Abstract: The present invention provides a double-sided electrode package of a structure excellent in the reliability of connection and moisture resistance to another package, which is capable of being manufactured simply and at low cost. The present invention also provides a double-sided electrode package of a structure capable of forming inner wirings (electrode pads) in arbitrary layouts according to the number of pins of a semiconductor chip and the size thereof, which package is capable of being manufactured simply and at low cost. A copper foil is attached onto a core material formed with electrode pads, wirings, through electrodes, lands and a solder resist. The copper foil is wet-etched in several stages to form surface side terminals which stand on the wirings approximately vertically and each of which includes a plurality of protrusions (convex portions continuous in the circumferential direction) formed at their side faces over the full circumference along the circumferential direction.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.

Abstract: In a double-sided electrode package, a sealing resin layer is formed so as to fill peripheries of surface-side terminals formed on a package substrate. Since the side surfaces of the surface-side terminals have plural protruded rims, adhesion with the sealing resin layer is improved by an anchor effect. At a sealing step, since supplied liquid resin is naturally flowed to form the sealing resin layer, a “mold step” and a “grinding step” may be omitted, and thus the sealing step may be simplified more greatly than a case where the resin sealing is carried out by a transfer molding method.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surface of a resin which seals the LSI chip connected to the multilayer wiring. The wiring traces are connected to terminal wiring traces connected to the multilayer wiring on the front face of the package substrate and to front-face bump electrodes for external connection on the upper surface of the resin. On the back face side of the package substrate, back-face bump electrodes for external connection are formed and connected to the multilayer wiring.

Abstract: According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surface of a resin which seals the LSI chip connected to the multilayer wiring. The wiring traces are connected to terminal wiring traces connected to the multilayer wiring on the front face of the package substrate and to front-face bump electrodes for external connection on the upper surface of the resin. On the back face side of the package substrate, back-face bump electrodes for external connection are formed and connected to the multilayer wiring.

Abstract: An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.

Abstract: An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.

Abstract: In a double-sided electrode package, a sealing resin layer is formed so as to fill peripheries of surface-side terminals formed on a package substrate. Since the side surfaces of the surface-side terminals have plural protruded rims, adhesion with the sealing resin layer is improved by an anchor effect. At a sealing step, since supplied liquid resin is naturally flowed to form the sealing resin layer, a “mold step” and a “grinding step” may be omitted, and thus the sealing step may be simplified more greatly than a case where the resin sealing is carried out by a transfer molding method.

Abstract: A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, and an adhesive portion comprised of a silicone or fluorine resin and particles each having a predetermined shape. The adhesive portion fixes the chip on the bottom of the cavity.

Abstract: A semiconductor acceleration sensor device has an acceleration sensor chip and a hollow package to house the acceleration sensor chip. A concave section is formed in a predetermined area on a bottom face inside the package. The semiconductor acceleration sensor device also has a low elasticity element with adhesiveness. The low elasticity element is filled in the concave section. The acceleration sensor chip is mounted on the low elasticity element. The adhesive surface between the low elasticity element and the acceleration sensor chip is higher than the bottom face.

Abstract: According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surface of a resin which seals the LSI chip connected to the multilayer wiring. The wiring traces are connected to terminal wiring traces connected to the multilayer wiring on the front face of the package substrate and to front-face bump electrodes for external connection on the upper surface of the resin. On the back face side of the package substrate, back-face bump electrodes for external connection are formed and connected to the multilayer wiring.

Abstract: The present invention provides a double-sided electrode package of a structure excellent in the reliability of connection and moisture resistance to another package, which is capable of being manufactured simply and at low cost. The present invention also provides a double-sided electrode package of a structure capable of forming inner wirings (electrode pads) in arbitrary layouts according to the number of pins of a semiconductor chip and the size thereof, which package is capable of being manufactured simply and at low cost. A copper foil is attached onto a core material formed with electrode pads, wirings, through electrodes, lands and a solder resist. The copper foil is wet-etched in several stages to form surface side terminals which stand on the wirings approximately vertically and each of which includes a plurality of protrusions (convex portions continuous in the circumferential direction) formed at their side faces over the full circumference along the circumferential direction.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: A semiconductor apparatus and a method of manufacturing same can simplify the manufacturing process and prevent a decrease in production yield without decreasing in sensor sensitivity.

Abstract: A semiconductor acceleration sensor of the invention comprises: a sensor chip having a pad formation surface around whose edge are formed a plurality of pads, and in which a rectangular frame shaped protrusion is formed on an area of the pad formation surface on a center side of the pads; and a control chip which has a terminal formation surface on which connection terminals are formed, and has a planar shape such that the pad of the sensor chip is visible from the terminal formation surface side. Moreover, the opposite surface of the control chip to the terminal formation surface is bonded to the frame shaped protrusion of the sensor chip.

Abstract: A semiconductor acceleration sensor chip has a fixed portion having a first thickness, a weight portion surrounding the fixed portion from a periphery, a beam portion having the first thickness and connecting the fixed portion and the weight portion such that the weight portion can displace with respect to the fixed portion, and a piezo element formed at the beam portion. The fixed portion is fastened to a lower container having a pedestal portion which projects-out at a center of a bottom surface of a cavity. In accordance with the above-described structure, there are provided a semiconductor acceleration sensor and method of manufacture thereof which can realize simplification of manufacturing processes and prevention of a decrease in yield, without a sensor sensitivity decreasing.

Abstract: A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, and an adhesive portion comprised of a silicone or fluorine resin and particles each having a predetermined shape. The adhesive portion fixes the chip on the bottom of the cavity.