Patents by Inventor Yoshio Kawai

Yoshio Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210195758
    Abstract: A resin-sealed in-vehicle electronic control device in the present disclosure is a resin-sealed in-vehicle electronic control device including a circuit board on which an electronic component is mounted, a connector housing that electrically connects the circuit board to an external terminal, and a sealing resin fixing the connector housing to the circuit board. The connector housing has a through hole allowing communication between a second end surface located opposite to a first end surface on which the external terminal is mounted and a side surface of the connector housing adjoining the second end surface, and the sealing resin is continuous to fill at least the inside of the through hole and cover a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board.
    Type: Application
    Filed: June 11, 2019
    Publication date: June 24, 2021
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Kazuhiro SUZUKI, Yoshio KAWAI, Toshiaki ISHII, Shota EZAKI
  • Publication number: 20210195728
    Abstract: An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
    Type: Application
    Filed: June 27, 2019
    Publication date: June 24, 2021
    Inventors: Miki HIRAOKA, Ryosuke ISHIDA, Yoshio KAWAI
  • Publication number: 20210151928
    Abstract: The maximum value of the reaction force generated on the circuit substrate can be reduced. An electronic control device includes a cover having a hollow opening; a connector inserted into the opening; and a seal member having compressibility that is arranged in contact with a first position of an inner peripheral portion of the opening and that comes into close contact with the inner peripheral portion of the opening and the connector in a compressed state; where the opening has a thickness in a first direction penetrating through the hollow of the opening; an area of a hollow region which is a hollow region of the opening is reduced or maintained along the first direction; the seal member is arranged on an outer peripheral portion of the connector and inserted in the first direction to the opening together with the connector; and an area of the hollow region at the first position is smaller than an area of the hollow region at an entrance of the opening in the first direction.
    Type: Application
    Filed: February 14, 2019
    Publication date: May 20, 2021
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Ryo AKIBA, Yoshio KAWAI
  • Patent number: 10986741
    Abstract: Provided is an electronic control device that can be reduced in size and weight and can maintain high reliability even under a severe environment. The electronic control device includes: a control substrate; a connector having one end connected to the control substrate and the other end connected to an external terminal; and a housing that covers at least the control substrate and a connecting portion on the connector with the control substrate, in which the housing includes a resin and a metal plate, the metal plate includes a bend part at its outer peripheral portion, and the bend part is covered with the resin.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: April 20, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Yujiro Kaneko, Yoshio Kawai
  • Patent number: 10953822
    Abstract: Provided is an electronic control device that can reduce a usage amount of an adhesive constituting a seal member, by relieving a stress caused in the seal member disposed in a gap between a first housing part and a second housing part in a high-temperature environment. In an electronic control device including: a component mounting board mounted with an electronic component; and a first housing part and a second housing part that are fixed to each other via a seal member and define a first space that accommodates the component mounting board, at least one predetermined housing part of the first or second housing part has a recess formed on a surface facing the seal member, and a second space is formed between the recess and the seal member.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: March 23, 2021
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masato Saito, Yoshio Kawai, Ryo Akiba
  • Publication number: 20210076513
    Abstract: To provide an electronic controller by which a heat dissipation property for an electronic part can be enhanced. The electronic controller is an electronic controller including a circuit board on which an electronic part is mounted, and a housing accommodating the circuit board. A metallic plate facing the electronic part is provided at part of the housing, and an outer surface of the metallic plate is covered with a second resin film thinner than the metallic plate. An inner surface of the metallic plate is covered with a first resin film thinner than the metallic plate.
    Type: Application
    Filed: January 8, 2019
    Publication date: March 11, 2021
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Takayuki FUKUZAWA, Yoshio KAWAI, Yujiro KANEKO
  • Patent number: 10881014
    Abstract: Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: December 29, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yujiro Kaneko, Yoshio Kawai, Toshiaki Ishii
  • Patent number: 10829064
    Abstract: Provided is a highly reliable electronic control device which has not only an effect of reducing costs but also an effect of facilitating a manufacturing process. To include a control board; a connector including a terminal connected to the control board; and a housing case to which the control board and the connector are fixed. The control board has a part sealed with a sealing resin. The connector is disposed at a position facing another part of the control board, being isolated from the sealing resin by the control board and the housing case.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: November 10, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Yujiro Kaneko, Yoshio Kawai
  • Publication number: 20200340806
    Abstract: A method for measuring a distance of diffusion of a curing catalyst for a thermosetting silicon-containing material includes the steps of: forming a silicon-containing film from a composition containing a thermosetting silicon-containing material, a curing catalyst and a solvent; coating the silicon-containing film with a photosensitive resin composition containing a resin whose solubility in alkaline developer is increased by the action of an acid, an acid generator and a solvent, and subsequently heating to prepare a substrate on which the silicon-containing film and a resin film are formed; irradiating the substrate with a high energy beam or an electron beam to generate an acid and heat-treating the substrate to increase the solubility of the resin in an alkaline developer by the action of the acid in the resin film; dissolving the resin film in an alkaline developer; and measuring a film thickness of the remaining resin.
    Type: Application
    Filed: March 4, 2020
    Publication date: October 29, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Tsukasa WATANABE, Yoshio KAWAI, Tomohiro KOBAYASHI, Yusuke BIYAJIMA, Masahiro KANAYAMA
  • Publication number: 20200344900
    Abstract: Provided is an electronic control device that can be reduced in size and weight and can maintain high reliability even under a severe environment. The electronic control device includes: a control substrate; a connector having one end connected to the control substrate and the other end connected to an external terminal; and a housing that covers at least the control substrate and a connecting portion on the connector with the control substrate, in which the housing includes a resin and a metal plate, the metal plate includes a bend part at its outer peripheral portion, and the bend part is covered with the resin.
    Type: Application
    Filed: November 16, 2017
    Publication date: October 29, 2020
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Yujiro KANEKO, Yoshio KAWAI
  • Publication number: 20200278607
    Abstract: A negative-tone resist composition is provided that contains a free photoacid generator and a multifunctional polymer covalently bound to a photoacid-generating moiety, where the composition is substantially free of cross-linking agents. Multifunctional polymers useful in conjunction with the resist composition are also provided, as is a process for generating a resist image on a substrate using the present compositions and polymers.
    Type: Application
    Filed: October 11, 2018
    Publication date: September 3, 2020
    Applicants: International Business Machines Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Luisa D. Bozano, Daisuke Domon, Yoshio Kawai, Keiichi Masunaga, Martha I. Sanchez, Daniel P. Sanders, Ratnam Sooriyakumaran, Linda K. Sundberg, Satoshi Watanabe
  • Patent number: 10699917
    Abstract: An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: June 30, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki Ito, Toshiaki Ishii, Yoshio Kawai, Nobutake Tsuyuno, Yujiro Kaneko, Takayuki Fukuzawa, Masahiko Asano
  • Patent number: 10641409
    Abstract: Provided are a driver and a driver-integrated electric actuator that can suppress a temperature rise of the driver integrated with an electric actuator. A driver circuit of an electric actuator-integrated driver controls a current to be supplied to an electric actuator. A metal member (heat-conducting portion) conducts heat generated in the driver circuit. A driver sealing portion is fixed to the electric actuator and seals the driver circuit and the metal member. The metal member is extended to the electric actuator.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: May 5, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Takayuki Fukuzawa, Yoshio Kawai, Yujiro Kaneko
  • Publication number: 20200086812
    Abstract: Provided is a highly reliable electronic control device which has not only an effect of reducing costs but also an effect of facilitating a manufacturing process. To include a control board; a connector including a terminal connected to the control board; and a housing case to which the control board and the connector are fixed. The control board has a part sealed with a sealing resin. The connector is disposed at a position facing another part of the control board, being isolated from the sealing resin by the control board and the housing case.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Yujiro KANEKO, Yoshio KAWAI
  • Patent number: 10517181
    Abstract: Providing an electronic control device excellent in reliability with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin for sealing the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin; a terminal for electrically connecting the control substrate with an external device; and a fixing plate for positioning and fixing the terminal with respect to the housing case. After the terminal is fixed to the housing case by the fixing plate, the terminal is electrically connected to the control substrate and subsequently a portion of the terminal and the control substrate are sealed with the sealing resin.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: December 24, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yujiro Kaneko, Yoshio Kawai
  • Patent number: 10501031
    Abstract: Provided is a highly reliable electronic control device which has not only an effect of reducing costs but also an effect of facilitating a manufacturing process. To include a control board; a connector including a terminal connected to the control board; and a housing case to which the control board and the connector are fixed. The control board has a part sealed with a sealing resin. The connector is disposed at a position facing another part of the control board, being isolated from the sealing resin by the control board and the housing case.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: December 10, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS
    Inventors: Yujiro Kaneko, Yoshio Kawai
  • Patent number: 10448498
    Abstract: The invention provides an in-vehicle controller equipped with a heat radiation coating film which can efficiently radiate heat from a high temperature portion such as a heat generating body to a casing. An in-vehicle controller includes a heat radiation coating film, wherein the heat radiation coating film includes a first region that has a first boundary surface abutting on a base material, and a second region that has a second boundary surface where the heat radiation coating film abuts on air, wherein a thermal conductivity of the first region is higher than that of the second region, and wherein a thermal emissivity of the second region is higher than that of the first region.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 15, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Maki Ito, Yuusuke Yasuda, Toshiaki Ishii, Yoshio Kawai, Masahiko Asano
  • Publication number: 20190299881
    Abstract: Provided is an electronic control device that can reduce a usage amount of an adhesive constituting a seal member, by relieving a stress caused in the seal member disposed in a gap between a first housing part and a second housing part in a high-temperature environment. In an electronic control device including: a component mounting board mounted with an electronic component; and a first housing part and a second housing part that are fixed to each other via a seal member and define a first space that accommodates the component mounting board, at least one predetermined housing part of the first or second housing part has a recess formed on a surface facing the seal member, and a second space is formed between the recess and the seal member.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 3, 2019
    Inventors: Masato SAITO, Yoshio KAWAI, Ryo AKIBA
  • Patent number: 10396010
    Abstract: Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: August 27, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kazuhiro Suzuki, Toshiaki Ishii, Yoshio Kawai, Yujiro Kaneko
  • Patent number: 10345700
    Abstract: A negative-tone resist composition is provided that contains a free photoacid generator and a multifunctional polymer covalently bound to a photoacid-generating moiety, where the composition is substantially free of cross-linking agents. Multifunctional polymers useful in conjunction with the resist composition are also provided, as is a process for generating a resist image on a substrate using the present compositions and polymers.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: July 9, 2019
    Assignees: International Business Machines Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Luisa D. Bozano, Daisuke Domon, Yoshio Kawai, Keiichi Masunaga, Martha I. Sanchez, Daniel P. Sanders, Ratnam Sooriyakumaran, Linda K. Sundberg, Satoshi Watanabe