Patents by Inventor Yoshikatsu INAGAKI

Yoshikatsu INAGAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200173730
    Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.
    Type: Application
    Filed: January 31, 2020
    Publication date: June 4, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke WATANABE, Tatsuro MIURA, Toshiaki NAKAMURA, Kenya KAWABATA, Yoshikatsu INAGAKI
  • Patent number: 10667430
    Abstract: Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: May 26, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Hirofumi Aoki
  • Publication number: 20200149823
    Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases.
    Type: Application
    Filed: November 7, 2019
    Publication date: May 14, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI
  • Publication number: 20200141659
    Abstract: The present disclosure provides a heat pipe capable of preventing deformation of even a thin container and having excellent heat transfer characteristics by preventing freezing of a working fluid even if the longitudinal direction of the container is set substantially parallel to the direction of gravity in cold regions. A heat pipe includes a container having a tubular shape with both ends sealed, a wick structure stored in the container, and a working fluid sealed in the container, wherein, in at least one of cross sections perpendicular to the longitudinal direction of the container, the wick structure is in contact with the inner surface of the container at two points but both side surfaces of the wick structure are not in contact with any inner surface of the container, and a sintered metal layer is formed on the container inner surface being not in contact with the wick structure.
    Type: Application
    Filed: December 20, 2019
    Publication date: May 7, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu INAGAKI, Shinichi ITO, Kazuya TAKAHASHI, Shuta HIKICHI
  • Publication number: 20200041215
    Abstract: Provided is a heat pipe which is installed in a cold region in a bottom heat posture in which a longitudinal direction of a container is substantially in parallel with a gravitational direction, is capable of preventing the container from deforming even when a working fluid has become frozen, and has excellent heat transport properties.
    Type: Application
    Filed: October 11, 2019
    Publication date: February 6, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu INAGAKI, Hirofumi AOKI, Kazuya TAKAHASHI, Shinichi ITO, Shuta HIKICHI
  • Publication number: 20200025460
    Abstract: The present disclosure is related to providing a heat sink that exhibits an excellent cooling performance by preventing occurrence of a hot spot on a heat pipe. A heat sink comprising: a heat receiving plate to which a heating element is thermally connected; and a heat pipe thermally connected to the heat receiving plate, wherein a thermal conductivity of the heat receiving plate is higher than a thermal conductivity of a material of a container of the heat pipe.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi AOKI, Yoshikatsu INAGAKI, Kenya KAWABATA, Hiroshi OKADA, Daiki TAKEMURA
  • Publication number: 20200025459
    Abstract: There is provided a flat heat pipe that is not easily deformed in spite of a reduction in thickness and can maintain high heat transport capacity. A flat heat pipe 100 includes a container 130 in which a cavity 130S is formed by plates 110 (110a, 110b) made of metal and disposed substantially in parallel with each other, working fluid that is enclosed in the cavity 130S, and a wick structure 150 that is inserted into the container. The wick structure 150 includes a first sheet-like member 140, and hollow protruding portions 170 protruding in a height direction of the container 130 are formed on the first sheet-like member 140.
    Type: Application
    Filed: September 18, 2019
    Publication date: January 23, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tomoaki TORATANI, Yoshinori NAKAMURA, Yoshikatsu INAGAKI, Hirofumi AOKI
  • Publication number: 20190360760
    Abstract: To provide a vapor chamber with which distortion of a container is reduced regardless of the kind of the material of the container and generation of pin-holes in a melted part of the container is prevented. The vapor chamber includes a container having a hollow cavity part, the container being formed by laminating one tabular member and another tabular member facing the one tabular member; a working fluid enclosed in the cavity part; and a wick structure provided in the cavity part. An outer peripheral part of the cavity part is sealed by welding. A melted part formed by the welding runs through the one tabular member, while the melted part does not run through the other tabular member.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi AOKI, Yoshikatsu INAGAKI
  • Publication number: 20190360762
    Abstract: A vapor chamber excellent in productivity, reduction of a number of components, and capable of preventing reduction in area of a cavity section while reducing a space of an outer periphery of the cavity section in which a working fluid is sealed is provided. An example vapor chamber has a container in which a cavity section is formed by stacked plate-shaped members, a working fluid that is sealed in the cavity section, and a wick structure accommodated in the cavity section.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 28, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi AOKI, Yoshikatsu INAGAKI, Hiroshi SAKAI
  • Patent number: 10458720
    Abstract: A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: October 29, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tatsuro Miura, Yoshikatsu Inagaki, Hiroshi Okada
  • Publication number: 20190281729
    Abstract: An object of the present disclosure is to provide a heat radiation member which excels in the cooling performance for a heat generator mounted in a thin casing and the thermal diffusion performance from the heat generator. A vapor chamber to be attached inside a casing includes: a flat plate-like container having a cavity portion; a wick structure provided to the cavity portion; a working fluid sealed in the cavity portion; and a resin attachment member, provided on the container, for attachment into the casing.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu INAGAKI, Hirofumi AOKI
  • Publication number: 20190219219
    Abstract: A heat insulating structure body comprising: a container which includes a first plate-like body, a second plate-like body facing the first plate-like body, a partition plate for dividing a space between the first plate-like body and the second plate-like body, a first cavity part formed by the first plate-like body and the partition plate, and a second cavity part formed by the second plate-like body and the partition plate, wherein a wick structure body and a working fluid are sealed in the second cavity part.
    Type: Application
    Filed: March 22, 2019
    Publication date: July 18, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu INAGAKI, Hirofumi AOKI
  • Publication number: 20190141855
    Abstract: Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation.
    Type: Application
    Filed: December 31, 2018
    Publication date: May 9, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
  • Publication number: 20190137187
    Abstract: Provided is a heat sink structure which can reliably prevent blocking and narrowing of an inner space of the planar heat pipe thus having excellent heat transmission characteristics, and which can make cooling of a plurality of heat generating elements installed in a narrowed inner space uniform with a simple configuration. A heat sink structure has a planar heat pipe configured to be placed on a plurality of heat generating elements thus being thermally coupled to the plurality of heat generating elements; and a tubular heat pipe thermally coupled to a heat radiating portion of the planar heat pipe at a heat receiving portion of the tubular heat pipe.
    Type: Application
    Filed: December 31, 2018
    Publication date: May 9, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI, Daiki TAKEMURA
  • Publication number: 20190024984
    Abstract: To provide a heat pipe where the heat pipe has an excellent capacity for absorbing a non-condensable gas such as a hydrogen gas thus exhibiting excellent heat transfer characteristics. The heat pipe includes: a container having a cavity portion inside the container; a wick structure disposed in the cavity portion; a working fluid sealed in the cavity portion; and a metal which absorbs hydrogen at 350° C. or below and releases no hydrogen at 350° C. or below, the metal being disposed in the cavity portion.
    Type: Application
    Filed: February 24, 2017
    Publication date: January 24, 2019
    Applicant: Furukaw Electric Co., Ltd.
    Inventors: Hirofumi Aoki, Hiroshi Sakai, Yoshikatsu Inagaki
  • Patent number: 10184729
    Abstract: A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: January 22, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Tatsuro Miura, Tomoki Yanagida
  • Patent number: 10119770
    Abstract: A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m·K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m·K, a peripheral portion of the hollow portion being sealed.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: November 6, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi Aoki, Hiroshi Sakai, Tatsuro Miura, Yoshikatsu Inagaki
  • Patent number: 10107561
    Abstract: A heat pipe suited for thinning, and achieving high heat transport performance is provided. A heat pipe 1 according to the invention includes working liquid, a container 2 into which the working liquid is sealed, and a mesh member 3 disposed in such a position as to come into contact with at least two inner surfaces of the container, the two surfaces facing to each other. The mesh member 3 is formed by a plurality of meshes 31 and 32 laminated on each other. The porosity in the portion where the respective meshes 31 and 32 contact each other is lower than the porosity in the portion where the meshes 31 and 32 contact the container 2.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: October 23, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Hiroshi Sakai, Hirofumi Aoki, Masanobu Sugimura
  • Publication number: 20180172360
    Abstract: A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.
    Type: Application
    Filed: July 22, 2015
    Publication date: June 21, 2018
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tatsuro MIURA, Yoshikatsu INAGAKI, Hiroshi OKADA
  • Patent number: 9995537
    Abstract: The purpose of this invention is to provide a sheet-shaped heat pipe that makes it possible to reduce a pressure loss caused by a vapor flow or a pressure loss caused by a working fluid flow to improve the maximum amount of heat to be transported and reduce thermal resistance by increasing the cross-sectional area of a vapor flow passage or a fluid flow passage, which has been limited by the length of a container in a height direction. A heat pipe (20) is provided with a protruding portion (24) so that the height of the wick-occupied portion (23) serving as the fluid flow passage is larger than the height of the space portion (22) serving as the vapor flow passage.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 12, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi Aoki, Masami Ikeda, Yoshikatsu Inagaki