Wire solder applicator
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Description
FIG. 1 is a perspective view of a wire solder applicator showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
Claims
The ornamental design for a wire solder applicator, as shown and described.
Referenced Cited
Patent History
Patent number: D517384
Type: Grant
Filed: Jul 21, 2004
Date of Patent: Mar 21, 2006
Assignees: Pentel Kabushiki Kaisha (Tokyo), Senju Metal Industry Co., Ltd. (Tokyo)
Inventors: Kou Ishii (Tokyo), Yoshiaki Yanagawa (Tokyo)
Primary Examiner: Philip S. Hyder
Attorney: Adams & Wilks
Application Number: 29/209,789
Type: Grant
Filed: Jul 21, 2004
Date of Patent: Mar 21, 2006
Assignees: Pentel Kabushiki Kaisha (Tokyo), Senju Metal Industry Co., Ltd. (Tokyo)
Inventors: Kou Ishii (Tokyo), Yoshiaki Yanagawa (Tokyo)
Primary Examiner: Philip S. Hyder
Attorney: Adams & Wilks
Application Number: 29/209,789
Classifications
Current U.S. Class:
D8/30