Patents by Inventor Yoshio Abe

Yoshio Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200044277
    Abstract: To provide a non-aqueous electrolyte electricity-storage element including a positive electrode including a positive-electrode active material capable of inserting and releasing anions, a negative electrode including a negative-electrode active material capable of inserting and releasing cations, and a non-aqueous electrolyte, wherein the positive-electrode active material is porous carbon having pores having a three-dimensional network structure, and wherein a changing rate of a cross-sectional thickness of a positive electrode film including the positive-electrode active material defined by Formula (1) below is less than 45%.
    Type: Application
    Filed: October 11, 2019
    Publication date: February 6, 2020
    Inventors: Naoto ABE, Yoshio ITOH, Tatsuya DAN, Yuka ARAKI, Shuhei TAKESHITA
  • Patent number: 10490846
    Abstract: To provide a non-aqueous electrolyte electricity-storage element including a positive electrode including a positive-electrode active material capable of inserting and releasing anions, a negative electrode including a negative-electrode active material capable of inserting and releasing cations, and a non-aqueous electrolyte, wherein the positive-electrode active material is porous carbon having pores having a three-dimensional network structure, and wherein a changing rate of a cross-sectional thickness of a positive electrode film including the positive-electrode active material defined by Formula (1) below is less than 45%.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: November 26, 2019
    Assignee: Ricoh Company, Ltd.
    Inventors: Naoto Abe, Yoshio Itoh, Tatsuya Dan, Yuka Araki, Shuhei Takeshita
  • Publication number: 20190243247
    Abstract: A composition for resist underlayer film formation contains a compound having a group represented by formula (1), and a solvent. R1 represents an organic group having 2 to 10 carbon atoms and having a valency of (m+n), wherein the carbon atoms include two carbon atoms that are adjacent to each other, with a hydroxy group or an alkoxy group bonding to one of the two carbon atoms, and with a hydrogen atom bonding to another of the two carbon atoms; L1 represents an ethynediyl group or a substituted or unsubstituted ethenediyl group; R2 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; n is an integer of 1 to 3; * denotes a bonding site to a moiety other than the group represented by the formula (1) in the compound; and m is an integer of 1 to 3.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 8, 2019
    Applicant: JSR CORPORATION
    Inventors: Naoya NOSAKA, Goji Wakamatsu, Tsubasa Abe, Yuushi Matsumura, Yoshio Takimoto, Shin-ya Nakafuji, Kazunori Sakai
  • Publication number: 20190190027
    Abstract: An active material is provided. The active material comprises a porous carbon having a plurality of pores forming a three-dimensional network structure and a conductive polymer, and at least a part of the plurality of pores contains the conductive polymer.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 20, 2019
    Inventors: Shuhei Takeshita, Masayoshi Nomura, Naoto Abe, Yoshio Itoh, Tatsuya Dan, Yuka Araki, Naoki Sugihara
  • Patent number: 10297828
    Abstract: To provide a non-aqueous electrolyte storage element including a positive electrode including a positive-electrode active material capable of inserting and eliminating anions, a negative electrode including a negative-electrode active material, and a non-aqueous electrolyte, wherein the positive-electrode active material includes a carbon material which has a plurality of pores constituting a three-dimensional network structure and has a solid electrolyte interface (SEI) material on a surface of the carbon material.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: May 21, 2019
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yuka Araki, Naoto Abe, Yoshio Itoh, Tatsuya Dan, Shuhei Takeshita
  • Patent number: 10253405
    Abstract: A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 9, 2019
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Akira Saito, Shuzo Umezu, Ryo Iino
  • Patent number: 9644251
    Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: May 9, 2017
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Yoshio Abe, Naotake Hirano
  • Patent number: 9435016
    Abstract: The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ? to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (L?/L) of the total special grain boundary length L? of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: September 6, 2016
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Yoshio Abe, Akira Saito, Yoshihiro Kameyama
  • Patent number: 9255310
    Abstract: A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: February 9, 2016
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Yoshihiro Kameyama, Yoshio Abe
  • Patent number: 9169539
    Abstract: The fatigue resistance characteristics, particularly, fatigue resistance characteristics after retention at 150° C. for 1000 hours are improved while maintaining the characteristics in the related art. Provided is a copper alloy sheet having a composition containing 0.2% by mass to 1.2% by mass of Mg, and 0.001% by mass to 0.2% by mass of P, the balance being Cu and unavoidable impurities. When X-ray diffraction intensity of a {110} crystal plane is set as I{110}, and X-ray diffraction intensity of {110} crystal plane of a pure copper standard powder is set as I0{110}, a surface crystal orientation of the copper alloy sheet satisfies a relation of 4.0?I{110}/I0{110}?6.0.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: October 27, 2015
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Shunroku Sukumoda
  • Publication number: 20150000803
    Abstract: A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.
    Type: Application
    Filed: December 22, 2011
    Publication date: January 1, 2015
    Applicant: Mitsubishi Shindoh Co., Ltd
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Akira Saito, Shuzo Umezu, Ryo Iino
  • Publication number: 20140209221
    Abstract: The fatigue resistance characteristics, particularly, fatigue resistance characteristics after retention at 150° C. for 1000 hours are improved while maintaining the characteristics in the related art. Provided is a copper alloy sheet having a composition containing 0.2% by mass to 1.2% by mass of Mg, and 0.001% by mass to 0.2% by mass of P, the balance being Cu and unavoidable impurities. When X-ray diffraction intensity of a {110} crystal plane is set as I{110}, and X-ray diffraction intensity of {110} crystal plane of a pure copper standard powder is set as I0{110}, a surface crystal orientation of the copper alloy sheet satisfies a relation of 4.0?I{110}/I0{110}?6.0.
    Type: Application
    Filed: April 4, 2012
    Publication date: July 31, 2014
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Shunroku Sukumoda
  • Publication number: 20130319584
    Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.
    Type: Application
    Filed: February 10, 2012
    Publication date: December 5, 2013
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Takeshi Sakurai, Yoshio Abe, Naotake Hirano
  • Publication number: 20130167988
    Abstract: The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ? to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (L?/L) of the total special grain boundary length L? of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.
    Type: Application
    Filed: July 7, 2010
    Publication date: July 4, 2013
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Takeshi Sakurai, Yoshio Abe, Akira Saito, Yoshihiro Kameyama
  • Publication number: 20110146855
    Abstract: A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.
    Type: Application
    Filed: June 4, 2010
    Publication date: June 23, 2011
    Applicant: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Yoshihiro Kameyama, Yoshio Abe
  • Publication number: 20100227053
    Abstract: In a transmission type screen and other optical devices formed by combining optical sheets such as a Fresnel lens sheet and a lenticular lens sheet, the generation of stray light and defective appearance caused by a friction-reducing agent are prevented. In the optical devices such as a transmission type screen 3 formed by combining a plurality of optical sheets such as a Fresnel lens sheet 1 and a lenticular lens sheet 2, a friction-reducing agent 20 is provided on a surface of at least one of the optical sheets at a thickness of 0.3 nm or more to 10 nm or less. A coating applicator 30 for the friction-reducing agent 20 includes: a transfer roller 31; coating liquid-supplying means 32 for supplying the coating liquid 20 to the transfer roller 31; and scraping means 35 for adjusting the thickness of the coating liquid 20 adhering to the transfer roller 31. In the coating liquid 30, the surface roughness Ra (JIS B 0601-1982) of the transfer roller 31 is set to 0.01 to 1 ?m.
    Type: Application
    Filed: May 11, 2010
    Publication date: September 9, 2010
    Applicant: KURARAY CO., LTD.
    Inventors: Hiroyuki MONOE, Kouzo Yasuda, Yukihiro Yanagawa, Osamu Kimura, Yoshio Abe, Katashi Saito
  • Publication number: 20100220391
    Abstract: A lenticular lens sheet including: rows of cylindrical lenses on an incident surface side; protrusions on sections of the lens rows where light is not condensed; and light absorption layers on the protrusions. The pitch of the lens rows is smaller than 0.5 mm, the angle between the lowermost section of the protrusion and a sheet main surface is equal to or greater than 45° and is greater than the angle formed between the vertex of the protrusion and the sheet main surface, and the width of the protrusion measured at a position 10 ?m away in the sheet thickness direction from the vertex of the protrusion is equal to or smaller than 150 ?m. A light shielding layer thick enough formed on the protrusion of a lenticular lens can be easily and uniformly formed even if the pitch of the lenticular lens rows is small, and thereby contrast of external light can be enhanced.
    Type: Application
    Filed: July 31, 2006
    Publication date: September 2, 2010
    Applicant: Kuraray Co., Ltd.
    Inventors: Yoshio Abe, Youji Ono
  • Patent number: 7784858
    Abstract: Rear vehicle body structure (10) includes a sub-frame (16), which has left and right sub side members (51, 52) and front and rear sub cross members (53, 54) that together constitute a substantially rectangular framework (46). The left sub side member includes a left rear extension portion (58) extending from the framework toward the rear of the vehicle body and connected to a left rear joint section (42), where the rear cross member and the left rear side frame are joined together. The right sub side member includes a right rear extension portion (63) extending from the framework toward the rear of the vehicle body and connected to a right rear joint section (44).
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: August 31, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yoshio Abe, Yoshiyuki Toba
  • Patent number: 7703351
    Abstract: An accelerator pedal (100) includes a stopper member (30) fixed to the floor of the driver's seat, a pad member (20) fastened to the stopper member (30) and operated by the driver's depression force, an arm (4) engaged with the pad member (20) to transmit the depression force, and a bracket (5) engaged with the arm (4) to support the arm (4), wherein the stopper member (30) is provided with a pad fitting section (17) for fastening the pad member (20), and the pad member (20) is integrally molded by a single resin material.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: April 27, 2010
    Assignees: Honda Motor Co., Ltd., F-Tech Inc.
    Inventors: Tomohiro Sakuraba, Hideto Nebuya, Takashi Sugiyama, Shigeki Nomura, Koji Terasaki, Teruo Kato, Toshimi Kitamura, Tomoaki Abe, Yoshio Abe, legal representative
  • Publication number: 20100072787
    Abstract: Rear vehicle body structure (10) includes a sub-frame (16), which has left and right sub side members (51, 52) and front and rear sub cross members (53, 54) that together constitute a substantially rectangular framework (46). The left sub side member includes a left rear extension portion (58) extending from the framework toward the rear of the vehicle body and connected to a left rear joint section (42), where the rear cross member and the left rear side frame are joined together. The right sub side member includes a right rear extension portion (63) extending from the framework toward the rear of the vehicle body and connected to a right rear joint section (44).
    Type: Application
    Filed: May 28, 2008
    Publication date: March 25, 2010
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yoshio Abe, Yoshiyuki Toba