Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

Abstract: An imaging unit includes: a flexible substrate including one end connected to a light receiving surface of a solid state image sensor, the flexible substrate extending to a surface side opposite to the light receiving surface; a multi-layer substrate connected to a surface of the flexible substrate, the surface of the flexible substrate being a surface to which the solid state image sensor is connected, the multi-layer substrate including a plurality of electronic components mounted thereon; and a connection layer configured to electrically and mechanically connect to connection members provided on the surface of the flexible substrate and a surface of the multi-layer substrate facing the surface of the flexible substrate.

Abstract: An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

Abstract: A device includes: a package having a bottom and a side wall surrounding the bottom; an element adhered to the bottom of the package; an internal contact formed inside the package; a resin encapsulation material with which a space between the package and the element is filled; and a coating formed to cover an end surface of the internal contact near the element, and made of a material whose thermal expansion coefficient is greater than or equal to the thermal expansion coefficient of the package and less than the thermal expansion coefficient of the resin encapsulation material.

Abstract: An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

Abstract: One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.

Abstract: An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

Abstract: An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

Abstract: An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

Abstract: An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.

Abstract: A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.

Abstract: A device includes: a package having a bottom and a side wall surrounding the bottom; an element adhered to the bottom of the package; an internal contact formed inside the package; a resin encapsulation material with which a space between the package and the element is filled; and a coating formed to cover an end surface of the internal contact near the element, and made of a material whose thermal expansion coefficient is greater than or equal to the thermal expansion coefficient of the package and less than the thermal expansion coefficient of the resin encapsulation material.

Abstract: An optical device includes the following structures. An optical element includes a light-receiving element at an upper surface of the optical element. A transparent member is disposed on the upper surface to cover the light-receiving element. A case includes a bottom wall, a side wall protruding from an outer edge of the bottom wall, and a through-hole penetrating the bottom wall. A sealant is filled in a space defined by surfaces of the optical element, the transparent member, and the case, and also in the through-hole. Here, the optical element and the transparent member are stored in a region between the bottom wall and the side wall. The sealant is filled to the region to seal the space. The bottom wall is segmented into: a center region in which the optical element is placed; and a peripheral region outside the center region. The through-hole is arranged in the peripheral region.

Abstract: An optical device including: an optical element including a light-receiving unit as a part of a top surface; a transparent member deposited on the optical element to cover the light-receiving unit; and a sealant formed to seal around the transparent member. The transparent member includes: a first protrusion formed in an upper region of a side surface of the transparent member such that a step is created on the side surface; and a tapered surface on an end surface of the first protrusion, the tapered surface being sloped such that a to cross-sectional area of the transparent member decreases towards an upper side of the transparent member. The sealant covers entirely at least a part of the side surface of the transparent member, the part of the side surface being located below the first protrusion.

Abstract: In a package including a base fixed with a solid image pickup element, a side wall rising up along the periphery of the base, and internal terminals arranged on a step of the side wall, a plurality of recesses are formed at certain intervals in a lower part of the step to prevent bleeding of an adhesive fixing the solid image pickup element from creeping up over the internal terminals. When the adhesive and bleeding thereof spread around the solid image pickup element during die bonding, they flow into the recesses, making even fast-flowing bleeding hardly creep up an inner surface of the side wall including the step, and enabling prevention of the adhesive from adhering to the internal terminal. Strength, questioned by the presence of the recesses upon wire bonding, can be secured by residual parts between the recesses, and defective wire bonding is less likely to occur.

Abstract: An optical semiconductor device of the present invention includes a semiconductor chip (11) having an optical element (12) formed on a surface of the semiconductor chip; and a transparent member (13) directly secured on the semiconductor chip (11) with a transparent adhesive (25) so as to cover the optical element (12). The transparent member (13) has a surface opposed to the semiconductor chip (11) and at least one edge line of the surface has one of a chamfered portion (14) and a rounded portion.

Abstract: Side terminals 3 at respective corners of a package are higher than side terminals 4 on each side of the package. Thus, even if the side terminals 4 on each side are lower than those according to the conventional art owing to miniaturization or the like, when a device is mounted on a mounting substrate by soldering, a solder fillet 11 of a sufficient size can be formed between each of the corner side terminals 3, which significantly affect reliability, and a corresponding terminal on the mounting substrate. Thus, the device can be more reliably mounted on the mounting substrate by soldering.

Abstract: An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

Abstract: An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.