Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate. The method also includes forming an etchable covering channel layer on the isolation layer, forming a patterning protection layer on the covering channel layer, forming etching channels in the covering channel layer using a first etching process, and removing the corners of the isolation layer by etching the isolation layer using a second etching process. Following the second etching process the isolation layer covers the sidewall P-N junctions. The method can also include bonding the growth substrate to a carrier and separating the growth substrate from the light emitting diode (LED) structures using a laser lift off (LLO) process.

Abstract: A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.

Abstract: This composition does not contain a non-crosslinkable organopolysiloxane resin but contains: (A) an organopolysiloxane having, per molecule, two groups each represented by formula (1) (R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (B) a monofunctional(meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2) (R1, R2, R3, a, and p are identical to those described above), a R43SiO1/2 unit (b) (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and (D) a photoinitiator.

Abstract: A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.

Abstract: Disclosed is an operating device of a game machine which is installed in the game machine including a display portion which displays the progress of a game in accordance with a control of a body controller and a result of the game and operates the progress of the game in conjunction with a display on the display portion. This operating device includes a rotation operation portion capable of being rotated by a player, a rotation operation detecting portion which detects a state of rotation operation of the rotation operation portion, a decoration display portion which displays any one of a pattern, a symbol and a letter, or a combination thereof, and a connection portion which outputs a signal of the rotation operation detecting portion to the body controller and inputs a signal for controlling a display of the decoration display portion from the body controller.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: Disclosed is an operating device of a game machine which is installed in the game machine including a display portion which displays the progress of a game in accordance with a control of a body controller and a result of the game and operates the progress of the game in conjunction with a display on the display portion. This operating device includes a rotation operation portion capable of being rotated by a player, a rotation operation detecting portion which detects a state of rotation operation of the rotation operation portion, a decoration display portion which displays any one of a pattern, a symbol and a letter, or a combination thereof, and a connection portion which outputs a signal of the rotation operation detecting portion to the body controller and inputs a signal for controlling a display of the decoration display portion from the body controller.

Abstract: In a gear comprising a resin material including a fibrous filler, a plurality of teeth formed at equal angular intervals are provided to a first outer peripheral part. When the gear is manufactured, the resin material is filled from a specific portion (first toothless part) which faces in a direction orthogonal to a center axis line, and in which the teeth are not formed in a portion that overlaps the first outer peripheral part when seen from the direction orthogonal to the center axis line. Therefore, there is a gate mark in the specific portion. Between the specific portion and the center axis line, the degree to which the filler is oriented in a direction intersecting the center axis line is higher than the degree to which the filler is oriented in a direction running along the center axis line.

Abstract: A motor device may include a motor including a motor shaft protruded from a motor main body; a worm gear connected with the motor shaft through a transmission mechanism and is formed with a spiral groove; and a worm wheel engaged with the worm gear. The transmission mechanism may include a transmission member to transmit rotation of the motor shaft to the worm gear. One end face on the motor main body side of the worm gear and an end face on a worm gear side of the transmission member may be formed with two protruded parts protruded toward the other of the end faces, and a recessed part engaged with the protruded parts is formed in the other of the end faces. A compression coil spring may disposed between the worm gear and the transmission member between the two protruded parts.

Abstract: A nondestructive inspection apparatus of a structure includes: an inspection apparatus body 1 provided with an infrared light irradiation unit irradiating a structure 3 to be inspected with heating infrared light, a temperature variation measuring unit measuring a variation in temperature of the structure due to the irradiation with infrared light from the infrared light irradiation unit, a drive-control-and-accumulation unit performing drive control of the infrared light irradiation unit and the temperature variation measuring unit and performing data accumulation; and a self-running mechanism unit 2 enabling the inspection apparatus body 1 to move along the structure 3. The structure 3 is inspected for an internal defect by irradiating the structure 3 with heating infrared light while the apparatus moves along the structure 3 through the use of the self-running mechanism unit 2 and measuring the variation in temperature of the structure 3 due to the irradiation with infrared light.

Abstract: A light-receiving element includes a semiconductor layer with a pn junction part and a pair of electrodes that interpose the pn junction part. Near field light is generated in the vicinity of the pn junction part by applying a forward bias voltage between the pair of electrodes and irradiating the pn junction with light that has a specific wavelength, and an electrode of the irradiated pair of electrodes is configured with a wire grid polarizer that transmits the light that has the specific wavelength.

Abstract: Signal transmission crosstalk between substrates is suppressed even when light emitting elements or light receiving elements are densely arranged. Provided is an optical interconnection device 1 in which optical signals are sent and received between a plurality of semiconductor substrates arranged in a laminated manner. A light emitting element 2 or a light receiving element 3 arranged in one semiconductor substrate 10 includes a pn junction part 10pn that uses the semiconductor substrate 10 as a common semiconductor layer, and is formed on one surface side of the semiconductor substrate 10. For a pair of the light emitting element 2 and the light receiving element 3 respectively sending and receiving optical signals between the different semiconductor substrates 10, light emitted by the light emitting element 2 is transmitted through the semiconductor substrate 10 and received by the light receiving element 3.

Abstract: A motor device may include a motor including a motor shaft protruded from a motor main body; a worm gear connected with the motor shaft through a transmission mechanism and is formed with a spiral groove; and a worm wheel engaged with the worm gear. The transmission mechanism may include a transmission member to transmit rotation of the motor shaft to the worm gear. One end face on the motor main body side of the worm gear and an end face on a worm gear side of the transmission member may be formed with two protruded parts protruded toward the other of the end faces, and a recessed part engaged with the protruded parts is formed in the other of the end faces. A compression coil spring may disposed between the worm gear and the transmission member between the two protruded parts.

Abstract: A nondestructive inspection apparatus of a structure includes: an inspection apparatus body 1 provided with an infrared light irradiation unit irradiating a structure 3 to be inspected with heating infrared light, a temperature variation measuring unit measuring a variation in temperature of the structure due to the irradiation with infrared light from the infrared light irradiation unit, a drive-control-and-accumulation unit performing drive control of the infrared light irradiation unit and the temperature variation measuring unit and performing data accumulation; and a self-running mechanism unit 2 enabling the inspection apparatus body 1 to move along the structure 3. The structure 3 is inspected for an internal defect by irradiating the structure 3 with heating infrared light while the apparatus moves along the structure 3 through the use of the self-running mechanism unit 2 and measuring the variation in temperature of the structure 3 due to the irradiation with infrared light.

Abstract: A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 ?m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 ?m but less than 10 ?m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.

Abstract: The present invention relates to a method for producing a nucleoside derivative represented by formula (2), comprising the step of reducing a nucleoside of formula (1) in the presence of a noble metal catalyst comprising a carrier and a noble metal supported thereby, selected from the group consisting of (A) a homogeneously supported catalyst where the specific surface area of the noble metal is 95.0 m2/g or more and the particle size of the noble metal is 4.3 nm or less, and (B) a surface-loaded catalyst where the specific surface area of the noble metal is 56.0 m2/g or more and the particle size of the noble metal is 8.0 nm or less, wherein R1 is hydrogen or a protective group, R2 is NH2 or OH, R3 is an acyl group, and X is a chlorine or bromine atom. According to the present invention, the yield can be made equal even when the amount of catalyst is smaller than that used for the conventional products.