Patents by Inventor Yoshinori Ejiri

Yoshinori Ejiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180342478
    Abstract: Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
    Type: Application
    Filed: September 7, 2016
    Publication date: November 29, 2018
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
  • Publication number: 20180250751
    Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and micro copper particles having a volume-average particle size of 2 ?m to 50 ?m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 6, 2018
    Inventors: Yuki KAWANA, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Hideo NAKAKO, Chie SUGAMA, Dai ISHIKAWA
  • Publication number: 20180021708
    Abstract: A biomolecule capturing filter, comprising a gold plating on the surface of a biomolecule capturing filter made of a metal other than gold, the gold plating being electroless gold plating is disclosed.
    Type: Application
    Filed: September 29, 2017
    Publication date: January 25, 2018
    Inventors: Kenji Takai, Satomi Yagi, Takahiro Suzuki, Yoshinori Ejiri, Hiroshi Yamamoto, Akio Takahashi
  • Patent number: 9457406
    Abstract: Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: October 4, 2016
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Katsuyuki Masuda, Yoshinori Ejiri, Maki Inada, Kyoko Kuroda
  • Patent number: 8997341
    Abstract: It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings.
    Type: Grant
    Filed: September 6, 2010
    Date of Patent: April 7, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshinori Ejiri, Kiyoshi Hasegawa, Takehisa Sakurai, Yoshiaki Tsubomatsu
  • Publication number: 20140299539
    Abstract: A biomolecule capturing filter, comprising a gold plating on the surface of a biomolecule capturing filter made of a metal other than gold, the gold plating being electroless gold plating is disclosed.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 9, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kenji TAKAI, Satomi YAGI, Takahiro SUZUKI, Yoshinori EJIRI, Hiroshi YAMAMOTO, Akio TAKAHASHI
  • Patent number: 8801971
    Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: August 12, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri, Katsuyuki Masuda
  • Publication number: 20130295276
    Abstract: There is provided a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used, but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained. The method includes the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 7, 2013
    Inventors: Hideo NAKAKO, Kazunori YAMAMOTO, Youichi MACHII, Yasushi KUMASHIRO, Shunya YOKOZAWA, Yoshinori EJIRI, Katsuyuki MASUDA
  • Patent number: 8426742
    Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: April 23, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshinori Ejiri, Shuichi Hatakeyama, Shigeharu Arike, Kiyoshi Hasegawa
  • Publication number: 20120234584
    Abstract: It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings.
    Type: Application
    Filed: September 6, 2010
    Publication date: September 20, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshinori Ejiri, Kiyoshi Hasegawa, Takehisa Sakurai, Yoshiaki Tsubomatsu
  • Publication number: 20120175147
    Abstract: Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
    Type: Application
    Filed: September 13, 2010
    Publication date: July 12, 2012
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Katsuyuki Masuda, Yoshinori Ejiri, Maki Inada, Kyoko Kuroda
  • Publication number: 20120170241
    Abstract: Disclosed is a printing ink comprising Cu- and/or CuO-containing metal nanoparticles, which obtains excellent dispersion properties and successive dispersion stability without using additives such as dispersing agents. Specifically disclosed is a printing ink that comprises Cu- and/or CuO-containing metal nanoparticles and has no more than 2,600 ppm of ionic impurities in the total solid content. The printing ink is obtained by dispersing the Cu- and/or CuO-containing metal nanoparticles, which have no more than 2,600 ppm of ionic impurities in the total solid content, in a dispersion medium.
    Type: Application
    Filed: September 13, 2010
    Publication date: July 5, 2012
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Yoshinori Ejiri, Katsuyuki Masuda, Kyoko Kuroda, Maki Inada
  • Publication number: 20120125659
    Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.
    Type: Application
    Filed: December 17, 2008
    Publication date: May 24, 2012
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri, Katsuyuki Masuda
  • Publication number: 20120104333
    Abstract: [Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle (5) comprises: a composite conductive particle (3) that has a resin particle (4) and a metal layer (6) that covers the resin particle (4); and insulating fine particles (1) that are provided on the outer side of the metal layer (6) so as to partially cover the surface of the metal layer (6). The metal layer (6) has a nickel-palladium alloy plating layer (6a).
    Type: Application
    Filed: July 1, 2010
    Publication date: May 3, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kenji Takai, Yoshinori Ejiri, Yuuko Nagahara, Mitsuharu Matsuzawa
  • Publication number: 20100233011
    Abstract: There are provided are a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained; and a copper oxide particle dispersed slurry used therein. The method is a method for forming a copper wiring pattern including the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.
    Type: Application
    Filed: October 20, 2008
    Publication date: September 16, 2010
    Inventors: Hideo Nakako, Kazunori Yamamoto, Youichi Machii, Yasushi Kumashiro, Shunya Yokozawa, Yoshinori Ejiri, Katsuyuki Masuda
  • Publication number: 20100071940
    Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.
    Type: Application
    Filed: April 23, 2008
    Publication date: March 25, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshinori Ejiri, Shuichi Hatakeyama, Shigeharu Arike, Kiyoshi Hasegawa