined angle in clockwise and counterclockwise directions alternately via a swing mechanism 21 thereby peeling off the sheet S from the wafer W accompanying a zigzag movement.

Abstract: A cutting device 15 that, after a sheet S is stuck on a wafer W on a sticking table 13, cuts the sheet S along the outer edge of the wafer. The cutting device 15 comprises a robot body 62 disposed beside the sticking table 13 and a cutter blade 63 supported by a tool holding chuck 69 positioned at the front end of the robot body 62. The cutter blade 63 is detachably attached to the tool holding chuck 69 so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.

Abstract: A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and a cut-line detecting device 14 detects whether any cut-line C is already formed on the outer circumference side of the die bonding sheet portion DS, on the pathway of the feeding out. According to the result of detection, the die cutting device 13 lets the raw sheet L pass straight through without forming any cut-line C when the cut-line C is judged to be already formed thereon. On the other hand, the die cutting device 13 forms a cut-line C to form a sticking tape DDT when no cut-line C is detected. The sticking tape DDT is peeled by a peeling device 15 to be stuck to the ring frame RF in the position that the die bonding sheet portion DS is to be corresponding to the semiconductor wafer W.

Abstract: A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

Abstract: [Problem to be Solved] To provide a measuring device preferable to enhance capability of pickup processing when picking up each chip of a plate-shaped member individually separated into a form of chips.

Abstract: A cutting device 15 that, after a sheet S is stuck on a wafer W on a sticking table 13, cuts the sheet S along the outer edge of the wafer. The cutting device 15 comprises a robot body 62 disposed beside the sticking table 13 and a cutter blade 63 supported by a tool holding chuck 69 positioned at the front end of the robot body 62. The cutter blade 63 is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.

Abstract: A stock device 11 for storing cutter blades 21 for a cutting device 10, which includes a case body 40 provided with a receiving section 41 for the cutter blades 21. Within the case body 40, engagement surfaces 43A are provided so as, when the cutter blades 21 are stored in the receiving section 41, to ensure the orientation of the cutter blades 21 to a constant direction when a cutter blade 21 is mounted onto the cutting device 10. Also, the case body 40 stores organic solvent L therein for washing the cutter blades 21, and is arranged so as to be able to dissolve and remove adhesive and the like adhered to a blade 21B with the organic solvent L.