Abstract: An air compressor comprising: a tank (50), a compression mechanism (30), a motor (5) and a control circuit (7). The control circuit (7) includes a CPU (70) and a storing unit (74) which stores a control program, the compressor operation history and a plurality of operation modes. Each of the operation modes is defined by two setting values: a reference restart pressure value and a motor rotational speed value, at least one of these values being different from among the plurality of modes. The control circuit (7) executes one of the plurality of modes as a target mode in which the control unit controls the motor to restart by comparing the pressure in the tank with the reference restart pressure and rotates the motor at the rotational speed of the target mode. The control circuit changes the target mode from the one of the plurality of modes to another one of the plurality of modes based on the compressor operation history.

Abstract: An antenna device, capable of stable communications without increasing a space of the entire device by keeping a resonance frequency substantially constant even if the temperature changes, includes: an antenna circuit having an antenna coil with an electrically connected capacitor; the coil receiving a magnetic field transmitted from a reader/writer at a predetermined oscillation frequency; the circuit becoming communicable when inductively coupled to the reader/writer; and a magnetic sheet formed at a position superposed on the coil to change its inductance, wherein the coil has a temperature characteristic in which the inductance is changed with a temperature change, and the sheet has a temperature characteristic of changing the inductance to achieve a characteristic inverse to the inductance change with the temperature change in a predetermined use temperature range, and substantially matching a resonance frequency of the circuit with the oscillation frequency in the use temperature region.

Abstract: An air compressor includes a motor, an air compression mechanism driven by the motor, a rotation shaft rotatable integrally with a rotor of the motor, a fan rotatable integrally with the rotation shaft, a plurality of air tanks for reserving compressed air generated by the air compression mechanism, and a control unit for controlling the motor. The plurality of air tanks are juxtaposed with each other and arrayed in an array direction. The plurality of air tanks includes an endmost air tank and an adjacent air tank adjacent to the endmost air tank. The control unit is disposed adjacent to and opposite to the adjacent air tank relative to the endmost air tank. The control unit is disposed adjacent to and in confrontation with an outer circumference of the fan.

Abstract: An air compressor comprising: a tank (50), a compression mechanism (30), a motor (5) and a control circuit (7). The control circuit (7) includes a CPU (70) and a storing unit (74) which stores a control program, the compressor operation history and a plurality of operation modes. Each of the operation modes is defined by two setting values: a reference restart pressure value and a motor rotational speed value, at least one of these values being different from among the plurality of modes. The control circuit (7) executes one of the plurality of modes as a target mode in which the control unit controls the motor to restart by comparing the pressure in the tank with the reference restart pressure and rotates the motor at the rotational speed of the target mode. The control circuit changes the target mode from the one of the plurality of modes to another one of the plurality of modes based on the compressor operation history.

Abstract: A through-substrate via (TSV)-MEMS combination includes a TSV die including a substrate and a plurality of TSVs which extend of a full thickness of the substrate. The TSV die includes a top side surface including circuitry and top side bonding pads thereon, a bottom side surface including bottom side bonding features thereon, and a through-hole through the full thickness of the substrate. A microelectromechanical systems (MEMS) die having a floating sensing structure including solder balls thereon is bound to the top side bonding pads or bottom side bonding features of the TSV die. A layer of adhesive material is surrounding the solder balls, which can provide a sealant ring for the TSV-MEMS bonds.

Abstract: An object of the present invention is to provide a dust collecting cover for a grinding cup wheel having both excellent practicality and versatility. A base plate is joined to a body of the dust collecting cover via elastic bodies at a plurality of positions, an adapter for joining an angle grinder is attachably/detachably provided on the base plate, and a portion of the body cover is formed as a sub-cover openable/closable utilizing a magnetic force of a magnet, and the sub-cover is configured to be fastenable to the body cover by a screw inserted via a through hole provided in the magnet into a female screw part provided on the body cover side.

Abstract: An antenna device, capable of stable communications without increasing a space of the entire device by keeping a resonance frequency substantially constant even if the temperature changes, includes: an antenna circuit having an antenna coil with an electrically connected capacitor; the coil receiving a magnetic field transmitted from a reader/writer at a predetermined oscillation frequency; the circuit becoming communicable when inductively coupled to the reader/writer; and a magnetic sheet formed at a position superposed on the coil to change its inductance, wherein the coil has a temperature characteristic in which the inductance is changed with a temperature change, and the sheet has a temperature characteristic of changing the inductance to achieve a characteristic inverse to the inductance change with the temperature change in a predetermined use temperature range, and substantially matching a resonance frequency of the circuit with the oscillation frequency in the use temperature region.

Abstract: A method for forming a semiconductor device can include providing a patterned layer of mold compound having a plurality of individual mold compound structures overlying a base film. The plurality of mold compound structures are aligned with a plurality of semiconductor dice to interpose the individual mold compound structures between the plurality of semiconductor dice. A pressure is applied to the individual mold compound structures to fill spaces between each of the plurality of semiconductor dice with the mold compound. The mold compound structures can be formed on the base film using a photosensitive mold compound. The mold compound structures can also be formed through the use of a patterned mask and a screen printing process.

Abstract: An antenna for receiving electromagnetic waves in a desired frequency band, includes a radiating conductor and a ground conductor, a feeder part, a wavelength-shortening section, and a magnetic field applying section. The radiating conductor and a ground conductor resonate at a resonance point frequency. The feeder part is configured to feed the radiating conductor with electricity. The wavelength-shortening section in which a magnetic body having both a dielectric property and a magnetic property is disposed close to the radiating conductor shifts the resonance point frequency into a band lower than the desired frequency band by a wavelength-shortening effect obtained based on the dielectric property and the magnetic property. The magnetic field applying section is configured to apply a magnetic field to the magnetic body so as to reduce a magnetic loss due to the magnetic body.

Abstract: The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.

Abstract: An air compressor includes a motor, an air compression mechanism driven by the motor, a rotation shaft rotatable integrally with a rotor of the motor, a fan rotatable integrally with the rotation shaft, a plurality of air tanks for reserving compressed air generated by the air compression mechanism, and a control unit for controlling the motor. The plurality of air tanks are juxtaposed with each other and arrayed in an array direction. The plurality of air tanks includes an endmost air tank and an adjacent air tank adjacent to the endmost air tank. The control unit is disposed adjacent to and opposite to the adjacent air tank relative to the endmost air tank. The control unit is disposed adjacent to and in confrontation with an outer circumference of the fan.

Abstract: A method for forming electronic assemblies includes providing a plurality of IC die each having IC bonding conductors and a workpiece having workpiece bonding conductors. A curable dielectric film is applied to the IC bonding conductors or the workpiece surface. The plurality of IC die are placed on the workpiece surface so that the plurality of IC bonding conductors are aligned to and face the plurality of workpiece bonding conductors to provide a first bonding. The placing is performed at a vacuum level corresponding to a pressure <1 kPa, and at a temperature sufficient to provide tackiness to the curable dielectric film. The plurality of IC die are then pressed to provide a second bonding. A temperature during pressing cures the curable dielectric film to provide an underfill and forms metallic joints between the plurality of IC bonding conductors and the plurality of workpiece bonding conductors.

Abstract: Provided is a massager which enables armrests to be used effectively even with a backrest in a reclined state. The massager includes: a backrest having a massaging mechanism for massaging the back of a user; a frame which supports the backrest in such a manner that the backrest can be reclined backwards; a pair of armrests which extend forward respectively from left and right side positions of the backrest; and a linking mechanism which changes an attitude of the pair of armrests in conjunction with a reclining operation of the backrest, in such a manner that a rear part of each armrest falls lower than the front part of each armrest, when the backrest is reclined backward.

Abstract: A massager in which a backrest and side walls holding massage members have a unified form, is provided. The massager has: a backrest including, in an integrated fashion, a backrest section in which a massage mechanism for massaging a user's back is provided, and a pair of projecting sections which project to the left and right-hand sides from at least the upper part of the backrest section; side walls which respectively project forwards from front surfaces of the pair of projecting sections; and air bags which are provided respectively on inner side faces of the pair of side walls and used for massaging the sides of the user leaning against the backrest section.

Abstract: An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer substrate has bottom metal land pads and top metal land pads, interposer vias, and an open receptacle region formed through the interposer substrate. The substrate top surface is positioned relative to the interposer so that the molded IC die is within the open receptacle region to align the bottom metal land pads and substrate contact pads. An underfill layer is between the substrate top surface and the bottom side of the interposer substrate. A step height from the mold cap height minus a height of the top metal land pads is generally from 0 to 0.2 mm.

Abstract: A massage chair includes a main frame, a seat, and a backrest. The main frame includes a back frame configured to support the backrest and a base frame configured to support the seat. The base frame is formed by combining a plurality of structural members. The plurality of structural members are arranged on positions corresponding to edges of a hexahedron. Part of the back frame serves as part of the structural members of the base frame.

Abstract: An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer substrate has bottom metal land pads and top metal land pads, interposer vias, and an open receptacle region formed through the interposer substrate. The substrate top surface is positioned relative to the interposer so that the molded IC die is within the open receptacle region to align the bottom metal land pads and substrate contact pads. An underfill layer is between the substrate top surface and the bottom side of the interposer substrate. A step height from the mold cap height minus a height of the top metal land pads is generally from 0 to 0.2 mm.

Abstract: A massage chair includes a seat, a backrest and a front cover. The front cover is shaped to cover the front face of the backrest and the top face of the seat. The upper and lower ends of the front cover are detachably attached to the upper part of the backrest and the front part of the seat through upper and lower attachments, respectively. The left and right ends of the front cover are detachably attached only to the left and right ends of the seat through left and right attachments, respectively. The attachment positions of the left and right ends of the front cover correspond to positions of the left and right ends of the seat, respectively.

Abstract: An object of the present invention is to provide a dust collecting cover for a grinding cup wheel having both excellent practicality and versatility. A base plate is joined to a body of the dust collecting cover via elastic bodies at a plurality of positions, an adapter for joining an angle grinder is attachably/detachably provided on the base plate, and a portion of the body cover is formed as a sub-cover openable/closable utilizing a magnetic force of a magnet, and the sub-cover is configured to be fastenable to the body cover by a screw inserted via a through hole provided in the magnet into a female screw part provided on the body cover side.

Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.