Abstract: Side terminals 3 at respective corners of a package are higher than side terminals 4 on each side of the package. Thus, even if the side terminals 4 on each side are lower than those according to the conventional art owing to miniaturization or the like, when a device is mounted on a mounting substrate by soldering, a solder fillet 11 of a sufficient size can be formed between each of the corner side terminals 3, which significantly affect reliability, and a corresponding terminal on the mounting substrate. Thus, the device can be more reliably mounted on the mounting substrate by soldering.

Abstract: An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.

Abstract: An optical device includes an optical element and a transparent element. The optical element includes an image pickup region provided on a main surface of a semiconductor substrate for outputting a signal according to incident light, a peripheral circuit region provided around the image pickup region for transmitting a signal received from the image pickup region, and an electrode pad provided on a part of an edge of the main surface of the semiconductor substrate for outputting a signal transmitted through the peripheral circuit region. The transparent member is bonded to the semiconductor substrate so that the transparent member covers the image pickup region and that an end face of the transparent member is located between the electrode pad and the image pickup region when viewed two-dimensionally. The transparent member is positioned so that a distance between the end face and the image pickup region is 0.04 mm or more.

Abstract: An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

Abstract: In an optical device in accordance with the present invention, a transparent member (5) covering a light receiving portion (2) on a top surface of an optical element (3) is composed of a base material (8) secured on the top surface of the optical element (3), and a resin portion (9) forming a fillet between each outer side surface of the base material (8) and the top surface of the optical element (3). The base material (8) and the resin portion (9) are optically integrated together. Each outer peripheral surface of the transparent member (S) constitutes an inclined surface (7).

Abstract: A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.

Abstract: One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.

Abstract: An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

Abstract: A package for an optical device includes a plurality of ceramic layers 101, 102 and 103 stacked on a base 2 and a recessed portion 18 formed to mount an optical element at the center. Reversely rounded portions 11 are formed on the corners of the ceramic layers 100, 101 and 102 such that at least one of the four corners of the top ceramic layer 103 has an outside shape placed outside the outside shapes of the corners of the ceramic layers 100, 101 and 102 with respect to the center.

Abstract: In a package including a base fixed with a solid image pickup element, a side wall rising up along the periphery of the base, and internal terminals arranged on a step of the side wall, a plurality of recesses are formed at certain intervals in a lower part of the step to prevent bleeding of an adhesive fixing the solid image pickup element from creeping up over the internal terminals. When the adhesive and bleeding thereof spread around the solid image pickup element during die bonding, they flow into the recesses, making even fast-flowing bleeding hardly creep up an inner surface of the side wall including the step, and enabling prevention of the adhesive from adhering to the internal terminal. Strength, questioned by the presence of the recesses upon wire bonding, can be secured by residual parts between the recesses, and defective wire bonding is less likely to occur.