Patents by Inventor Yoshinori Hirobe
Yoshinori Hirobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10189042Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: June 22, 2018Date of Patent: January 29, 2019Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Patent number: 10167544Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: GrantFiled: March 24, 2014Date of Patent: January 1, 2019Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsunari Obata, Toshihiko Takeda, Hiroshi Kawasaki, Hiroyuki Nishimura, Atsushi Maki, Hiromitsu Ochiai, Yoshinori Hirobe
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Patent number: 10160000Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: July 20, 2016Date of Patent: December 25, 2018Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20180318864Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: June 22, 2018Publication date: November 8, 2018Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
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Publication number: 20180148822Abstract: In a method for forming a vapor deposition pattern using a vapor deposition mask provided with a plurality of openings corresponding to a pattern that is produced by vapor deposition, and forming a vapor deposition pattern in a vapor deposition target, the method includes a close contact step of disposing the vapor deposition mask on one surface side of the vapor deposition target, disposing a pressing member and a magnetic plate in layer in this order on the other surface side of the vapor deposition target, and bringing the vapor deposition target and the vapor deposition mask into close contact with each other by using magnetism of the magnetic plate, and a vapor deposition pattern forming step of causing a vapor deposition material released from a vapor deposition source to adhere to the vapor deposition target through openings after the close contact step, and forming the vapor deposition pattern in the vapor deposition target.Type: ApplicationFiled: April 15, 2016Publication date: May 31, 2018Applicant: Dai Nippon Printing Co., Ltd.Inventors: Toshihiko TAKEDA, Yoshinori HIROBE, Yoshiko MIYADERA, Katsunari OBATA, Naoto YAMADA
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Publication number: 20170110662Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: ApplicationFiled: December 27, 2016Publication date: April 20, 2017Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
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Patent number: 9548453Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: GrantFiled: October 9, 2015Date of Patent: January 17, 2017Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura
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Patent number: 9527098Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.Type: GrantFiled: May 22, 2015Date of Patent: December 27, 2016Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20160325300Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: July 20, 2016Publication date: November 10, 2016Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
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Publication number: 20160163983Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: ApplicationFiled: October 9, 2015Publication date: June 9, 2016Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
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Patent number: 9343679Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: GrantFiled: January 11, 2013Date of Patent: May 17, 2016Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura
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Publication number: 20160047030Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.Type: ApplicationFiled: March 24, 2014Publication date: February 18, 2016Inventors: Katsunari OBATA, Toshihiko TAKEDA, Hiroshi KAWASAKI, Hiroyuki NISHIMURA, Atsushi MAKI, Hiromitsu OCHIAI, Yoshinori HIROBE
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Publication number: 20150251205Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.Type: ApplicationFiled: May 22, 2015Publication date: September 10, 2015Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
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Patent number: 9108216Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: January 11, 2013Date of Patent: August 18, 2015Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20150037928Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: January 11, 2013Publication date: February 5, 2015Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
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Publication number: 20150017759Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.Type: ApplicationFiled: January 11, 2013Publication date: January 15, 2015Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura
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Publication number: 20020038994Abstract: A shadow mask is formed with through holes in a predetermined arrangement or pattern. Each of the through holes has a rear surface side hole portion through which an electron beam enters and a front surface side hole portion through which the electron beam outgoes so as to form a beam spot having a predetermined shape on a surface to be irradiated. The front surface side hole portion of the through hole formed at a peripheral portion of the shadow mask has an opening hole area smaller than that of the front surface side hole portion of the through hole formed at a central portion thereof. The front surface side hole portion of the through hole formed at a peripheral portion of the shadow mask may have substantially an elliptical shape having an opening hole width in a direction normal to a virtual line extending from a center of the shadow mask, and the width is made smaller than that of the front surface side hole portion of the through hole formed at a central portion thereof.Type: ApplicationFiled: August 15, 2001Publication date: April 4, 2002Inventors: Yoshinori Hirobe, Takuya Ogio, Akira Makita