Abstract: A semiconductor memory device is constructed to include a memory cell formed by a plurality of transistors, wherein each of gate wiring layers of all of the transistors forming the memory cell is arranged to extend in one direction.

Abstract: A base cell is configured such that P-type regions 11 to 13 are arrayed in a column direction in an N-type well 10, N-type regions 21 to 23 are arrayed in a column direction in a P-type well 20 next to the N-type well, gate lines 34A and 35B passing above a channel between the P-type regions and further between the N-type regions are formed in a row direction, and well contact regions 16C and 26C are formed in the wells 10 and 20 at outer ends thereof, respectively, while no gate contacts are formed at the outer ends. Power supply lines VDD and VSS connected to the well contact regions are formed in the column direction in a second wiring layer above a first wiring layer.

Abstract: A base cell is configured such that P-type regions 11 to 13 are arrayed in a column direction in an N-type well 10, N-type regions 21 to 23 are arrayed in a column direction in a P-type well 20 next to the N-type well, gate lines 34A and 35B passing above a channel between the P-type regions and further between the N-type regions are formed in a row direction, and well contact regions 16C and 26C are formed in the wells 10 and 20 at outer ends thereof, respectively, while no gate contacts are formed at the outer ends. Power supply lines VDD and VSS connected to the well contact regions are formed in the column direction in a second wiring layer above a first wiring layer.

Abstract: A base cell is configured such that P-type regions 11 to 13 are arrayed in a column direction in an N-type well 10, N-type regions 21 to 23 are arrayed in a column direction in a P-type well 20 next to the N-type well, gate lines 34A and 35B passing above a channel between the P-type regions and further between the N-type regions are formed in a row direction, and well contact regions 16C and 26C are formed in the wells 10 and 20 at outer ends thereof, respectively, while no gate contacts are formed at the outer ends. Power supply lines VDD and VSS connected to the well contact regions are formed in the column direction in a second wiring layer above a first wiring layer.

Abstract: A semiconductor memory device is constructed to include a memory cell formed by a plurality of transistors, wherein each of gate wiring layers of all of the transistors forming the memory cell is arranged to extend in one direction.

Abstract: A semiconductor memory device is constructed to include a memory cell formed by a plurality of transistors, wherein each of gate wiring layers of all of the transistors forming the memory cell is arranged to extend in one direction.

Abstract: A semiconductor memory device is constructed to include a memory cell formed by a plurality of transistors, wherein each of gate wiring layers of all of the transistors forming the memory cell is arranged to extend in one direction.