Patents by Inventor Yoshinori Matsuura

Yoshinori Matsuura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190261518
    Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 22, 2019
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori MATSUURA
  • Patent number: 10356915
    Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: July 16, 2019
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori Matsuura
  • Patent number: 10283728
    Abstract: There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time. The electrodeposited copper foil has a fraction of the areas occupied by the {100} plane deviating by 18° or less from the <001> crystal orientation of 10% or more determined by analysis of the surface by electron backscatter diffraction (EBSD) and at least one surface of the electrodeposited copper foil has a glossiness Gs (20°) of 1,500 or more, determined in accordance with JIS Z 8741-1997.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: May 7, 2019
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshinori Matsuura, Toshimi Nakamura, Masaharu Myoi, Hajime Watanabe
  • Publication number: 20190029125
    Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.
    Type: Application
    Filed: February 21, 2017
    Publication date: January 24, 2019
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori MATSUURA
  • Publication number: 20190013212
    Abstract: There is provided a copper foil provided with a carrier providing excellent chemical resistance against the copper flash etching solution during the formation of the wiring layer on the surface of the coreless support and excellent visibility of the wiring layer due to high contrast to the antireflective layer in image inspection after copper flash etching. The copper foil provided with a carrier comprises a carrier; a release layer provided on the carrier; an antireflective layer provided on the release layer and composed of at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo; and an extremely-thin copper layer provided on the antireflective layer; wherein at least the surface adjacent to the extremely-thin copper layer of the antireflective layer comprises an aggregate of metal particles.
    Type: Application
    Filed: February 21, 2017
    Publication date: January 10, 2019
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori MATSUURA
  • Publication number: 20180376602
    Abstract: There is provided a copper foil with a carrier particularly suitable for a circuit forming process for removing a carrier after laser drilling and desmear treatment, in detail, a copper foil with a carrier having high heat press resistance (heat resistance) of the carrier, laser drilling performance, corrosion resistance of the carrier against the desmear treatment, corrosion resistance of a release layer against the desmear treatment, and carrier release strength. The copper foil with a carrier comprises a carrier comprising at least one resin selected from polyethylene naphthalate (PEN) resins, polyethersulfone (PES) resins, polyimide resins, and polyphenylene sulfide resins; a silicon layer provided on the carrier, the silicon layer mainly containing silicon; a carbon layer provided on the silicon layer, the carbon layer mainly containing carbon; and an extremely thin copper layer provided on the carbon layer.
    Type: Application
    Filed: December 1, 2016
    Publication date: December 27, 2018
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori MATSUURA
  • Publication number: 20180151268
    Abstract: There is provided a copper foil having a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board. A surface-treated copper foil according to the present invention includes a copper foil and a silicon-based surface coating layer provided on at least one surface of the copper foil, the silicon-based surface coating layer being mainly composed of silicon (Si). The silicon-based surface coating layer has a carbon content of 1.0 to 35.0 atomic % and an oxygen content of 12.0 to 40.0 atomic % relative to a total content in 100 atomic % of carbon (C), oxygen (O) and silicon (Si) elements as measured by X-ray photoelectron spectroscopy (XPS).
    Type: Application
    Filed: March 24, 2016
    Publication date: May 31, 2018
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori MATSUURA
  • Patent number: 9985238
    Abstract: Provided is an electrolytic copper foil significantly useful as electrodes for electronic devices. The electrolytic copper foil used for an electronic device according to the present invention includes copper or copper alloy, the electrolytic copper foil having a 0.2% proof stress of 250 N/mm2 or more after heat treatment at 200° C. for 60 min in a nitrogen atmosphere, wherein at least one of the surfaces of the electrolytic copper foil has a concave-dominant surface profile having a Pv/Pp ratio of 1.2 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp as determined in a rectangular area of 181 ?m by 136 ?m in accordance with JIS B 0601-2001.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: May 29, 2018
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Yoshinori Matsuura
  • Patent number: 9786404
    Abstract: There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 ?m by 136 ?m in accordance with JIS B 0601-2001.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: October 10, 2017
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshinori Matsuura, Nozomu Kitajima, Toshimi Nakamura, Masaharu Myoi
  • Publication number: 20170188457
    Abstract: There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.
    Type: Application
    Filed: September 3, 2015
    Publication date: June 29, 2017
    Inventors: Yoshinori MATSUURA, Joe NISHIKAWA, Hiroaki KURIHARA
  • Patent number: 9508951
    Abstract: There is provided an electrode foil that can form an organic electroluminescent device having a high external quantum efficiency despite the presence of the organic nitrogen compound at the interface of a metal foil and a reflective layer. The electrode foil of the invention includes a metal foil made of copper or copper alloy and a reflective layer provided on at least one surface of the metal foil. The electrode foil has an organic nitrogen compound at the interface between the metal foil and the reflective layer in such an amount that the ratio of the number of counts on the C—N bond to the total number of counts on the copper and the C—N bond: CN/(CN+Cu) in the organic nitrogen compound is 0.4 or less determined by time-of-flight secondary ion mass spectrometric analysis (TOF-SIMS) of the interface.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: November 29, 2016
    Assignees: Mitsui Mining & Smelting Co., Ltd., Panasonic Corporation
    Inventors: Yoshinori Matsuura, Toshimi Nakamura, Masaharu Myoi, Nozomu Kitajima, Mitsuo Yaguchi
  • Patent number: 9490440
    Abstract: An electrode foil which has both the functions of a supporting base material and a reflective electrode and also has superior thermal conductivity; and an organic device using the same are provided. The electrode foil comprises a metal foil and a reflective layer provided directly on the metal foil.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: November 8, 2016
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshinori Matsuura, Nozomu Kitajima, Naohiko Abe
  • Publication number: 20160285030
    Abstract: There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time.
    Type: Application
    Filed: June 4, 2014
    Publication date: September 29, 2016
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshinori MATSUURA, Toshimi NAKAMURA, Masaharu MYOI, Hajime WATANABE
  • Publication number: 20150340639
    Abstract: Provided is an electrolytic copper foil significantly useful as electrodes for electronic devices. The electrolytic copper foil used for an electronic device according to the present invention includes copper or copper alloy, the electrolytic copper foil having a 0.2% proof stress of 250 N/mm2 or more after heat treatment at 200° C. for 60 min in a nitrogen atmosphere, wherein at least one of the surfaces of the electrolytic copper foil has a concave-dominant surface profile having a Pv/Pp ratio of 1.2 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp as determined in a rectangular area of 181 ?m by 136 ?m in accordance with JIS B 0601-2001.
    Type: Application
    Filed: July 2, 2013
    Publication date: November 26, 2015
    Inventor: Yoshinori Matsuura
  • Publication number: 20150207096
    Abstract: There is provided an electrode foil that can form an organic electroluminescent device having a high external quantum efficiency despite the presence of the organic nitrogen compound at the interface of a metal foil and a reflective layer. The electrode foil of the invention includes a metal foil made of copper or copper alloy and a reflective layer provided on at least one surface of the metal foil. The electrode foil has an organic nitrogen compound at the interface between the metal foil and the reflective layer in such an amount that the ratio of the number of counts on the C—N bond to the total number of counts on the copper and the C—N bond: CN/(CN+Cu) in the organic nitrogen compound is 0.4 or less determined by time-of-flight secondary ion mass spectrometric analysis (TOF-SIMS) of the interface.
    Type: Application
    Filed: June 7, 2013
    Publication date: July 23, 2015
    Inventors: Yoshinori Matsuura, Toshimi Nakamura, Masaharu Myoi, Nozomu Kitajima, Mitsuo Yaguchi
  • Publication number: 20150194232
    Abstract: There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 ?m by 136 ?m in accordance with JIS B 0601-2001.
    Type: Application
    Filed: April 24, 2013
    Publication date: July 9, 2015
    Inventors: Yoshinori Matsuura, Nozomu Kitajima, Toshimi Nakamura, Masaharu Myoi
  • Patent number: 9029885
    Abstract: There is provided an electrode foil, which can show superior light scattering, while preventing short circuit between electrodes. The electrode foil of the present invention comprises a metal foil having a thickness of from 1 ?m to 250 ?m, wherein the electrode foil comprises, on at least one outermost surface thereof, a light-scattering surface having a Pv/Pp ratio of 2.0 or higher, wherein the Pv/Pp ratio is a ratio of a maximum profile valley depth Pv of a profile curve to a maximum profile peak height Pp of the profile curve as measured in a rectangular area of 181 ?m×136 ?m in accordance with JIS B 0601-2001.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: May 12, 2015
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshinori Matsuura, Nozomu Kitajima, Toshimi Nakamura, Masaharu Myoi
  • Publication number: 20150001519
    Abstract: An electrode foil functioning as both a supporting substrate and an electrode and suitable for low-cost high-efficiency production of flexible electronic devices having functionality on their both sides is provided. An electrode foil of the present invention comprises a metal foil, wherein the metal foil has a thickness of 1 to 250 ?m, and wherein the outermost surfaces on both sides of the electrode foil are ultra-smooth surfaces each having an arithmetic mean roughness Ra of 30.0 nm or less as determined in accordance with JIS B 0601-2001.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 1, 2015
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshinori Matsuura, Nozomu Kitajima, Toshimi Nakamura, Masaharu Myoi
  • Publication number: 20140284589
    Abstract: An electrode foil which has both the functions of a supporting base material and a reflective electrode and also has superior thermal conductivity; and an organic device using the same are provided. The electrode foil comprises a metal foil and a reflective layer provided directly on the metal foil.
    Type: Application
    Filed: June 10, 2014
    Publication date: September 25, 2014
    Inventors: Yoshinori MATSUURA, Nozomu KITAJIMA, Naohiko ABE
  • Patent number: 8816338
    Abstract: There are provided an electrode foil which has all the functions of a supporting base material, an electrode and a reflective layer and also has a superior thermal conductivity; and an organic device using the same. The electrode foil comprises a metal foil, wherein the electrode foil has at least one outermost surface which is an ultra-smooth surface having an arithmetic average roughness Ra of 10.0 nm or less as measured in accordance with JIS B 0601-2001.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 26, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshinori Matsuura, Nozomu Kitajima, Naohiko Abe