Abstract: The prepreg includes a first resin layer and a second resin layer disposed on both surfaces of the first resin layer. The first resin layer is a half-cured product of a first resin composition that includes a glass cloth impregnated with the first resin composition and contains no hexagonal boron nitride. The second resin layer is a half-cured product of a second resin composition containing hexagonal boron nitride. The glass cloth has a warp and weft weave density of 54 pieces/25 mm or more. The hexagonal boron nitride has an average particle size ranging from 10 ?m to 30 ?m. The hexagonal boron nitride is contained in an amount ranging from 20 parts by mass to 40 parts by mass relative to 100 parts by mass of a residual component other than the hexagonal boron nitride in the second resin composition.

Abstract: A driving assistance system has a driving information acquisition unit that acquires any of an amount of operations by a driver, a vehicle behavior, a state of the driver, and information regarding the environment surrounding a vehicle as driving information, a vehicle location information acquisition unit that acquires vehicle location information, a statistical information generation unit that generates statistical information by statistically processing the driving information as a time-series pattern, an information associating unit that associates the statistical information with the vehicle location information at the time of the acquisition of the driving information, an information reference unit that references and reads the statistical information based on the location information acquired by the vehicle location information acquisition unit, a driving assistance unit that performs driving assistance based on the statistical information read by the information reference unit, and a communication uni

Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component. In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.

Abstract: A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

Abstract: A disk drive includes a housing, a disk recording medium disposed in the housing, and a plurality of filters disposed along a flow channel formed in the housing and overlapped with each other. Each of the filters including an outer member formed of an electrostatic woven fabric and electrostatic non-woven fibers contained in an enclosed space formed by the outer member.

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

Abstract: A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

Abstract: An etching device for etching a silicon-containing film formed on a substrate W is includes: a chamber; a substrate mounting mechanism provided in the chamber; a gas supply mechanism configured to supply an etching gas composed of fluorine, hydrogen, and nitrogen into the chamber; and an exhaust mechanism. The substrate mounting mechanism includes: a mounting table; temperature adjusting mechanisms configured to adjust a temperature of a mounting surface of the mounting table to 50 degrees C. or less; and a heating member configured to heat at least a portion of surfaces other than the mounting surface in the mounting table to 60 to 100 degrees C. A resin coating layer is formed at least on the mounting surface of the mounting table.

Abstract: A driving assistance system has a driving information acquisition unit that acquires any of an amount of operations by a driver, a vehicle behavior, a state of the driver, and information regarding the environment surrounding a vehicle as driving information, a vehicle location information acquisition unit that acquires vehicle location information, a statistical information generation unit that generates statistical information by statistically processing the driving information as a time-series pattern, an information associating unit that associates the statistical information with the vehicle location information at the time of the acquisition of the driving information, an information reference unit that references and reads the statistical information based on the location information acquired by the vehicle location information acquisition unit, a driving assistance unit that performs driving assistance based on the statistical information read by the information reference unit, and a communication uni

Abstract: A plurality of movable temporary hangers 7 are placed on a stay cable 4B hung in tension above a target stay cable 4C, and then the target stay cable 4C is held on a lower portion of the temporary hangers 7. Then, the target stay cable 4C held with the temporary hanger 7 is detached from a bridge deck 3 and a main tower 2. Then, the target stay cable 4C and the temporary hangers 7 holding the target stay cable 4C are moved toward the bridge deck 3 and removed.

Abstract: A plurality of movable temporary hangers 7 are placed on a stay cable 4B hung in tension above a target stay cable 4C, and then the target stay cable 4C is held on a lower portion of the temporary hangers 7. Then, the target stay cable 4C held with the temporary hanger 7 is detached from a bridge deck 3 and a main tower 2. Then, the target stay cable 4C and the temporary hangers 7 holding the target stay cable 4C are moved toward the bridge deck 3 and removed.

Abstract: In an optical motion capture system, it is possible to measure spatially high-dense data by increasing the number of measuring points. In the motion capture system using a mesh marker, intersections of lines for the mesh marker are called nodes and the lines connecting the nodes are called edges. The system includes a plurality of cameras for capturing a two-dimensional image of the mesh marker by imaging a subject having the mesh marker, a node/edge detecting section for detecting node/edge information on the mesh marker from the two-dimensional image captured by the respective cameras, and a three-dimensional reconstructing section for acquiring three-dimensional position information of the nodes by using the node/edge information detected from the plurality of two-dimensional images captured by different cameras.

Abstract: Provided are intervertebral disk nucleus pulposus stem cells or progenitor cells that may be used for treatment of intervertebral disk disorders. An intervertebral disk nucleus pulposus cell is characterized by being isolated from the intervertebral disk nucleus pulposus of a vertebrate and is positive for at least one surface marker from among Tie2 and GD2. That is, the intervertebral disk nucleus pulposus stem cell is characterized by being at least Tie2-positive for the surface marker and) possesses a self-renewal ability as well as multipotency capable of differentiating into adipocytes, osteocytes, chondrocytes and neurons. Also provided is an intervertebral disk nucleus pulposus progenitor cell characterized by being at least Tie2-negative and GD2-positive for the surface marker and capable of differentiating into any of adipocytes, osteocytes, chondrocytes and neurons.

Abstract: An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).

Abstract: A forward/reverse mechanics calculation of an accurate model of a human body having bone geometrical data and muscle/cord/band data is carried out at high speed. When a new skeleton geometrical model is given, a mapping between the new skeleton geometrical model and a pre-defined normal body model representing a normal body is defined to automatically produce a new body model.

Abstract: An epoxy resin composition is provided having the necessary flame retardancy and heat resistance for a laminate or multilayer board, and having superior dielectric properties without exhibiting any decrease in interlayer adhesiveness. The epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.

Abstract: An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.

Abstract: The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.

Abstract: The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks. This epoxy resin composition includes: (A) an epoxy resin; (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent, (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A).