Abstract: A structure to be plated includes a body to be plated 11 on which plating is formed, and plated film thickness determining member 16 opposed to and electrically isolated from the body to be plated 11 through a slit portion 12. The plated film thickness determining member 16 has an islands-shape and is conductive. It is possible to instantly determine whether or not the plating formed on the body to be plated 11 has been formed to a thickness larger than the width W of the slit portion 12 on the spot by determining whether or not plating has grown from the surface of the body to be plated 11 to the plated film thickness determining member 16 through the slit portion 21.

Abstract: A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted; a bonding agent for bonding the semiconductor chip to the die pad; a plurality of inner leads provided at the outer periphery of the die pad; outer leads extending from the inner leads; bonding wires connecting the inner leads to the semiconductor chip mounted on the die pad; and a resin for sealing the inner leads, the die pad, the semiconductor chip, the bonding agent and the bonding wires. The bonding agent is further disposed in all or part of a margin of the die pad at a peripheral portion where the semiconductor chip is mounted, and a plurality of dimples are formed in the surface of the bonding agent in the die pad margin.

Abstract: Provided is a method of manufacturing a semiconductor device including: arranging multiple dies planarly between a first lead frame plate and a second lead frame plate, which face each other, to connect the multiple semiconductor chips to each of the first lead frame plate and the second lead frame plate; filling a resin between the first lead frame plate and the second lead frame plate to seal the multiple dies; performing a first dicing on a laminated body including the first lead frame plate, the resin, and the second lead frame plate, between the adjacent dies, to separate at least the first lead frame plate by cutting; applying plating to the laminated body with at least the first lead frame plate being separated by cutting; and performing a second dicing on a remainder of the laminated body between the adjacent dies, to separate the laminated body into individual semiconductor devices.

Abstract: A lead frame according to one aspect of the present invention is used for a resin-sealed-type semiconductor device and includes a first lead frame having a frame body part and a lead part, and a second lead frame having a frame body part and a lead part. The lead part of the first lead frame and the lead part of the second lead frame do not contact with each other and an inner lead part formed in the lead part of the first lead frame and an inner lead part formed in the lead part of the second lead frame are provided in substantially the same plane when the frame body part of the first lead frame and the frame body part of the second lead frame are laminated together.

Abstract: A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted; a bonding agent for bonding the semiconductor chip to the die pad; a plurality of inner leads provided at the outer periphery of the die pad; outer leads extending from the inner leads; bonding wires connecting the inner leads to the semiconductor chip mounted on the die pad; and a resin for sealing the inner leads, the die pad, the semiconductor chip, the bonding agent and the bonding wires. The bonding agent is further disposed in all or part of a margin of the die pad at a peripheral portion where the semiconductor chip is mounted, and a plurality of dimples are formed in the surface of the bonding agent in the die pad margin.

Abstract: A partly finished product of a semiconductor device includes a resin body encapsulating a semiconductor chip, first and second leads extended outwardly from the resin body, a dam bar connected between said first and second leads, and an excess resin portion protruding from the resin body between the first and second leads and the dam bar. The excess resin portion is cut off at two limited portions, and thereby two groove portions are formed in the excess resin portion. An apparatus for cutting the dam bar includes a punch having a cutting edge for cutting connection portions between the first and second leads and the dam bar and for cutting off the two limited portions of the excess resin portion. Since the cut region of the excess resin portion becomes smaller, a stress imparted to the resin body and/or the semiconductor chip through the excess resin portion can be smaller.

Abstract: A partial discharge monitoring apparatus for a rotating electric machine includes a partial discharge detecting circuit which measures each signal output from a partial discharge sensor located in the rotating electric machine simultaneously in a first frequency band and a second frequency band. Detection time for detecting each signal includes a peak hold time and a dead time, which comes after the peak hold time. A next-occurring signal is detected after the dead time has elapsed.

Abstract: A partial discharge monitoring apparatus for a rotating electric machine includes a partial discharge detecting circuit which measures each signal output from a partial discharge sensor located in the rotating electric machine simultaneously in a first frequency band and a second frequency band. Detection time for detecting each signal includes a peak hold time and a dead time, which comes after the peak hold time. A next-occurring signal is detected after the dead time has elapsed.

Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.

Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.

Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.

Abstract: An abnormality detecting apparatus in which noise is rejected in determining the condition of each of rotating electrical machines, so that a partial discharge of a rotating electric machine is detected with high accuracy. The abnormality detecting apparatus includes partial discharge detectors for detecting a partial discharge of a rotating electrical machine, a switching unit for selecting a partial discharge detector, a partial discharge measurement section for measuring the signal from the selected switch, a computer for selecting the respective partial discharge detectors or sequentially selecting respective partial discharge detectors for measurement, noise rejection, insulation diagnosis judgement, and data management for the respective discharge detectors, and for displaying measurement results, and a control section for controlling the switching unit and the partial discharge measurement section through the computer.

Abstract: A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first end portions connected to the first band shaped member; coupling strip each provided for one of the island portions whose first end portion connects to a second end portion of each of the island portions and whose second end portion connects to the second band shaped member. The lead frame further comprises at least one electrode portion for each of the island portions and electrically coupled with a corresponding electrode of the semiconductor pellet. The at least one electrode portion is disposed between each of the island portions and the second band shaped member, a first end portion thereof is connected to the second band shaped member, and a second end portion thereof is opposed to the second end portion of each of the island portions.

Abstract: A defect detecting apparatus for monitoring an electrical equipment for defects, the electrical equipment having a resonance frequency.

Abstract: An abnormality detecting method and apparatus for electrical equipment measures the frequency spectrum of a signal detected by a partial discharge sensor and detects a partial discharge signal having a frequency component in the neighborhood of a resonance frequency to detect the abnormality of the electrical equipment. The resonance frequency is determined on the basis of the electrical equipment and the measuring circuit. Where the electrical equipment is a rotating electric machine, the resonance frequency is determined on the basis of the length of the stator core, and a narrow bandpass filter circuit passes a frequency component around a resonance frequency to detect a partial discharge signal from the passed signal.

Abstract: The abnormality detecting method and apparatus for electric equipment measure the frequency spectrum of a signal detected by a partial discharge sensor 9, and detect a partial discharge signal having a frequency component in the neighborhood of a resonance frequency determined on the basis of the electric equipment and its measuring circuit, then detect the abnormality of the electric equipment. In a rotating electric machine particularly, the narrow band filter circuit 23 passes a frequency component around a resonance frequency determined on the basis of the length of the stator core to detect a partial discharge signal from the passed signal.