Patents by Inventor Yoshihisa Hatta

Yoshihisa Hatta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a circuit board not having solder failures
    Publication number: 20010008043
    Abstract: A method of making a circuit board (10) on which surface electronic components (15) are mounted during the method using a solder reflow process. The board comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction that the board travels during the reflow direction (16), thereby preventing electronic component soldering failures that may occur as a result of the deflection of the circuit board during the reflow process.
    Type: Application
    Filed: February 20, 2001
    Publication date: July 19, 2001
    Inventors: Yukiko Daido, Yoshihisa Hatta
  • Circuit board for preventing solder failures
    Patent number: 6222135
    Abstract: A circuit board (10) on which surface electronic components (15) are mounted during a reflow process comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction the board travels during the reflow direction (16) to prevent electronic component soldering failures that may occur as a result of the deflection of the circuit board flow process.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: April 24, 2001
    Assignee: International Business Machines Corporation
    Inventors: Yukiko Daido, Yoshihisa Hatta