Abstract: A semiconductor device comprises a wiring substrate including a wiring pattern; a semiconductor chip installed on the wiring substrate, including a plurality of pads formed on a surface of the semiconductor chip, which opposes the wiring substrate; a first resin layer covering over a part of the wiring pattern within a region of overlapping the semiconductor chip; and a second resin layer installed between the semiconductor chip and the first resin layer. The pads are oppose to and coupled with a part of the wiring pattern exposed over the first resin layer; and the linear expansion coefficient of the wiring substrate is larger than that of the semiconductor chip, the elastic modulus of the wiring substrate is lower than that of the semiconductor chip and the linear expansion coefficient of the first resin layer is larger than that of the second resin layer. The elastic modulus of the first resin layer is lower than that of the second resin layer.

Abstract: A semiconductor chip includes a semiconductor substrate including first and second surfaces and a plurality of side surfaces, the first and second surfaces being parallel to each other and facing in opposite directions, the side surfaces connecting peripheries of the first and second surfaces. At least one of the side surfaces is an inclined surface with respect to the first and second surfaces, and a groove is formed in the inclined surface. The groove extends in a direction which intersects a plane parallel to the first and second surfaces and extends in a direction which intersects a plane which intersects the first and second surfaces at right angles.

Abstract: A method of manufacturing a semiconductor device is provided including depressing a bonding tool having a concave portion toward a wiring board with a semiconductor chip disposed within the concave portion, pressing the semiconductor chip with a bottom face of the concave portion, fluidizing a resin provided between the semiconductor chip and the wiring board, and filling a lateral space proximate the semiconductor chip within the concave portion with the resin, and curing the resin.

Abstract: A method of manufacturing a semiconductor device uses a substrate on which an interconnect pattern is formed and on which a protective film is formed to include an opening and to cover the interconnect pattern in a region other than the opening. The method includes: attaching an adhesive sheet to an area including the opening and a boundary between the opening and the protective film so that a void is formed due to a level difference between the interconnect pattern and the substrate; softening the adhesive sheet by heating; and causing a semiconductor chip to adhere to the substrate through the adhesive sheet. The protective film includes a groove which connects with the opening, the adhesive sheet is attached except a part of the groove, and the void is discharged through the groove by heating and softening the adhesive sheet.

Abstract: A method of fabricating a semiconductor device, including: preparing a wiring board on which is mounted a first semiconductor chip having a plurality of first pads; electrically connecting each of the first pads to an interconnecting pattern of the first semiconductor chip by a wire; providing resin paste on the first semiconductor chip; mounting a second semiconductor chip having a plurality of second pads on the first semiconductor chip with the resin paste interposed therebetween; and forming a spacer by hardening the resin paste to fix the first and second semiconductor chips together, wherein the spacer is formed to extend under the second pads and further outward; and wherein the highest portion of the wire is disposed on the outer side of the first semiconductor chip.

Abstract: A semiconductor device includes a substrate provided with terminals for connecting conductive wires, a first semiconductor chip mounted face-up on the substrate and electrically connected to the terminals provided on the substrate by the conductive wires and a second semiconductor chip having a projecting part formed on a rear surface thereof and attached onto the first semiconductor chip via the projecting part.

Abstract: A semiconductor device includes a substrate having a terminal to connect a conductive wire, a first semiconductor chip mounted face-up above the substrate and electrically connected to the terminal formed on the substrate by the conductive wire, a second semiconductor chip mounted above the first semiconductor chip via an insulating spacer and a solid material contained in the insulating spacer to keep a distance between the first semiconductor chip and the second semiconductor chip.