Patents by Inventor Yoshinori Hirobe
Yoshinori Hirobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11511301Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: November 18, 2020Date of Patent: November 29, 2022Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20210214843Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.Type: ApplicationFiled: December 15, 2020Publication date: July 15, 2021Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yasuko SONE, Hiroshi KAWASAKI, Yoshinori HIROBE, Katsunari OBATA, Asako NARITA, Hitoshi ISHIRO, Chiaki HATSUTA
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Publication number: 20210207258Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: ApplicationFiled: March 19, 2021Publication date: July 8, 2021Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsunari OBATA, Toshihiko TAKEDA, Hiroshi KAWASAKI, Hiroyuki NISHIMURA, Atsushi MAKI, Hiromitsu OCHIAI, Yoshinori HIROBE
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Publication number: 20210156020Abstract: In a method for forming a vapor deposition pattern using a vapor deposition mask provided with a plurality of openings corresponding to a pattern that is produced by vapor deposition, and forming a vapor deposition pattern in a vapor deposition target, the method includes a close contact step of disposing the vapor deposition mask on one surface side of the vapor deposition target, disposing a pressing member and a magnetic plate in layer in this order on the other surface side of the vapor deposition target, and bringing the vapor deposition target and the vapor deposition mask into close contact with each other by using magnetism of the magnetic plate, and a vapor deposition pattern forming step of causing a vapor deposition material released from a vapor deposition source to adhere to the vapor deposition target through openings after the close contact step, and forming the vapor deposition pattern in the vapor deposition target.Type: ApplicationFiled: February 5, 2021Publication date: May 27, 2021Applicant: Dai Nippon Printing Co., Ltd.Inventors: Toshihiko TAKEDA, Yoshinori HIROBE, Yoshiko MIYADERA, Katsunari OBATA, Naoto YAMADA
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Patent number: 10982317Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: GrantFiled: February 11, 2020Date of Patent: April 20, 2021Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsunari Obata, Toshihiko Takeda, Hiroshi Kawasaki, Hiroyuki Nishimura, Atsushi Maki, Hiromitsu Ochiai, Yoshinori Hirobe
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Patent number: 10947616Abstract: In a method for forming a vapor deposition pattern using a vapor deposition mask provided with a plurality of openings corresponding to a pattern that is produced by vapor deposition, and forming a vapor deposition pattern in a vapor deposition target, the method includes a close contact step of disposing the vapor deposition mask on one surface side of the vapor deposition target, disposing a pressing member and a magnetic plate in layer in this order on the other surface side of the vapor deposition target, and bringing the vapor deposition target and the vapor deposition mask into close contact with each other by using magnetism of the magnetic plate, and a vapor deposition pattern forming step of causing a vapor deposition material released from a vapor deposition source to adhere to the vapor deposition target through openings after the close contact step, and forming the vapor deposition pattern in the vapor deposition target.Type: GrantFiled: April 15, 2016Date of Patent: March 16, 2021Assignee: Dai Nippon Printing Co., Ltd.Inventors: Toshihiko Takeda, Yoshinori Hirobe, Yoshiko Miyadera, Katsunari Obata, Naoto Yamada
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Publication number: 20210069739Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: November 18, 2020Publication date: March 11, 2021Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
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Patent number: 10895008Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.Type: GrantFiled: March 30, 2018Date of Patent: January 19, 2021Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yasuko Sone, Hiroshi Kawasaki, Yoshinori Hirobe, Katsunari Obata, Asako Narita, Hitoshi Ishiro, Chiaki Hatsuta
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Patent number: 10894267Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: July 9, 2019Date of Patent: January 19, 2021Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20210013415Abstract: To provide a vapor deposition mask in which a metal layer is provided on a resin mask, in which the resin mask has an opening required to form a vapor deposition pattern, the resin mask contains a resin material, the metal layer contains a metal material, and provided that a glass transition temperature (Tg) of the resin material plus 100° C. is an upper limit temperature, in a linear expansion graph whose vertical axis indicates linear expansion rate and whose horizontal axis indicates temperature, an integrated value of a linear expansion curve for the resin mask over a range from a temperature of 25° C. to the upper limit temperature divided by an integrated value of a linear expansion curve for the metal layer over the range from the temperature of 25° C. to the upper limit temperature falls within a range from 0.55 to 1.45 inclusive.Type: ApplicationFiled: March 20, 2019Publication date: January 14, 2021Applicant: Dai Nippon Printing Co., Ltd.Inventors: Hiroshi KAWASAKI, Katsunari OBATA, Yasuko SONE, Yoshinori HIROBE
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Publication number: 20200395545Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: ApplicationFiled: August 28, 2020Publication date: December 17, 2020Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
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Publication number: 20200259090Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.Type: ApplicationFiled: March 30, 2018Publication date: August 13, 2020Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yasuko SONE, Hiroshi KAWASAKI, Yoshinori HIROBE, Katsunari OBATA, Asako NARITA, Hitoshi ISHIRO, Chiaki HATSUTA
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Publication number: 20200173011Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: ApplicationFiled: February 11, 2020Publication date: June 4, 2020Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsunari OBATA, Toshihiko TAKEDA, Hiroshi KAWASAKI, Hiroyuki NISHIMURA, Atsushi MAKI, Hiromitsu OCHIAI, Yoshinori HIROBE
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Patent number: 10597766Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: GrantFiled: March 24, 2014Date of Patent: March 24, 2020Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsunari Obata, Toshihiko Takeda, Hiroshi Kawasaki, Hiroyuki Nishimura, Atsushi Maki, Hiromitsu Ochiai, Yoshinori Hirobe
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Patent number: 10597768Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: GrantFiled: November 14, 2018Date of Patent: March 24, 2020Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsunari Obata, Toshihiko Takeda, Hiroshi Kawasaki, Hiroyuki Nishimura, Atsushi Maki, Hiromitsu Ochiai, Yoshinori Hirobe
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Publication number: 20190329277Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: July 9, 2019Publication date: October 31, 2019Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
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Publication number: 20190296240Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: ApplicationFiled: April 2, 2019Publication date: September 26, 2019Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATASUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
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Patent number: 10391511Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: November 8, 2018Date of Patent: August 27, 2019Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20190100835Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: ApplicationFiled: November 14, 2018Publication date: April 4, 2019Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsunari OBATA, Toshihiko TAKEDA, Hiroshi KAWASAKI, Hiroyuki NISHIMURA, Atsushi MAKI, Hiromitsu OCHIAI, Yoshinori HIROBE
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Publication number: 20190070625Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: November 8, 2018Publication date: March 7, 2019Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI