Abstract: Provided are a semiconductor device capable of constituting a through electrode having a desired shape, an electronic device, and a method for manufacturing a semiconductor device. The semiconductor device includes: a first substrate including silicon; a first film formed on at least some surfaces of a hole-shaped portion formed in the first substrate; and a photosensitive second film covering at least a part of a side surface of the hole-shaped portion with the first film interposed therebetween.

Abstract: In a semiconductor device provided with a through electrode, thermal stress is reduced. The semiconductor device includes a semiconductor substrate, a wiring layer, a first through hole, and a first inner through electrode. In the semiconductor device, the wiring layer is formed on a front surface of the semiconductor substrate. Furthermore, in the semiconductor device, the first through hole penetrates the semiconductor substrate from a back surface to the front surface of the semiconductor substrate, and has a side wall covered with an insulating film. Furthermore, in the semiconductor device, the first inner through electrode is formed along a part of the side wall of the first through hole.

Abstract: A position aligning apparatus performs position alignment of a pattern in a current process of a pattern exposure process by using a pattern formed before the current process. The position aligning apparatus includes: a correction calculating section configured to calculate a correction value set of a current lot about each of misalignments in scale and rotation of a pattern in a chip in the current process based on a correction value set in an immediately-preceding lot in the current process, a completeness value set in the immediately-preceding lot in the current process, a summation of completeness value sets in the immediately-preceding lot to a process immediately-preceding to the current process, and a summation of completeness value sets in the current lot to the immediately-preceding process; and a correction control unit configured to control correction of the scale and the rotation of the pattern in the chip by using the correction value sets.

Abstract: A position aligning apparatus performs position alignment of a pattern in a current process of a pattern exposure process by using a pattern formed before the current process. The position aligning apparatus includes: a correction calculating section configured to calculate a correction value set of a current lot about each of misalignments in scale and rotation of a pattern in a chip in the current process based on a correction value set in an immediately-preceding lot in the current process, a completeness value set in the immediately-preceding lot in the current process, a summation of completeness value sets in the immediately-preceding lot to a process immediately-preceding to the current process, and a summation of completeness value sets in the current lot to the immediately-preceding process; and a correction control unit configured to control correction of the scale and the rotation of the pattern in the chip by using the correction value sets.

Abstract: An object of the present invention is to provide a wire rod feeding device in which a soft wire rod can be inserted easily. To achieve this object, in the wire rod feeding device in accordance with the present invention, the wire rod is gripped and released, and is run out by a chuck body (7) which is movable back and forth, and opening means for keeping an opened state of the chuck body is provided.