Patents by Inventor Yoshio Arai

Yoshio Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11937437
    Abstract: A semiconductor memory includes a plurality of stripe-like active areas formed by stacking, in a direction perpendicular to a substrate, a plurality of layers extending parallel to the substrate, a first gate electrode formed on first side surfaces of the active areas, the first side surfaces being perpendicular to the substrate, a second gate electrode formed on second side surfaces of the active areas, the second side surfaces being perpendicular to the substrate. The layers are patterned in self-alignment with each other, intersections of the active areas and the first gate electrode form a plurality of memory cells, and the plurality of memory cells in an intersecting plane share the first gate electrode.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: March 19, 2024
    Assignee: Kioxia Corporation
    Inventors: Masahiro Kiyotoshi, Akihito Yamamoto, Yoshio Ozawa, Fumitaka Arai, Riichiro Shirota
  • Publication number: 20240003932
    Abstract: A fluid device 10 includes: a flow path 20 through which a fluid containing a fine particle flows; an ultrasonic transmitter 60 configured to transmit an ultrasonic wave to the fluid in the flow path 20 in response to an input of a drive signal; a flow velocity measurement unit 40 configured to measure a flow velocity of the fluid in the flow path 20; and a controller 70 configured to control the ultrasonic transmitter 60. The controller 70 sets an amplitude of the drive signal according to a measured flow velocity that is a flow velocity measured by the flow velocity measurement unit 40, and inputs the drive signal having the set amplitude to the ultrasonic transmitter 60.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 4, 2024
    Inventors: Keita KUBO, Chikara KOJIMA, Mitsuru MIYASAKA, Yoshio ARAI, Hiroto TOMIOKA
  • Publication number: 20240000423
    Abstract: An ultrasonic probe is attached to a target to perform ultrasonic measurement. The ultrasonic probe includes: a first substrate including an ultrasonic element array in which a plurality of ultrasonic elements performing at least one of transmission of ultrasonic waves and reception of ultrasonic waves are arranged in an array, the ultrasonic element array being arranged on a first surface of the first substrate; a second substrate facing a second surface opposite to the first surface of the first substrate; and a housing that houses the first substrate and the second substrate therein and is provided with an opening through which the ultrasonic waves pass at a position corresponding to the ultrasonic element array. The second substrate includes a communication unit coupled to the plurality of ultrasonic elements and capable of wirelessly communicating with another terminal device. A weight of the ultrasonic probe is 150 g or less.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 4, 2024
    Inventors: Yoshio ARAI, Chikara KOJIMA, Hiroto TOMIOKA, Keita KUBO
  • Patent number: 11806753
    Abstract: An ultrasonic device includes an ultrasonic sensor, a wiring member, and a housing, in which the wiring member has a covered wire that covers a signal line coupled to the ultrasonic sensor via an insulating layer, and a conductive member that is electrically coupled with the covered wire, the housing has a plurality of housing components having conductivity, and covers the ultrasonic sensor with the plurality of housing components, and the conductive member is electrically coupled to and held by the plurality of housing components.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 7, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Masayoshi Yamada, Hikaru Iwai, Mitsuru Miyasaka, Yoshio Arai
  • Publication number: 20230218273
    Abstract: There is provided a thickness measurement device for measuring a thickness of a measurement target by using an ultrasonic wave, the thickness measurement device being to be attached to an object including the measurement target therein. The thickness measurement device includes a plurality of ultrasonic elements each configured to transmit the ultrasonic wave to the measurement target from a surface of the object, receive a reflected wave reflected by the measurement target, and output a reception signal, and a controller configured to control the ultrasonic elements. The plurality of ultrasonic elements transmit the ultrasonic waves in directions different from one another, and the controller compares a signal intensity of the reception signal with a predetermined threshold, and measures the thickness of the measurement target based on the reception signal having a signal intensity larger than the threshold.
    Type: Application
    Filed: January 6, 2023
    Publication date: July 13, 2023
    Inventors: Seiji IZUO, Yoshio ARAI
  • Patent number: 11487004
    Abstract: An ultrasonic wave measuring device including an ultrasonic wave device and a processor. The ultrasonic wave device transmits transmission ultrasonic waves toward an object, receives reflected ultrasonic waves, and outputs reception signals. The processor is configured to: detect a transmission time; detect zero-crossing points of the reception signals; detect zero-crossing times; calculate periods of time between the transmission time and each of the zero-crossing times; compare a reference period of time with each of the calculated periods of time so as to generate difference values therebetween; determine a minimum value among the difference values; and set a corresponding zero-crossing point having the minimum value as a reception zero-crossing point. The ultrasonic wave measuring device is configured to measure a distance toward the object based on the period of time between the zero-crossing time corresponding to the reception zero-crossing point and the transmission time.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: November 1, 2022
    Inventors: Yoshio Arai, Tomohide Onogi
  • Publication number: 20220296217
    Abstract: An ultrasonic thickness measurement device includes: an ultrasonic probe including eight or less ultrasonic elements each including a transmission element and a receiving element, the transmission element and the receiving element being ultrasonic elements; and a controller configured to determine a thickness of target body tissue from tomographic image data of a body of a subject acquired based on a received signal that is received by each of the receiving elements of each of the ultrasonic elements. The controller determines the thickness from the tomographic image data based on each of the received signals that is received by each of the ultrasonic elements.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 22, 2022
    Inventors: Yoshio ARAI, Kanechika KIYOSE, Masahiro ONODA, Mio SASAKI
  • Patent number: 11353607
    Abstract: An ultrasonic sensor includes a transmission unit that is disposed on a first axis which is inclined with respect to a normal line of a surface of an object, a reception unit that is provided on a side opposite to the transmission unit of the object, on the first axis, and a transmission control unit that controls drive of the transmission unit. The transmission unit includes a plurality of transmission elements that transmit ultrasonic waves, and the plurality of transmission elements are arranged in a first direction that intersects the first axis in a plane including the normal line and the first axis. The transmission control unit delay-drives the plurality of transmission elements to align a direction of the ultrasonic wave that is transmitted from the transmission unit with the first axis.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 7, 2022
    Inventors: Yoshio Arai, Ryoki Watanabe
  • Patent number: 11134923
    Abstract: An ultrasonic diagnostic apparatus includes: a plurality of receiving elements that receive an ultrasonic wave, convert the ultrasonic wave into an electric signal, and output a receiving signal; a first detecting amplifier that detects noise and outputs a noise signal; a second detecting amplifier that amplifies the noise signal and outputs an amplified noise signal; a subtraction amplifier that receives the receiving signal and the amplified noise signal and subtracts the amplified noise signal from the receiving signal; and a plurality of circuit substrates that each include the second detecting amplifier and subtraction amplifier.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 5, 2021
    Inventors: Yoshio Arai, Masaki Hayashi
  • Publication number: 20210094071
    Abstract: An ultrasonic device includes an ultrasonic sensor, a wiring member, and a housing, in which the wiring member has a covered wire that covers a signal line coupled to the ultrasonic sensor via an insulating layer, and a conductive member that is electrically coupled with the covered wire, the housing has a plurality of housing components having conductivity, and covers the ultrasonic sensor with the plurality of housing components, and the conductive member is electrically coupled to and held by the plurality of housing components.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 1, 2021
    Inventors: Masayoshi YAMADA, Hikaru IWAI, Mitsuru MIYASAKA, Yoshio ARAI
  • Publication number: 20200294692
    Abstract: A cable has a core line. The core line includes a signal line transmitting a signal, a ground line having a ground potential, and a shield line covering the signal line and the ground line. The ground line and the shield line are electrically coupled together.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 17, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yoshio ARAI, Mitsuru MIYASAKA, Masayoshi YAMADA, Kanechika KIYOSE
  • Publication number: 20200271779
    Abstract: An ultrasonic wave measuring device includes: an ultrasonic wave transmission and reception unit configured to perform ultrasonic wave transmission and reception processing of transmitting ultrasonic waves to an object and receiving the ultrasonic waves reflected by the object, and to output reception signals based on reception of the ultrasonic waves; a zero-crossing detection unit configured to detect a plurality of zero-crossings corresponding to the reception signals whose signal voltages are equal to or higher than a predetermined threshold; and a reception setting unit configured to set a reception zero-crossing used as a reception timing based on the plurality of zero-crossings.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 27, 2020
    Inventors: Yoshio ARAI, Tomohide ONOGI
  • Patent number: 10631832
    Abstract: An ultrasonic module includes a reception circuit adapted to receive a reception signal from an ultrasonic device, which receives an ultrasonic wave, to generate an echo signal, switching power supplies driven with a predetermined switching cycle, and adapted to supply the reception circuit with electrical power, and a phasing addition circuit adapted to perform an addition process on a first echo signal output when driving the reception circuit at a first drive timing in the switching cycle, and a second echo signal output when driving the reception circuit at a second drive timing delayed as much as a half cycle of a switching noise in the switching power supplies from the first drive timing.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: April 28, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Yoshio Arai, Kenji Murakami
  • Publication number: 20190343491
    Abstract: An ultrasonic diagnostic apparatus includes: a plurality of receiving elements that receive an ultrasonic wave, convert the ultrasonic wave into an electric signal, and output a receiving signal; a first detecting amplifier that detects noise and outputs a noise signal; a second detecting amplifier that amplifies the noise signal and outputs an amplified noise signal; a subtraction amplifier that receives the receiving signal and the amplified noise signal and subtracts the amplified noise signal from the receiving signal; and a plurality of circuit substrates that each include the second detecting amplifier and subtraction amplifier.
    Type: Application
    Filed: March 30, 2017
    Publication date: November 14, 2019
    Inventors: Yoshio ARAI, Masaki HAYASHI
  • Publication number: 20190265374
    Abstract: An ultrasonic sensor includes a transmission unit that is disposed on a first axis which is inclined with respect to a normal line of a surface of an object, a reception unit that is provided on a side opposite to the transmission unit of the object, on the first axis, and a transmission control unit that controls drive of the transmission unit. The transmission unit includes a plurality of transmission elements that transmit ultrasonic waves, and the plurality of transmission elements are arranged in a first direction that intersects the first axis in a plane including the normal line and the first axis. The transmission control unit delay-drives the plurality of transmission elements to align a direction of the ultrasonic wave that is transmitted from the transmission unit with the first axis.
    Type: Application
    Filed: February 26, 2019
    Publication date: August 29, 2019
    Inventors: Yoshio ARAI, Ryoki WATANABE
  • Patent number: 10368840
    Abstract: An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 6, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Yoshio Arai, Kazuki Yoshida
  • Publication number: 20190038256
    Abstract: An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 7, 2019
    Inventors: Yoshio ARAI, Kazuki YOSHIDA
  • Patent number: 10161748
    Abstract: An ultrasonic measurement apparatus includes: a first phasing addition circuit that receives electric signals output from a plurality of reception ultrasonic elements, shifts the plurality of electric signals in a time axis direction to combine the plurality of electric signals, and outputs a composite signal; a second electro-optical conversion unit and a second light emitting unit that receive the composite signal, convert the composite signal into an optical signal, and output the optical signal; an optical cable through which the optical signal is transmitted; and a second light receiving unit and a second photoelectric conversion unit that receive the optical signal and converts the optical signal into an electric signal. The second light emitting unit outputs the optical signal after the first phasing addition circuit outputs the composite signal.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: December 25, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Yoshio Arai
  • Publication number: 20180058845
    Abstract: An ultrasonic measurement apparatus includes: a first phasing addition circuit that receives electric signals output from a plurality of reception ultrasonic elements, shifts the plurality of electric signals in a time axis direction to combine the plurality of electric signals, and outputs a composite signal; a second electro-optical conversion unit and a second light emitting unit that receive the composite signal, convert the composite signal into an optical signal, and output the optical signal; an optical cable through which the optical signal is transmitted; and a second light receiving unit and a second photoelectric conversion unit that receive the optical signal and converts the optical signal into an electric signal. The second light emitting unit outputs the optical signal after the first phasing addition circuit outputs the composite signal.
    Type: Application
    Filed: August 24, 2017
    Publication date: March 1, 2018
    Inventor: Yoshio ARAI
  • Publication number: 20170065260
    Abstract: An ultrasonic module includes a reception circuit adapted to receive a reception signal from an ultrasonic device, which receives an ultrasonic wave, to generate an echo signal, switching power supplies driven with a predetermined switching cycle, and adapted to supply the reception circuit with electrical power, and a phasing addition circuit adapted to perform an addition process on a first echo signal output when driving the reception circuit at a first drive timing in the switching cycle, and a second echo signal output when driving the reception circuit at a second drive timing delayed as much as a half cycle of a switching noise in the switching power supplies from the first drive timing.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 9, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yoshio ARAI, Kenji MURAKAMI