Abstract: A printed wiring board on which a pattern can be formed favorably by printing and soldering even where a small part of the 1005 size or less is mounted. The printed wiring board includes a substrate; a pair of soldering lands on the substrate, the soldering lands being spaced from one another with a first side of one land opposing a first side of another land; and a mounted part having a pair of electrodes on opposite ends thereof soldered to the respective lands. A wiring line is connected to each soldering land, and an insulating element overlies the wiring lines. The insulating element has openings formed so as to expose the soldering lands therethrough. Wiring line connection elements are individually connected to only the first sides of the lands. Each insulating element opening has an edge positioned outside of the corresponding land and on the inner side of the corresponding wiring line connection element.

Abstract: An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at least a portion of the terminal region. The conductive paste has an oxidation-reduced region thereon, formed by application of an acid to the conductive paste. An oxidation-prevention layer is formed on the oxidation-reduced region by deposition of a flux on the oxidation-reduced region, application of a solder to the flux, and blowing of a heated gas by the solder. The oxidation-prevention layer is adapted to bond the electrode associated with the electronic element to the conductive paste by soldering, when the electrode is present in the electrode region.

Abstract: An organic electroluminescent (EL) display, wherein fabrication is simplified, manufacturing cost is reduced, periodicity with which pixels are arrayed is maintained, picture quality is prevented from deteriorating due to a boundary between transparent substrates, and high resolution is realized. A plurality of organic thin film EL display elements are formed on a single transparent substrate. Circuit substrates on which driver circuits for supplying signals to signal and scanning electrodes for each of the EL display elements are mounted are bonded to the EL display elements. The circuit substrate has an end-sealing property and through holes are bored opposite the signal and scanning electrodes. The through holes are covered by a conductive, end-sealing material. Signals are supplied from the driver circuit to the signal and scanning electrodes through the conductive material. A portion of the organic EL display element that is not bonded to the circuit substrate is covered by an end-sealing material.

Abstract: An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at least a portion of the terminal region. The conductive paste has an oxidation-reduced region thereon, formed by application of an acid to the conductive paste. An oxidation-prevention layer is formed on the oxidation-reduced region by deposition of a flux on the oxidation-reduced region, application of a solder to the flux, and blowing of a heated gas by the solder. The oxidation-prevention layer is adapted to bond the electrode associated with the electronic element to the conductive paste by soldering, when the electrode is present in the electrode region.

Abstract: An organic EL display with a big screen can be realized, a fabrication work can be simplified, a manufacturing cost can be reduced, a periodicity with which pixels are arrayed on the whole of the screen can be maintained after the manufacturing, a picture quality can be prevented from being deteriorated due to a boundary between transparent substrates and high resolution can be realized. A plurality of organic thin-film EL elements (2) are formed on a single transparent substrate (1). Circuit substrates (5) in which driver circuits (6) for supply signals to signal electrodes and scanning electrodes of the elements (2) are mounted are closely bonded to the respective elements (2). The circuit substrate (5) is made of a material having end-sealing property and has through-holes bored at its positions opposing to the signal electrode and the scanning electrode. The through-holes are buried by a material having end-sealing property and conductivity.

Abstract: An organic EL display, wherein fabrication is simplified, manufacturing cost is reduced, periodicity with which pixels are arrayed is maintained, picture quality is prevented from deteriorating due to a boundary between transparent substrates, and high resolution is realized. A plurality of organic thin-film EL elements (2) are formed on a single transparent substrate (1). Circuit substrates (5) in which driver circuits (6) for supplying signals to signal and scanning electrodes of the elements (2) are mounted are bonded to the elements (2). The circuit substrate has an end-sealing property and through-holes bored opposite the signal and scanning electrodes. The through-holes are covered by a conductive, end-sealing material. Signals are supplied from the driver circuit (6) to the signal and scanning electrodes through the conductive material. A portion of the organic EL element which is not bonded to the circuit substrate is covered by an end-sealing material.

Abstract: Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands normally occurs to obtain a copper-plated through-hole in both sides of a printed wiring board using a paper-phenol substrate, wherein adhesion strength between the copper foil lands and the copper paste is enhanced.

Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.

Abstract: The invention is directed to a chip size package (“CSP”) configuration and method for arranging a CSP configuration which is simple to manufacture, and less costly. The invention includes a structure for a printed circuit board (“PCB”), having at least a single pad for a chip size package (“CSP”) which is square shape. The CSP pad then is rotated 45 degrees in a clockwise or counter clockwise direction from a perpendicular so as to form a diamond shape. Also included is at least a via having a circle shape and wherein the distance between an inner side of the rotated CSP pad, where the inner side is the side closest to the via, and the outer edge of the via is at least 0.1 mm.

Abstract: An optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and to provide a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.

Abstract: A printed wiring board in which control of a characteristic impedance of a signal transmission pattern is realized. The printed wiring board includes a flat plate base material, a signal transmission pattern provided on at least one surface of the base material for transmitting a high frequency signal, an insulator layer formed with a constant thickness to cover the signal transmission pattern, and a grounded control unit provided on the insulator layer opposing the signal transmission pattern for controlling a characteristic impedance of the signal transmission pattern.

Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.

Abstract: Copper foil lands provided with a through-hole to be filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands would hitherto easily occur, whereby a copper plated-through hole both side printed wiring board using a paper-phenol substrate is obtained in which adhesion strength between the copper foil lands and the copper paste has been enhanced.

Abstract: Disclosed is an optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and to provide a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.

Abstract: An optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.

Abstract: The present invention provides an organic thin film EL which can reduce a non-display area when using a plurality of display panels as a single screen, and can prevent a generation of migration. In a flat display device (50) laminating a display material and electrodes (52) and (57), a driver circuit connected to these electrodes (52) and (57) is arranged inside a sealing member (30) covering a back surface of the flat display device (50), and wirings (31) and (70) for connecting a power supply circuit and a signal supply circuit to the driver circuit are led from the inside of the sealing member (30) to the back side of the flat display device (50).

Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for finning the copper paste, is provided.

Abstract: There is provided a printed wiring board in which control of a characteristic impedance of a signal transmission pattern is realized with a small space and at a low cost, its manufacture is easy, a delay is hard to cause, and a high frequency signal can be stably transmitted. The printed wiring board includes a flat plate base material, a signal transmission pattern provided on at least one surface of the base material, for transmitting a high frequency signal, an insulator layer formed to a constant thickness so as to cover the signal transmission pattern, and a control unit provided on the insulator layer so as to be opposite to the signal transmission pattern and to be grounded, for controlling a characteristic impedance of the signal transmission pattern.

Abstract: Disclosed herein are a video display and a manufacturing method therefor, more particularly, there is provided a video display including a display panel having a plurality of anodes and cathodes arranged orthogonally to each other so as to form grids, a printed wiring board having a drive circuit with wirings for driving the display panel and a plurality of bumps for electrically connecting the wirings of the drive circuit to the anodes and the cathodes, and an adhesive layer for bonding the display panel and the printed wiring board to form a multilevel structure. With this structure, a large-sized video image with no discontinuities can be displayed, and the thickness of the video display can also be reduced.

Abstract: Disclosed is an optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and to provide a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.