Abstract: A coil component includes an insulating layer; an annular ring-shaped coil core embedded in the insulating layer; a coil electrode wound around the coil core; an input electrode designed for external connection, disposed on a lower surface of the insulating layer, and connected to a first end of the coil electrode; and an output electrode designed for external connection, disposed on the lower surface of the insulating layer, and connected to a second end of the coil electrode. One of the input electrode and the output electrode is disposed inside the coil core in a plan view. With this configuration, unlike a conventional coil component in which both input and output electrodes are disposed outside a coil core, it is possible not only to easily reduce the area of the coil component in a plan view, but also to improve heat dissipation characteristics of the coil component.

Abstract: A module includes a main substrate, a sub-module mounted on a first surface of the main substrate, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an inner shield film formed so as to cover at least a part of side surfaces of the second sealing resin and not to electrically connect to the main substrate. A ground connection conductor is disposed so as to electrically connect to the inner shield film, and the ground connection conductor is exposed to the outside.

Abstract: A module includes a main board including a first surface, a submodule mounted on the first surface, a first component mounted on the first surface separately from the submodule, a first sealing resin formed so as to cover the first surface, the submodule, and the first component, and an external shield film formed so as to cover a surface and a side surface of the first sealing resin on a side far from the first surface and a side surface of the main board. The submodule includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shield film formed so as to cover at least a part of a side surface of the second sealing resin. The internal shield film has at least a two-layer structure.

Abstract: A module includes a main substrate having a first surface, a sub-module mounted on the first surface, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface, the sub-module, and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film formed so as to cover at least a part of a surface of second sealing resin remote from the first surface. A surface of the sub-module remote from the first surface includes a striped section where an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged.

Abstract: A coil electrode 4 provided in a coil component 1a includes a plurality of inner metal pins 5a arranged on an inner peripheral side of a coil core 3, a plurality of outer metal pins 5b arranged on an outer peripheral side of the coil core 3 to form a plurality of pairs with the inner metal pins 5a, a plurality of lower wiring patterns 7 that connect lower ends of the inner metal pins 5a and the outer metal pins 5b in the pairs, and a plurality of upper wiring patterns 6 that connect upper ends of the outer metal pins 5b to upper ends of inner metal pins 5a adjacent to the inner metal pins 5a that form the pairs with the outer metal pins 5b.

Abstract: A module includes a wiring board having a first main surface, a first component mounted on the first main surface and having a first height H1, a second component mounted on the first main surface and having a second height H2 lower than the first height H1, and a sealing resin arranged so as to cover the first component and the second component while covering the first main surface. Compared to a first connection terminal used for connection between the first component and the first main surface, a second connection terminal used for connection between the second component and the first main surface has a higher height. A surface of the first component on a side far from the first main surface and a surface of the second component on a side far from the first main surface are exposed from the sealing resin.

Abstract: A module substrate, a sealing resin portion, and a shield are provided. The shield is provided to cover each of the sealing resin portion and a peripheral side surface of the module substrate. The shield is connected to a ground electrode. On the peripheral side surface, the shield is separated into a first surface side and a second surface side.

Abstract: An inductor component 1 includes a resin layer 2, a protective film 4, two metal pins 5 provided to stand in the resin layer 2, and a metal plate 6 joined to both of the metal pins 5, and both of the metal pins 5 and the metal plate 6 configure an inductor electrode 7. Both of the metal pins 5 are provided to stand in the resin layer 2, upper end surfaces 5a thereof are exposed to an upper surface 2a of the resin layer 2, and lower end surfaces 5b thereof are exposed to a lower surface 2b. Recesses 8 are formed around the peripheral edges of the upper end surfaces 5a of both of the metal pins 5 by laser beam irradiation.

Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across both the first component and the second component. The wire has one end and the other end that are both connected to the first surface, and the wire is grounded. As seen in a direction perpendicular to the first surface, the first component is located closer to the one end than the second component, a portion of the wire that is furthest from the first surface is located closer to the one end than to the other end, and the second component has an upper surface located lower than an upper surface of the first component.

Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin that covers the first main surface and a portion of connection of the first component to at least the first main surface, a first conductor pattern arranged on a surface of the first sealing resin on a side distant from the first main surface, and a columnar conductor as a metal member connected to the first conductor pattern to pass through the first sealing resin from an electrode drawn from the first component along the first main surface.

Abstract: A module comprises: a substrate having a first surface; a first component that is mounted on the first surface; a first sealing resin that covers the first surface and at least a portion of the first component that is connected to the first surface; a first conductor pattern that is disposed on a surface of the first sealing resin that is farther from the first surface; and a wire that serves as a plurality of connecting conductors each electrically interconnecting the first surface and the first conductor pattern, wherein when viewed in a direction perpendicular to the first surface, the plurality of connecting conductors are disposed so as to surround the first component, and the first conductor pattern includes a frame-shaped portion that electrically interconnects the plurality of connecting conductors outside the first component successively.

Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.

Abstract: Provided is a high-frequency module capable of enhancing its shielding performance by reducing a placement interval of bonding wires at a desired position using a plurality of bonding wires different in arc height when a shield member is formed using the bonding wires. A high-frequency module includes a multilayer wiring board, components mounted on an upper surface of the multilayer wiring board, a shield member disposed along the component, a sealing resin layer, and a shield film. The shield member is formed of a plurality of bonding wires different in arc height. When the bonding wires are disposed by allowing a bonding wire having a high arc height to sequentially straddle a bonding wire having a low arc height in a nested manner, a placement interval of the bonding wires at a desired position can be reduced and shielding performance can be enhanced.

Abstract: A module includes: a board having a first main surface; a first component mounted on the first main surface; a first wire group including a plurality of wires disposed to extend across the first component; a first ground conductor disposed inside the board; and a first conductor via group including a plurality of via conductors that connect each of the wires belonging to the first wire group and the first ground conductor. The first component is surrounded by the first wire group, the first conductor via group, and the first ground conductor.

Abstract: A module includes: a board having a first main surface; a first component mounted on the first main surface; a first conductor column group including a plurality of conductor columns arranged on the first main surface along at least a part of an outer periphery of the first component; a first ground conductor disposed inside the board; a first conductor via group including a plurality of via conductors that connect the first ground conductor and an end of each of the conductor columns, the end of each of the conductor columns being located close to the first main surface; and a shield film disposed to cover over the first component. When viewed in a cross section taken along a plane perpendicular to the first main surface, the first component is at least partially surrounded by the first conductor column group, the first conductor via group, and the first ground conductor.

Abstract: A high-frequency module 1 includes: a substrate 2; a first component 4 mounted on an upper surface 2a of the substrate 2; a second component 5 mounted on a lower surface 2b of the substrate 2; an upper sealing resin layer 6 and a lower sealing resin layer 7; a conductor pin 8; and a shield layer 9. The conductor pin 8 includes a terminal portion 8a exposed from a lower surface 7a of the lower sealing resin layer 7 and connected to a ground electrode of an outer substrate, and a shield connection portion 8b exposed from a side surface 7b of the lower sealing resin layer 7 and connected to the shield layer 9. As a result of the terminal portion 8a of the conductor pin 8 being connected to the ground electrode, the shield layer 9 is connected to a ground potential with the shortest distance therebetween.

Abstract: Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A module 1 includes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. Since the intermediate layer is formed by using a frame-shaped substrate, the upper module and the lower module can be connected without necessarily a bump, so that it is possible to provide a module which has a fanout-type package-on-package structure and can be easily reduced in height.

Abstract: A high-frequency module 1a includes: a circuit board 2; a first component 3a, which has characteristics likely to be changed by heat, and a second component 3b, which generates heat, that are mounted on an upper surface 20a of the circuit board 2; a sealing resin layer 4 configured to cover each of the components 3a and 3b and a component 3c; a shield film 5 configured to cover a surface of the sealing resin layer 4; and a heat dissipation member 6 disposed above an upper surface 4a of the sealing resin layer 4. A recessed portion 11 is formed in the upper surface 4a of the sealing resin layer 4 as viewed in a direction perpendicular to the upper surface 20a of the circuit board 2. The recessed portion 11 can prevent the heat generated from the second component 3b from affecting the first component 3a.

Abstract: A high-frequency module (1a) includes a multilayer wiring substrate (2), a plurality of components (3a, 3b) mounted on an upper surface (20a) of the multilayer wiring substrate (2), a sealing resin layer (4) laminated on the upper surface (20a) of the multilayer wiring substrate (2) and sealing the plurality of components (3a, 3b), and a shield (5). The shield (5) is composed of shield walls (5a, 5b) arranged in grooves (12) and (13), respectively, formed between the first component (3a) and the second component (3b) in the sealing resin layer (4) and a connecting conductor (11) coupling both the shield walls (5a, 5b). A first region (40a) and a second region (40b) in the sealing resin layer (4) split by the shield (5) are contiguous at the location of the connecting conductor (11) as seen from a direction perpendicular to the upper surface (20a) of the multilayer wiring substrate (2).

Abstract: A radio-frequency module includes a multilayer circuit board, a plurality of components mounted on a top surface of the multilayer circuit board, a sealing resin layer laminated on the top surface of the multilayer circuit board and sealing a plurality of components, and a shield wall disposed in a groove formed in the sealing resin layer between the component and the component. The shield wall has a region that overlaps the component when viewed in a direction perpendicular to the top surface of the multilayer circuit board. The groove in the overlapped region is formed with a depth that does not reach the component. In the component, a terminal electrode that covers the entire surfaces of side surfaces, and part of a top surface, a bottom surface, and side surfaces is formed.