Patents by Inventor Yoshinari Matsuda

Yoshinari Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020039872
    Abstract: Disclosed is an optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and to provide a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.
    Type: Application
    Filed: October 26, 2001
    Publication date: April 4, 2002
    Inventors: Nobutoshi Asai, Yoshinari Matsuda, Ryota Odake
  • Publication number: 20020011784
    Abstract: An organic EL display with a big screen can be realized, a fabrication work can be simplified, a manufacturing cost can be reduced, a periodicity with which pixels are arrayed on the whole of the screen can be maintained after the manufacturing, a picture quality can be prevented from being deteriorated due to a boundary between transparent substrates and high resolution can be realized. A plurality of organic thin-film EL elements (2) are formed on a single transparent substrate (1). Circuit substrates (5) in which driver circuits (6) for supply signals to signal electrodes and scanning electrodes of the elements (2) are mounted are closely bonded to the respective elements (2). The circuit substrate (5) is made of a material having end-sealing property and has through-holes bored at its positions opposing to the signal electrode and the scanning electrode. The through-holes are buried by a material having end-sealing property and conductivity.
    Type: Application
    Filed: April 10, 2001
    Publication date: January 31, 2002
    Inventors: Yoshio Suzuki, Yoshinari Matsuda