Abstract: Repeaters are arranged at arbitrary positions to substantially improve transmission speed of a signal. In the semiconductor integrated circuit device 1, repeater regions 10 where repeaters are provided as relay points for wiring are provided in the central parts of the core power source regions 2, 3 and 5, on the left side of the core power source regions 4 to 8 and at the upper and lower parts of the semiconductor integrated circuit device 1. A power switch region for repeater 11 is formed so as to surround the core power source regions 2 to 8 and the repeater regions 10. The power source lines of the reference potential connected to the repeater regions 10 are laid out at equally spaced intervals throughout the core power source regions 2 to 8, which enables the repeater regions 10 to be flexibly laid out. This permits the repeaters to be more effectively arranged, which improves the performances of semiconductor integrated circuit device 1.

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: A plurality of MOS transistors each having an SOI structure includes, in mixed form, those brought into body floating and whose body voltages are fixed and variably set. When a high-speed operation is expected in a logic circuit in which operating power is relatively a low voltage and a switching operation is principally performed, body floating may be adopted. Body voltage fixing may be adopted in an analog system circuit that essentially dislikes a kink phenomenon of a current-voltage characteristic. Body bias variable control may be adopted in a logic circuit that requires the speedup of operation in an active state and needs low power consumption in a standby state. Providing in mixed form the transistors which are subjected to the body floating and the body voltage fixing and which are variably controlled in body voltage, makes it easier to adopt an accurate body bias according to a circuit function and a circuit configuration in terms of the speedup of operation and the low power consumption.

Abstract: A semiconductor integrated circuit device is provided, the circuit being capable of arranging a control signal system, avoiding a danger of failure to check an indefinite signal propagation prevention circuit or the like, further facilitating a check oriented to mounting on an automated tool, and facilitating power shutdown control inside of a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains Area A to Area I. A rule is provided, the rule defining that, in the case where a circuit having a high priority is turned ON, a power domain having its lower priority cannot be turned OFF, thereby facilitating a designing method. In addition, areas capable of applying still another power supply are provided in the independent power areas Area A to Area I. In that area, a relay buffer (repeater) and a clock buffer or an information retaining latch for saving information are integrated.

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: A semiconductor integrated circuit device enhanced in design efficiency while achieving multi-functionalization and power saving is to be provided.

Abstract: The invention provides a semiconductor integrated circuit device with improved designing efficiency while achieving higher functions.

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: A body bias control system allows for independent design of a functional module, thereby reducing the burden of designing the module. The body bias control system provides a switch circuit having an area in which the body bias is controlled independently of its outside portion, for controlling the supply of body bias in the vicinity of the area. Preferably three types of switches are provided for switching the body bias to suitable levels for a standby mode, a mode of normal operation and a mode of high-speed operation.

Abstract: A dynamic RAM includes sense amplifiers each formed of a latch circuit consisting of MOSFETs of a first and second conductivity types with the application of a first and second voltages to the sources thereof, respectively, and having a pair of input/output nodes corresponding to a first bit line pair which is connected with a number of dynamic memory cells, and further includes pairs of switching MOSFETs of the first conductivity type which connect selectively an input/output node pair of the latch circuits to a pair of second bit lines provided commonly to a plurality of the first bit line pair in response to the reception of the select signal. The switching MOSFETs have their threshold voltage set smaller in terms of absolute value than the threshold voltage of the MOSFETs of the first conductivity type of the latch circuits, and the select signal has its level of turning off the switching MOSFETs set greater in terms of absolute value than the first voltage with respect to the second voltage.

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: A dynamic RAM includes sense amplifiers each formed of a latch circuit consisting of MOSFETs of a first and second conductivity types with the application of a first and second voltages to the sources thereof, respectively, and having a pair of input/output nodes corresponding to a first bit line pair which is connected with a number of dynamic memory cells, and further includes pairs of switching MOSFETs of the first conductivity type which connect selectively an input/output node pair of the latch circuits to a pair of second bit lines provided commonly to a plurality of the first bit line pair in response to the reception of the select signal. The switching MOSFETs have their threshold voltage set smaller in terms of absolute value than the threshold voltage of the MOSFETs of the first conductivity type of the latch circuits, and the select signal has its level of turning off the switching MOSFETs set greater in terms of absolute value than the first voltage with respect to the second voltage.

Abstract: A dynamic RAM includes sense amplifiers each formed of a latch circuit consisting of MOSFETs of a first and second conductivity types with the application of a first and second voltages to the sources thereof, respectively, and having a pair of input/output nodes corresponding to a first bit line pair which is connected with a number of dynamic memory cells, and further includes pairs of switching MOSFETs of the first conductivity type which connect selectively an input/output node pair of the latch circuits to a pair of second bit lines provided commonly to a plurality of the first bit line pair in response to the reception of the select signal. The switching MOSFETs have their threshold voltage set smaller in terms of absolute value than the threshold voltage of the MOSFETs of the first conductivity type of the latch circuits, and the select signal has its level of turning off the switching MOSFETs set greater in terms of absolute value than the first voltage with respect to the second voltage.

Abstract: A dynamic RAM includes sense amplifiers each formed of a latch circuit consisting of MOSFETs of a first and second conductivity types with the application of a first and second voltages to the sources thereof, respectively, and having a pair of input/output nodes corresponding to a first bit line pair which is connected with a number of dynamic memory cells, and further includes pairs of switching MOSFETs of the first conductivity type which connect selectively an input/output node pair of the latch circuits to a pair of second bit lines provided commonly to a plurality of the first bit line pair in response to the reception of the select signal. The switching MOSFETs have their threshold voltage set smaller in terms of absolute value than the threshold voltage of the MOSFETs of the first conductivity type of the latch circuits, and the select signal has its level of turning off the switching MOSFETs set greater in terms of absolute value than the first voltage with respect to the second voltage.

Abstract: A DRAM module is applied to the system LSI which is provided with a standby mode for suppressing the whole operation thereof and an operation standby mode which permits at least the DRAM module to operate but suppresses the operation of other circuits. The above-mentioned modes as well as a substrate bias control technology are applied to the CMOS system LSI that operates on a low voltage. The system LSI is controlled to hold or not to hold data, enabling a memory of a large capacity to be mounted and consuming a sufficiently decreased amount of electric power.

Abstract: A semiconductor memory device, divided into plural blocks, comprising: a memory array having a non-volatile memory element which makes the read cycle and the write cycle to be substantially equivalent; plural storage elements storing the information of write protection/permission corresponding to each said block respectively; and a setting circuit to set the information of write protection/permission to said plural storage elements, wherein said setting circuit sets the write-protection information to said plural storage elements at the write cycle after designated plural read cycles. Therefore, the write protection/permission can be set by the unit of block, block by block, so that the write-protected ROM and the RAM can be set freely. Furthermore, the complexity of the setting procedure of write protection/permission may prevent the accidental false setting caused by a system runaway and so forth.

Abstract: A semiconductor memory device, divided into plural blocks, includes a memory array having a non-volatile memory element in which address access times for the read cycle and the write cycle are substantially equivalent to one another (for example, a ferroelectric memory element). Plural storage elements stores the information for write protection/permission corresponding to each of the blocks, respectively. A setting circuit is provided to set the information for write protection/permission to the plural storage elements. The setting circuit sets the write-protection information to the plural storage elements at the write cycle after designated plural read cycles. Therefore, the write protection/permission can be set in block units block by block, so that the write-protected areas for a ROM and a RAM formed by the non-volatile memory element can be set freely.

Abstract: A test mode circuit for an integrated circuit includes a high voltage detector having an input for receiving a high voltage signal, a Schmitt trigger having an input coupled to the output of the high voltage detector, a latch having an input coupled to the output of the Schmitt trigger and an output for providing a test mode signal in a test operational mode, and additional control circuitry for disabling the high voltage detector and Schmitt trigger so that substantially all of the active current flow in the high voltage detector and Schmitt trigger is eliminated in a normal operational mode. The test mode circuit further includes circuitry for preventing a reset condition in the latch during the test mode until a power-down condition occurs. A glitch filter is also included, which is interposed between the output of the Schmitt trigger and the input to the latch.

Abstract: A system and method for selective write protection for a non-volatile memory device which comprises a superset of the existing JEDEC 21-C standard and in which user definable portions of a non-volatile memory device can be write protected instead of only the entire device. The write-protection technique of the present invention can be selectably enabled or disabled dynamically as determined by a user. Moreover, the system and method of the present invention provides for storage of the device write-protection configuration in non-volatile memory in order that the device can be restored to its last known write-protection state in the event it is powered down or the current configuration is otherwise lost.