Abstract: A module (101) includes a substrate (1) having a first main surface (1a) and including wiring, a first component (31) having a circuit surface (31a), mounted on the first main surface (1a) such that the circuit surface (31a) faces the first main surface (1a), and having a ground terminal (10) on the circuit surface (31a), a first sealing resin (6a) disposed to cover the first main surface (1a) and the first component (31), and a heat dissipation portion (5) provided along an upper surface of the first sealing resin (6a). The wiring is connected to the ground terminal (10), and the module further includes a heat conducting member (7) connecting the wiring and the heat dissipation portion (5).

Abstract: A module includes a core substrate provided with a first surface and a second surface that define front and rear surfaces, respectively, the core substrate being provided with a through hole that connects the first surface and the second surface to each other, a redistribution layer arranged to cover the first surface and the through hole of the core substrate, a first component at least partially arranged in the inside of the through hole, and a second component mounted on a side of the second surface of the core substrate as partially being superimposed on the through hole. The first component is electrically connected to the redistribution layer. The first component is electrically directly connected to the second component in a portion where the second component is superimposed on the through hole.

Abstract: A radio frequency module includes a wiring board, a first electronic component and a second electronic component, and a third electronic component connected to a matching circuit. The wiring board includes a core board having not only a first principal surface and a second principal surface but also a through hole, a first buildup layer stacked on the first principal surface, and a second buildup layer stacked on the second principal surface. At least one of the first electronic component or the second electronic component is disposed partially inside the through hole. The third electronic component is disposed on the first buildup layer. The second electronic component is stacked on one side, where the third electronic component is located, of the first electronic component in a thickness direction defined for the core board. The second electronic component is a constituent component of the matching circuit.

Abstract: Provided is a radio frequency module which may not only reduce the height of the overall module but also ensure a sufficient degree of planarity as well. In a radio frequency module, a first electronic component is disposed on a wiring board. A second electronic component is built in the wiring board. A core board has a through hole. The first electronic component is arranged on a first buildup layer to overlap with the through hole of the core board when viewed in plan in a thickness direction defined for the core board. The second electronic component is disposed inside the through hole of the core board. Thickness of the second electronic component is greater than thickness of the core board when measured in the thickness direction defined for the core board. The second electronic component is electrically connected to the first electronic component via the first buildup layer.

Abstract: In a radio frequency module, a magnetic core included in an inductor is disposed inside a through hole of a core board. An axis of winding of a coil is perpendicular to a thickness direction defined for the core board. A magnetic core has a first side surface and a second side surface intersecting with the axis of winding of the coil. A first shield portion includes a first feedthrough ground via conductor provided for the core board. A second shield portion includes a second feedthrough ground via conductor provided for the core board. The first feedthrough ground via conductor and the second feedthrough ground via conductor are arranged to interpose the magnetic core between the first feedthrough ground via conductor and the second feedthrough ground via conductor in a direction aligned with the axis of winding of the coil.

Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin that covers the first main surface and a portion of connection of the first component to at least the first main surface, a first conductor pattern arranged on a surface of the first sealing resin on a side distant from the first main surface, and a columnar conductor as a metal member connected to the first conductor pattern to pass through the first sealing resin from an electrode drawn from the first component along the first main surface.

Abstract: A module includes: a board having a first main surface; a first component mounted on the first main surface; a first conductor column group including a plurality of conductor columns arranged on the first main surface along at least a part of an outer periphery of the first component; a first ground conductor disposed inside the board; a first conductor via group including a plurality of via conductors that connect the first ground conductor and an end of each of the conductor columns, the end of each of the conductor columns being located close to the first main surface; and a shield film disposed to cover over the first component. When viewed in a cross section taken along a plane perpendicular to the first main surface, the first component is at least partially surrounded by the first conductor column group, the first conductor via group, and the first ground conductor.

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film.

Abstract: A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection.

Abstract: A module is provided that includes a wiring substrate having a major surface, a plurality of components mounted on the major surface, and a conductor incorporated resin body mounted on the major surface. Moreover, the conductor incorporated resin body is disposed between the plurality of components and includes a conductor pattern therein that is grounded.

Abstract: A module includes: a board having a first main surface; a first component mounted on the first main surface; a first wire group including a plurality of wires disposed to extend across the first component; a first ground conductor disposed inside the board; and a first conductor via group including a plurality of via conductors that connect each of the wires belonging to the first wire group and the first ground conductor. The first component is surrounded by the first wire group, the first conductor via group, and the first ground conductor.

Abstract: In a circuit module of the present disclosure, one or more solder balls have an ellipsoidal shape, are located in an inter-board region between an upper circuit board and a lower circuit board, and electrically connect the upper circuit board and the lower circuit board. The size of the second solder ball is larger than the size of the first solder ball. A first sealing resin is provided in the inter-board region so as to be in contact with a first lower main surface and a second upper main surface and to cover surfaces of the one or more second solder balls.

Abstract: A circuit module of the present disclosure includes a first circuit board, a second circuit board, a first electronic component, and one or more first solder balls. The first circuit board includes a first positive main surface and a first negative main surface. The first electronic component includes a third positive main surface and a third negative main surface. The one or more first solder balls have an ellipsoidal shape. The one or more first solder balls are located in an inter-board region between the first circuit board and the second circuit board. The first solder ball electrically connects the first circuit board and the second circuit board. The third positive main surface of the first electronic component is in contact with the first negative main surface of the first circuit board.

Abstract: A module includes a main substrate having a first surface, a sub-module mounted on the first surface, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface, the sub-module, and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film formed so as to cover at least a part of a surface of second sealing resin remote from the first surface. A surface of the sub-module remote from the first surface includes a striped section where an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged.

Abstract: A high frequency module includes a mounting board, a first electronic component, a second electronic component, and a shield member. The mounting board has a main surface. The first electronic component and the second electronic component are disposed on the main surface of the mounting board. The shield member is disposed on the main surface of the mounting board. The shield member is positioned between the first electronic component and the second electronic component, and is adjacent to the first electronic component and the second electronic component.

Abstract: A module substrate, a sealing resin portion, and a shield are provided. The shield is provided to cover each of the sealing resin portion and a peripheral side surface of the module substrate. The shield is connected to a ground electrode. On the peripheral side surface, the shield is separated into a first surface side and a second surface side.

Abstract: A module includes: a first substrate having a first surface and a second surface facing opposite sides; and a second substrate having a third surface and a fourth surface facing opposite sides, wherein the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate, while being spaced apart from the first substrate on the second surface side of the first substrate, the first substrate and the second substrate are electrically connected, an inductor is mounted on the third surface, and at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux, and each of the at least one shield electrode is grounded.

Abstract: A module comprises: a first electronic component having a first component surface and a second component surface; a second electronic component having a third component surface and a fourth component surface; a first substrate having a first substrate surface and a second substrate surface; and a second substrate having a third substrate surface and a fourth substrate surface, the second substrate being disposed so as to overlap the first substrate while being spaced from the first substrate, the first electronic component and the second electronic component being disposed such that the second component surface and the third component surface face each other, at least a portion of the second electronic component being disposed inside an opening, the first electronic component being mounted on the second substrate surface by face bonding, the second electronic component being wire-bonded to the fourth substrate surface using a second connection terminal.

Abstract: A circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.

Abstract: A module includes a die pad arranged to locate a lower end thereof on a reference plane, a signal terminal arranged to locate a lower end thereof on the reference plane, an electronic component fixed as being superimposed above the die pad, and a sealing resin arranged to seal the die pad, the signal terminal, and the electronic component from above. The electronic component is provided with a component first surface facing a side of the die pad and a component second surface facing a side opposite to the die pad. The component second surface and the signal terminal are electrically connected to each other through a first wire. The die pad includes a die pad main body on which the electronic component is carried and a surrounding portion extending from the die pad main body along the reference plane to surround the signal terminal apart from the signal terminal.