Abstract: A method for manufacturing a substrate having electrically conductive circuits on the surface of a transparent substrate, window-shaped coating films on the electrically conductive circuits and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, includes the steps of:(a) coating the surface of a transparent substrate with a photoresist composition to cover the circuits-carrying surface of the substrate, followed by forming a photoresist coating film,(b) superposing a photomask on the surface of the photoresist coating film formed through step (a) and exposing the thus masked photoresist coating film to light,(c) subjecting the substrate formed through steps (a) and (b) to development, and eliminating the photoresist coating film in the frame-shaped part,(d) subjecting the photoresist coating film left in step (c) to heat-treatment,(e) coating the substrate obtained through steps (a) to (d) in this order with a negative photoresist composition containing a

Abstract: A color filter having discrete color layers arrayed on a substrate and light screening coating films interlaced between the color layers and if desired seal part having no coating film thereon, with high precision is industrially advantageously manufactured by (a) forming a transparent electroconductive layer on a transparent substrate, (b) coating the transparent electroconductive layer with a positive photoresist composition to form a photoresist layer, (c) exposing the photoresist layer to light through a photomask and developing the light-exposed photoresist layer to form a circuit-form photoresist layer, (d) etching and eliminating the transparent electroconductive layer bared in the gaps between the circuit-form photoresist layer to obtain a substrate having thereon a circuit-form laminate, (e) exposing the laminate to light through a photomask and developing the light-exposed laminate to bare the transparent electroconductive layer discretely, (f) carrying out electrodeposition using a thermosetting or

Abstract: A method for manufacturing a substrate useful as a color filter for LCD and having window-shaped coating films and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, which comprises the steps of:(a) forming a functional coating film on a transparent substrate having electrically conductive circuits on a surface thereof,(b) superposing a photomask having a predetermined pattern on the surface of the coating film formed in step (a), and exposing the thus masked coating film to light,(c) subjecting the intermediate product to developing to leave a frame-shaped coating film, and(d) subjecting the resulting substrate formed through steps (a) to (c) to electro-deposition to form electro-deposition coating films on the electrically conductive circuits, enables production of coating films of fine pattern with improved precision.

Abstract: According to this invention, a printed board connector includes a first connector, a second connector, and a third connector. The first connector is mounted on an upper surface of an edge portion of a printed board and constituted by a first housing and a first contact. The second connector is mounted on a lower surface of the edge portion of the printed board at an opposite position of the first connector with respect to the printed board and constituted by a second housing and a second contact. The third connector is constituted by a third contact formed on one of the upper and lower surfaces of the edge portion of the printed board by a conductive metal layer and a third housing formed by opposite side surfaces of the first and second housings.

Abstract: A coaxial pin array connector comprises a top member having guide holes corresponding to coaxial cables, and an intermediate, conductive member having throughholes, respectively corresponding to and aligned with the guide holes. A bottom, insulative member is provided having first throughholes for admitting signal pins of a circuit board and second throughholes for admitting grounding pins of the circuit board and recesses for receiving power pins of the circuit board. Conductive cylindrical hollow structures are respectively positioned in the throughholes of the intermediate member and extend between the top and bottom members to allow the coaxial cable pins to be admitted from the guide holes to the bottom member and make electrical contact with the signal pins.

Abstract: Disclosed is a connector for integrated circuit packages. The connector generally includes a cover assembly having a metal framework for fixedly securing the integrated circuit package without projecting pin elements of the package from the backside of the cover assembly in order to prevent the pin element from the damage and a socket assembly for mounting contact elements to connect with the pin elements. The framework is hinged to the cover assembly at one of the side edges thereof. The cover assembly can be combined with the socket assembly by means of the first engage portion of the cover assembly and the second engage portion of the socket assembly at the side edge opposed to the hinged side edge. After combination the hinged side edge of the cover assembly can be pressed against the socket assembly so as to connect the pin elements with the corresponding contact elements from the side edge having the engage portion towards the hinged side edge of the socket assembly one by one.

Abstract: In an IC socket in which contactors are disposed along the inner wall surface of an insulating housing chamber into which a leg portion of an insulating cover is inserted, each contactor has one end portion bent in the direction of insertion of the leg portion to form a folded-back portion and has lugs which project out from both marginal edges of the contactor near the bent portion. In the inner wall surface of the chamber there are formed engaging recesses corresponding to the contactors. Each contactor is fixedly disposed with its bent portion held in contact with the inner wall surface of the chamber and with the lugs engaged with the engaging recesses in the inner wall surface of the chamber.

Abstract: An arrangement for removable connection between substrates including a first and a second substrate and a first connector mounted on the first substrate and a second connector mounted on an edge portion of the second substrate. The second connector is adapted to be engaged with the first connector. The arrangement also includes a third connector mounted on the first substrate with the third connector having first and second contacts. A third contact is provided in the vicinity of the edge portion of the second substrate and is adapted to contact the first contact of the third connector during an initial stage of an engaging process of the first and the second connectors and to contact the second contact of the third connector after the initial stage.

Abstract: A liquid cooling module comprises a substrate on which heat generating components to be cooled are mounted, a thermally conductive member secured to the substrate enclosing the heat generating components and a liquid cooling member having a chamber in which liquid is flowed. The thermally conductive member has a pair of two-motion coupling members one on each side thereof and the liquid cooling member has a pair of two-motion coupling members respectively engageable with the two-motion coupling members of the thermally conductive member when they are moved toward each other in a first direction and subsequently moved in a second direction with respect to each other normal to the first direction. An array of thermally conductive, springy contact elements are arranged between the thermally conductive member and the liquid cooling member.