Abstract: An amino compound having a secondary amino group directly bonded to a phenyl group is modified by silylating the secondary amino group. When the silylated amino compound is compounded in a silicone composition comprising an organopolysiloxane containing at least two lower alkenyl groups, an organohydrogenpolysiloxane, and a platinum base curing catalyst, the composition is improved in flame retardance to the level of UL-94 V-0 without sacrificing the activity of the curing catalyst.

Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.

Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.

Abstract: There is provided a cleaning agent comprising a lactone represented by the following formula (1): wherein R1 is an alkylene group having 3 to 6 carbon atoms. The cleaning agent is useful for cleaning an organic electroluminescence material, photosensitive resin, liquid crystal or wax.

Abstract: In a home theater system having a source apparatus, a repeater apparatus and a sink apparatus connected in the recited order, when connected to a sink apparatus, whatever type it is, the repeater apparatus provides the source apparatus with video and audio signal format information that allows correct transmission. A control part 210 of the repeater apparatus 200 reads EDID information from memory 321 of the connected sink apparatus 300, and analyzes video and audio signal formats that can be processed by the sink apparatus 300, and when any format that cannot be handled by the repeater apparatus 200 itself is included, the repeater apparatus deletes information concerning that format to reconstruct the EDID information, and stores the reconstructed information into memory 221 in order to cause the source apparatus 100 to reference the stored information as EDID information of the repeater apparatus itself.

Abstract: The present invention relates to a knockout non-human animal whose genome comprises a disruption in at least one allele of the PHF3 gene, useful in developing drugs for diseases with the onset of atopic dermatitis or the like; a totipotent cell such as an ES cell which is essential to production of the above non-human animal; use thereof; and so on.

Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition reaction curing type silicone rubber composition which cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.

Abstract: An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as a semiconductor encapsulating material.

Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition reaction curing type silicone rubber composition which cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.

Abstract: An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.

Abstract: It is intended to provide an uracil derivative represented by the following general formula (I): (I) wherein X represents a group selected from among NHCO, NHCH2, CO, CONH and CH2NH; R1 represents hydrogen or optionally substituted C1-6 alkyl; R2 represents a group of the following general formula (II) or (III): (II) (III) (wherein m is 0 or 1; n is an integer of from 1 to 3; Y represents OH or NH2; and a dotted line shows a binding position), provided that when R2 is a group of the general formula (III), X represents NHCO or NHCH2; R3 and R4 independently represent each hydrogen or C1-6 alkyl; and Ar represents phenyl substituted by C1-6 alkyl at the o- and m-positions, optionally substituted heteroaryl or a bicyclic aromatic group; its pharmaceutically acceptable salt, and a remedy containing the above uracil derivative or its pharmaceutically acceptable salt as the active ingredient for, in particular, allergic diseases relating to a type IV allergic reaction, i.e.

Abstract: An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.

Abstract: An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.

Abstract: A heat-conductive silicone rubber composition is provided. This composition comprises (A) an organopolysiloxane with an average of at least 0.1 alkenyl groups bonded to silicon atoms within each molecule, (B) an organopolysiloxane with an average of at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a heat-conductive filler, (D) a platinum catalyst, and (E) a methylpolysiloxane with a hydrolyzable group and a vinyl group, as represented by a general formula shown below.

Abstract: An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as a semiconductor encapsulating material.

Abstract: A condensation curable silicone rubber composition is provided which is able to suppress increases in viscosity over time, has an adequate pot life and excellent mold releasability, and displays favorable urethane molding durability. The composition includes: (A) an organopolysiloxane represented by a general formula (I), wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group, and n represents a number which results in a viscosity at 25° C. of 100 to 500,000 mm2/s, with a viscosity at 25° C. of 100 to 500,000 mm2/s; (B) a surface-treated reinforcing fine silica powder with a specific surface area as measured by a BET method of at least 50 m2/g, and a tap density of 0.2 to 0.4 g/ml, which has undergone treatment with an organosilicon compound to produce a quantity of surface carbon of at least 2.5% by weight; and (C) a tin compound-based curing catalyst.

Abstract: A room temperature curing organopolysiloxane composition is provided which displays no toxicity, is resistant to cracking and discoloration, cures rapidly, and yields a cured product of good hardness. This composition includes (A) an organopolysiloxane with at least two hydroxyl groups bonded to silicon atoms within a single molecule, (B) an organosilicon compound represented by a formula (I) shown below, and/or a partial hydrolysis condensate thereof, RaSiX4-a  (I) (wherein, R represents a substituted or unsubstituted monovalent hydrocarbon of 1 to 10 carbon atoms, X represents a hydrolysable group, and a represents an integer of 0 to 3), and (C) a bismuth compound-based curing catalyst.

Abstract: An organopolysiloxane composition is provided including: (A) an organopolysiloxane with hydroxyl groups at both terminals of the molecular chain; (B) an organosilicon compound represented by the general formula shown below: wherein, R2 represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R3 represents a hydrogen atom or a methyl group, R4 represents a monovalent hydrocarbon group, X represents a hydrolysable group, Z1 represents —R5—, —R5O— or —R5(CH3)2SiO— (wherein R5 represents a bivalent hydrocarbon group), Z2 represents an oxygen atom or a bivalent hydrocarbon group, m represents 0, 1 or 2, and n represents 0, 1 or 2; (C) a condensation curing catalyst; and (D) a photopolymerization initiator.

Abstract: A heat-conductive silicone rubber composition is provided. This composition comprises (A) an organopolysiloxane with an average of at least 0.1 alkenyl groups bonded to silicon atoms within each molecule, (B) an organopolysiloxane with an average of at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a heat-conductive filler, (D) a platinum catalyst, and (E) a methylpolysiloxane with a hydrolyzable group and a vinyl group, as represented by a general formula shown below. This composition displays superior molding workability and adhesion, even if a large quantity of a heat-conductive filler is added to the composition.

Abstract: An amino compound having a secondary amino group directly bonded to a phenyl group is modified by silylating the secondary amino group. When the silylated amino compound is compounded in a silicone composition comprising an organopolysiloxane containing at least two lower alkenyl groups, an organohydrogenpolysiloxane, and a platinum base curing catalyst, the composition is improved in flame retardance to the level of UL-94 V-0 without sacrificing the activity of the curing catalyst.