Patents by Inventor Yoshio Kawai

Yoshio Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926312
    Abstract: In a case where a predetermined switching operation to a state in which a traveling position is selected from a state in which another shift position of a mechanical transmission device is selected is performed by a driver, a quick engagement command to quickly engage a predetermined engagement device is performed in a state in which output of a predetermined torque is stopped, and then a rapid garage control of increasing a rotation speed of an electric motor at a rotation speed equal to or higher than a predetermined rotation speed is executed. The rapid garage control is executed in a case where a predetermined start condition is established.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: March 12, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshio Hasegawa, Tomohiro Chimbe, Shogo Kawai
  • Patent number: 11877412
    Abstract: Provided is an electronic control device capable of suppressing failure of an electronic component due to static electricity. The electronic control device 100 includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating case 20 that holds the substrate 10, a conductive cover 30 that covers the insulating case 20, a conductive base 40 that holds the insulating case 20, and a conductive fixture 21 that fixes the insulating case 20 to the conductive base 40. A distance L1 between the conductive cover 30 and the conductive fixture 21 is equal to or less than a distance L2 between the conductive cover 30 and a conductive terminal 1a of the electronic component 1.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: January 16, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yoshio Kawai, Ryo Akiba
  • Publication number: 20240008207
    Abstract: An electronic control device includes a non-conductive resin housing; a circuit board; a metal housing; a waterproof seal material; and a conductive adhesive. The circuit board has a circuit ground (GND pattern), and is held by the resin housing. The metal housing covers the circuit board and is attached to the resin housing. The waterproof seal material seals and waterproofs the resin housing and the metal housing. The conductive adhesive is in contact with the metal housing and the circuit ground, and electrically connects the metal housing to the circuit ground at a plurality of points.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 4, 2024
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Yusuke TAKAHASHI, Yoshio KAWAI
  • Publication number: 20230380080
    Abstract: There is provided an electronic control device fixed to an in-vehicle device to be controlled. The electronic control device is a unit that includes a base attached to the in-vehicle device, a case fixed to the base, a circuit board held by the case, and an electronic component mounted on the circuit board. At least one of the case and the base is made of a resin, the case and the base are fixed with a plurality of fixing screws, and the case and the base are fixed by an adhesive disposed away from the plurality of fixing screws.
    Type: Application
    Filed: September 22, 2021
    Publication date: November 23, 2023
    Inventors: Ryo AKIBA, Yoshio KAWAI
  • Publication number: 20230354509
    Abstract: An electronic control device capable of suppressing failure of an electronic component due to static electricity is provided. An electronic control device that controls an actuator includes a circuit board, an electronic component mounted on the circuit board, a resin case (insulating case) that holds the circuit board, a metal cover (first conductive cover) that covers the resin case, an actuator cover (second conductive cover) that holds the resin case and covers an opening portion of the actuator, and a conductive portion that make the metal cover (first conductive cover) and the actuator cover (second conductive cover) conductive.
    Type: Application
    Filed: December 28, 2020
    Publication date: November 2, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Ryo AKIBA, Yoshio KAWAI
  • Patent number: 11778729
    Abstract: A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: October 3, 2023
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yasuhiro Tsuyuki, Toshiaki Ishii, Yoshio Kawai
  • Publication number: 20230292470
    Abstract: An electronic control device capable of improving cooling performance by air cooling is provided. The electronic control device includes a circuit board 6 (board), a heat-generating component 7 (heating element) mounted on the circuit board 6, a heat dissipation material 12 (thermally conductive material) that is in contact with the heat-generating component 7 and conducts heat of the heat-generating component 7, a fin-integrated housing 3 (housing) that is in contact with the heat dissipation material 12 and covers the circuit board 6, and a cover 1 that covers the fin-integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as intake holes, and a hole (1) 2 as an exhaust hole. The hole (1) 2 is formed at a position close to the heat-generating component 7 relative to the hole (2) 8 and the hole (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions away from the heat-generating component 7 relative to the hole (1) 2.
    Type: Application
    Filed: February 2, 2021
    Publication date: September 14, 2023
    Inventors: Keiko UENO, Yoshio KAWAI
  • Publication number: 20230255009
    Abstract: In order to prevent a short-circuit failure between a conductive connecting portion (1) that is provided as a countermeasure against external electrical noises and an electronic circuit, a structure is adopted where a large number of electronic components (8) are mounted on a circuit board (5) that is mounted on a base (7), a metal cover (6) is disposed so as to cover upper portions of the electronic components (8), opening portions (3) are formed in the circuit board (5) at four positions on a periphery of the circuit board (5), protruding members (12) that are integrally formed with the base (7) are disposed at four positions respectively in alignment with the positions where the opening portions (3) are formed, the protruding members (12) are made to pass through the opening portions (3) at four positions from a back surface side of the circuit board (5) to protrude to a front surface side of the circuit board 5, the conductive connecting portions (1) are arranged in an outside direction with respect to th
    Type: Application
    Filed: May 31, 2021
    Publication date: August 10, 2023
    Inventors: Yusuke TAKAHASHI, Yoshio KAWAI
  • Publication number: 20230220003
    Abstract: The objective of the present invention is to provide a method of producing each high purity imidazole dipeptide in large quantities on an industrial scale, regardless of the type of animal extract employed. The objective is achieved by a method of producing a purified imidazole dipeptide composition, including the step (1) of subjecting an animal extract treatment solution containing at least two types of imidazole dipeptides to adsorption treatment carried out by bringing the solution into contact with a hydrophobic adsorption resin to adsorb the imidazole dipeptides onto the hydrophobic adsorption resin; and the step (2) of subjecting the hydrophobic adsorption resin adsorbing the imidazole dipeptides to elution treatment using an aqueous solution to mutually separate and collect the imidazole dipeptides to purify an imidazole dipeptide.
    Type: Application
    Filed: April 28, 2021
    Publication date: July 13, 2023
    Applicant: TOKAI BUSSAN CO., LTD.
    Inventors: Akira YONEYAMA, Chiaki SANO, Hiroki NAKANISHI, Yoshio KAWAI, Yohsuke KOYAMA
  • Patent number: 11592287
    Abstract: A method for measuring a distance of diffusion of a curing catalyst for a thermosetting silicon-containing material includes the steps of: forming a silicon-containing film from a composition containing a thermosetting silicon-containing material, a curing catalyst and a solvent; coating the silicon-containing film with a photosensitive resin composition containing a resin whose solubility in alkaline developer is increased by the action of an acid, an acid generator and a solvent, and subsequently heating to prepare a substrate on which the silicon-containing film and a resin film are formed; irradiating the substrate with a high energy beam or an electron beam to generate an acid and heat-treating the substrate to increase the solubility of the resin in an alkaline developer by the action of the acid in the resin film; dissolving the resin film in an alkaline developer; and measuring a film thickness of the remaining resin.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: February 28, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Ogihara, Tsukasa Watanabe, Yoshio Kawai, Tomohiro Kobayashi, Yusuke Biyajima, Masahiro Kanayama
  • Publication number: 20230054252
    Abstract: An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.
    Type: Application
    Filed: December 25, 2020
    Publication date: February 23, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Miki HIRAOKA, Yoshio KAWAI
  • Patent number: 11572442
    Abstract: Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRX1—, —S—, —SO2—, —SO3— and —SO2NRX1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: February 7, 2023
    Assignees: International Business Machines Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Dmitry Zubarev, Hiroyuki Urano, Katsuya Takemura, Masashi Iio, Kazuya Honda, Yoshio Kawai
  • Patent number: 11555697
    Abstract: A method for measuring a distance of diffusion of a curing catalyst for a thermosetting silicon-containing material includes the steps of: forming a silicon-containing film from a composition containing a thermosetting silicon-containing material, a curing catalyst and a solvent; coating the silicon-containing film with a photosensitive resin composition containing a resin whose solubility in alkaline developer is increased by the action of an acid, an acid generator and a solvent, and subsequently heating to prepare a substrate on which the silicon-containing film and a resin film are formed; irradiating the substrate with a high energy beam or an electron beam to generate an acid and heat-treating the substrate to increase the solubility of the resin in an alkaline developer by the action of the acid in the resin film; dissolving the resin film in an alkaline developer; and measuring a film thickness of the remaining resin.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: January 17, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Ogihara, Tsukasa Watanabe, Yoshio Kawai, Tomohiro Kobayashi, Yusuke Biyajima, Masahiro Kanayama
  • Publication number: 20220394881
    Abstract: The present invention provides an in-vehicle electronic control device which further improves heat dissipation by forming a protrusion extending toward an electronic component on an inner surface of a cover portion formed of a highly thermally conductive resin in consideration of orientation of a filling material contained in the highly thermally conductive resin. An in-vehicle electronic control device of the present invention includes: a circuit board on which an electronic component is mounted; a base portion in which the circuit board is installed; and a cover portion with which the circuit board is covered together with the base portion, which is formed of a resin containing a filling material, and which has a protrusion protruding toward the electronic component, in which the protrusion is formed of a resin containing a filling material and a width of the protrusion is smaller than a width of the electronic component.
    Type: Application
    Filed: November 20, 2020
    Publication date: December 8, 2022
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Yasuhiro TSUYUKI, Yoshio KAWAI, Toshiaki ISHII, Eiichi IDE
  • Patent number: 11523493
    Abstract: An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: December 6, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Miki Hiraoka, Ryosuke Ishida, Yoshio Kawai
  • Patent number: 11500285
    Abstract: A negative-tone resist composition is provided that contains a free photoacid generator and a multifunctional polymer covalently bound to a photoacid-generating moiety, where the composition is substantially free of cross-linking agents. Multifunctional polymers useful in conjunction with the resist composition are also provided, as is a process for generating a resist image on a substrate using the present compositions and polymers.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: November 15, 2022
    Assignee: International Business Machines Corporation
    Inventors: Luisa D. Bozano, Daisuke Domon, Yoshio Kawai, Keiichi Masunaga, Martha I. Sanchez, Daniel P. Sanders, Ratnam Sooriyakumaran, Linda K. Sundberg, Satoshi Watanabe
  • Publication number: 20220361314
    Abstract: A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).
    Type: Application
    Filed: June 12, 2020
    Publication date: November 10, 2022
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Yasuhiro TSUYUKI, Toshiaki ISHII, Yoshio KAWAI
  • Publication number: 20220279671
    Abstract: Provided is an electronic control device capable of suppressing failure of an electronic component due to static electricity. The electronic control device 100 includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating case 20 that holds the substrate 10, a conductive cover 30 that covers the insulating case 20, a conductive base 40 that holds the insulating case 20, and a conductive fixture 21 that fixes the insulating case 20 to the conductive base 40. A distance L1 between the conductive cover 30 and the conductive fixture 21 is equal to or less than a distance L2 between the conductive cover 30 and a conductive terminal 1a of the electronic component 1.
    Type: Application
    Filed: July 10, 2020
    Publication date: September 1, 2022
    Inventors: Yoshio KAWAI, Ryo AKIBA
  • Publication number: 20220240395
    Abstract: Provided is an electronic device capable of enhancing salt damage resistance. An electronic device includes a circuit board 3 on which an electronic component 2 is mounted, a housing 4 that houses the circuit board 3, a connector 5 that is mounted on the circuit board 3 and is exposed to an outside of the housing via a first opening portion 4a of the housing 4, a cover member 6 that constitutes a part of a case 131 of an external device 103 to hold the housing 4, and has a second opening portion 66a to which the connector 5 is fitted, and a seal member 8 that is interposed between the connector 5 and the cover member 6, and liquid-tightly seals the case 131 of the external device 103. The housing 4 has a first wall portion 18 extending toward the cover member 6 so as to cover a part of the connector 5 at a distance, and the cover member 6 has a second barrier portion 68 extending toward the housing 4 so as to cover a part of the connector 5 at a distance.
    Type: Application
    Filed: June 2, 2020
    Publication date: July 28, 2022
    Inventors: Ryo AKIBA, Yoshio KAWAI
  • Patent number: 11333975
    Abstract: Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: May 17, 2022
    Assignees: International Business Machines Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Dmitry Zubarev, Hiroyuki Urano, Katsuya Takemura, Masashi Iio, Kazuya Honda, Yoshio Kawai