Patents by Inventor Yoshio Sakai

Yoshio Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119357
    Abstract: Provided are an analysis device, an analysis method, and a program capable of easily identifying a factor of a prediction error in prediction using a prediction model on the basis of various viewpoints. An analysis device (1) includes: a metric evaluation unit (2) that calculates and evaluates a plurality of types of metrics with respect to a prediction model, data of explanatory variables used in the prediction model, or data of target variables used in the prediction model; and a factor identification unit (3) that identifies a factor of an error in prediction by the prediction model according to a combination of evaluation results of the plurality of types of metrics.
    Type: Application
    Filed: February 25, 2021
    Publication date: April 11, 2024
    Applicant: NEC Corporation
    Inventors: Keita SAKUMA, Tomoya SAKAI, Yoshio KAMEDA, Hiroshi TAMANO
  • Patent number: 11950365
    Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: April 2, 2024
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Shoichiro Sakai, Koji Nitta, Yoshio Oka, Junichi Motomura, Masanao Yamashita
  • Patent number: 11646798
    Abstract: A receiving device includes a light source outputting local oscillation light, a detector detecting intermittent input of a burst light signal by using the local oscillation light, a first converter converting the detected burst optical signal into an electrical analog signal, an amplifier amplifying the analog signal according to a gain, a second converter converting the amplified analog signal into a digital signal, and a setting processor setting the gain of the amplifier and a wavelength of the local oscillation light instructed by a control device when setting a communication line with one of transmitting devices transmitting the burst optical signal, wherein, before setting the communication line, the setting processor switches the wavelength of the local oscillation light according to the burst optical signal transmitted from each of the transmitting devices, adjusts the gain of the amplifier and notifies the control device of the adjusted gain.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 9, 2023
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Yoshio Sakai, Toshiki Tanaka
  • Publication number: 20230132225
    Abstract: A purpose of the disclosure is to provide a measurement device for human bodies that can encourage a person who is reluctant to measure body composition to use the device. A measurement device has: an electric resistance value acquisition unit for acquiring an electric resistance value of one or more parts of a body of a person to be measured; and a type determination unit for using the electric resistance value to determine a type representing a physical characteristic of the person to be measured from one or more predetermined points of view.
    Type: Application
    Filed: December 23, 2022
    Publication date: April 27, 2023
    Inventors: Miyuki KODAMA, Toshiki NAGAHAMA, Yoshio SAKAI, Senri TANIDA
  • Publication number: 20220181011
    Abstract: A system includes a medical device that uses a plurality of expendables each having an expiration date, and a computer that can be connected for communication to the medical device. The medical device includes an acquisition unit configured to acquire expiration information relating to an expiration date of a first expendable included in the plurality of expendables in a state that the medical device is not connected to the first expendable, and a transmission unit configured to transmit the expiration information acquired by the acquisition unit. The computer includes a reception unit configured to receive the expiration information, and a managing unit configured to manage the expiration date of the first expendable on the basis of the expiration information received by the reception unit.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 9, 2022
    Applicant: NIHON KOHDEN CORPORATION
    Inventors: Takayuki SUGIYAMA, Fumito HORIUCHI, Yoshio SAKAI
  • Publication number: 20220109504
    Abstract: A receiving device includes a light source outputting local oscillation light, a detector detecting intermittent input of a burst light signal by using the local oscillation light, a first converter converting the detected burst optical signal into an electrical analog signal, an amplifier amplifying the analog signal according to a gain, a second converter converting the amplified analog signal into a digital signal, and a setting processor setting the gain of the amplifier and a wavelength of the local oscillation light instructed by a control device when setting a communication line with one of transmitting devices transmitting the burst optical signal, wherein, before setting the communication line, the setting processor switches the wavelength of the local oscillation light according to the burst optical signal transmitted from each of the transmitting devices, adjusts the gain of the amplifier and notifies the control device of the adjusted gain.
    Type: Application
    Filed: August 25, 2021
    Publication date: April 7, 2022
    Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Yoshio SAKAI, Toshiki TANAKA
  • Patent number: 10527937
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: January 7, 2020
    Assignee: GOO CHEMICAL CO., LTD.
    Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
  • Patent number: 10317796
    Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an ?-hydroxy alkylphenone-based photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The ?-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: June 11, 2019
    Assignee: GOO CHEMICAL CO., LTD.
    Inventors: Michiya Higuchi, Yoshio Sakai, Nobuhito Hamada, Tokuzan Miyake
  • Patent number: 10261414
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1), An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight %.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: April 16, 2019
    Assignee: GOO CHEMICAL CO., LTD.
    Inventor: Yoshio Sakai
  • Patent number: 10254647
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: April 9, 2019
    Assignee: GOO CHEMICAL CO., LTD.
    Inventor: Yoshio Sakai
  • Patent number: 10234758
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: March 19, 2019
    Assignee: GOO CHEMICAL CO., LTD.
    Inventors: Yoshio Sakai, Michiya Higuchi, Nobuhito Hamada, Tokuzan Miyake
  • Patent number: 10151976
    Abstract: A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an ?-hydroxy alkylphenone-based photopolymerization initiator.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: December 11, 2018
    Assignee: GOO CHEMICAL CO., LTD.
    Inventors: Yoshio Sakai, Michiya Higuchi
  • Publication number: 20180210336
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.
    Type: Application
    Filed: December 10, 2014
    Publication date: July 26, 2018
    Inventors: Yoshio Sakai, Michiya Higuchi, Nobuhito Hamada, Tokuzan Miyake
  • Publication number: 20180136559
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).
    Type: Application
    Filed: October 12, 2016
    Publication date: May 17, 2018
    Inventor: Yoshio Sakai
  • Publication number: 20180129135
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).
    Type: Application
    Filed: October 12, 2016
    Publication date: May 10, 2018
    Inventor: Yoshio Sakai
  • Publication number: 20180059544
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
    Type: Application
    Filed: November 7, 2017
    Publication date: March 1, 2018
    Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
  • Patent number: 9835944
    Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: December 5, 2017
    Assignee: GOO CHEMICAL CO., LTD.
    Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
  • Publication number: 20170336708
    Abstract: A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an ?-hydroxy alkylphenone-based photopolymerization initiator.
    Type: Application
    Filed: August 17, 2015
    Publication date: November 23, 2017
    Inventors: Yoshio Sakai, Michiya Higuchi
  • Patent number: 9808184
    Abstract: To provide a motor function evaluation device and a motor function evaluation method capable of evaluating a motor function of a subject comprehensively and easily. A motor function evaluation device 1 of the present invention includes a measurement base 11, a load measurement unit 14 that measures load change over time of the subject applied to the measurement base 11, and an arithmetic unit 24 that determines a balance ability indicator of the subject determined by the load change over time measured by the load measurement unit 14. The arithmetic unit 24 determines the balance ability indicator from a time interval from when the subject stands up and the load applied to the load measurement unit 14 is maximized until when the load variation is stabilized.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: November 7, 2017
    Assignee: TANITA CORPORATION
    Inventors: Yoshio Sakai, Tomoko Takehara, Tomohiro Okura, Taishi Tsuji
  • Publication number: 20170315443
    Abstract: A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents Ra—COO.
    Type: Application
    Filed: December 10, 2014
    Publication date: November 2, 2017
    Applicant: GOO CHEMICAL CO., LTD.
    Inventors: Nobuhito Hamada, Yoshio Sakai, Michiya Higuchi, Tokuzan Miyake