Abstract: A method for producing a metal matrix composite by compounding a matrix material and a reinforcing material. The metal matrix composite has a near-net shape with high dimensional accuracy and a high reinforcing material volume ratio (Vf %). The matrix material is a pure metal or an alloy, and the reinforcing material includes ceramic particles, graphite particles, and/or metal particles, and the reinforcing material is different from the matrix material. The method includes molding a reinforcing material-molded or filled body having a near-net shape and pores, in a metal mold having a cavity corresponding to the near-net shape, pre-heating the mold including the reinforcing material-molded or filled body, placing the mold in an outer shell metal mold, casting a molten matrix material into the pores of the reinforcing material-molded or filled body, thereby obtaining the metal matrix composite. The method uses the same mold throughout the entire process.

Abstract: An object of the present invention is to develop a technique for providing a novel metal matrix composite capable of stably suppressing problems of conventional composites formed with a reinforcing material and a matrix material, such as a metal, the problems being, for example, inferior mechanical properties such as tensile and bending strengths to those of single-phase materials, such as a metal, coarser surface roughness due to, for example, chipping and wear of a cutting edge caused by fall-off of a reinforcing material or collision of a blade with a hard reinforcing material during precision shaping machining, and inferior workability.

Abstract: There is provided a method for producing a metal matrix composite by which a metal matrix composite having a near-net shape of high dimensional accuracy and having a high reinforcing material volume ratio (Vf %) can easily be obtained.

Abstract: A dissimilar metal joint structure includes a first and second joining materials and a three-dimensional structural body. The structural body is joined to the top of the first joining material. Spaces in the structural body are filled with the second joining material, so that the second joining material is geometrically integrated with the structural body. The structural body is joined to the first joining material at an interface. The second joining material is charged into the spaces in the structural body and is integrated with the structural body. The first and second joining materials are joined together via the structural body. Because the second joining material is charged into the spaces in the structural body, the second joining material and the structural body are strongly joined and integrated together by the anchor effect. Inducing metallurgical reaction at the interface between the first and second joining materials can increase bonding strength.

Abstract: A channel fastener, which is capable of preventing or suppressing the plastic deformation of a leaf spring when the other device such as a fuel assembly and a tool is brought into contact therewith from the upper side, is provided. The channel fastener (6) comprises a leaf spring guard (9) having a leg body (13) formed in a roughly L-shape in horizontal cross section and extending vertically and a flat upper plate (12) connected to the leg body (13) at the upper end of the leg body (13) and extending horizontally, and a leaf spring (8) having an upper plate part (15) fixed to the leaf spring guard flat upper plate (12) and extending along the leaf spring guard flat upper plate (12) and at least two legs (17) connected to the upper plate part (15) and extending downward along the leaf spring guard leg body (13). One or a plurality of projected parts (21) projected upward are formed on the leaf spring guard fiat upper plate (12).

Abstract: A groove (21) is formed on an upper surface of sealing resin (2) in the form of a strip. A device (101) is pressed against a flat surface of a radiating fin (55) by a band plate shaped clamper (61) which is engaged with the groove (21). Due to the engagement of the clamper (61) and the groove (21), movement of the device (101) is limited. Namely, the device (101) is stably fixed to the radiating fin (55). Since the device (101) is fixed to the radiating fin (55) by the clamper (61), no hole for receiving a fastening screw is provided in the sealing resin (2). Therefore, the sealing resin (2) is reduced, whereby miniaturization of the device (101) is implemented. Thus, the device is miniaturized at no sacrifice of radiation efficiency.

Abstract: In a device (101) formed as an invertor, terminals connected to floating source pins (VS) which are provided in control circuits (31 to 33) are limited to output terminals (U, V, W). In order to hold voltages across floating source pins (VD, VS), capacitive elements (51 to 53) which are provided around the device (101) are connected to the output terminals (U, V, W). Thus, the terminals which are connected with the floating source pins (VS) are shared by the output terminals (U, V, W), whereby the numbers of the terminals and wiring patterns are reduced. Thus, the device (101) is miniaturized.

Abstract: It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.

Abstract: It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.

Abstract: It is an object to downsize a device while maintaining a high breakdown voltage. An external terminal (7) protrudes to the outside from the side wall of a sealing resin (2) and a heat sink (1) is exposed in the bottom of the sealing resin (2). A step surface (21) retracted from the exposed surface of the heat sink (1) is formed in the part of the sealing resin (2) surrounding the periphery of the heat sink (1). When using this semiconductor device, the exposed surface of the heat sink (1) is brought into surface contact with the flat surface (41a) of the radiation fin (41) and an insulation sheet (31) is interposed between the step surface (21) and the flat surface (41a), and which is pressed therebetween. The insulation sheet (31) is disposed to cover the region facing the external terminal (7) in the flat surface (41a).

Abstract: A first composite substrate including an insulating substrate, a copper pattern, and a copper layer on opposite surfaces is mounted on a metal base plate. A second composite substrate and semiconductor chips are mounted on the first composite substrate and interconnected by wire bonding. The paths of current flowing in the wires and in a copper pattern of the second composite substrate are antiparallel to the paths of current flowing in respective corresponding portions of the first composite substrate. A semiconductor device is produced in which an increasing switching frequency does not increase a surge voltage generated in ON and OFF switching operations.

Abstract: A method of casting a powdered material. A slurry is formed by dispersing metal powder or ceramic powder into a dispersing medium mainly consisting of a substance extractable by a liquid or supercritical carbon dioxide and having a melting point between 0.degree. C. and 100.degree. C., and the slurry is poured into a liquid non-absorbing mold where the slurry is cooled to freeze and solidify into a molding. The main constituent of the dispersing medium in the molding is extracted and removed by the liquid or supercritical carbon dioxide.

Abstract: A production process of pigment according to this invention comprises the steps of: a first step of forming an inorganic compound coating layer on the entire surfaces of scaly substrates made of ceramic; a second step of forming metallic glossy dots on the surfaces of the inorganic compound coating layer in a scattered manner by an electroless plating, and the metallic glossy dots occupying from 0.05 to 95% of the surfaces of the inorganic compound coating layer with respect to the total surface area of the inorganic compound coating layer; and a third step of irradiating ultraviolet ray on particles formed by the second step. The impurities and the like, which adversely affect the color hue of the pigment, have been discolored or faded away by the ultraviolet ray irradiation in the third step. Accordingly, the pigment having good weather resistance can be produced readily and stably by the present invention.

Abstract: A pigment comprises a substrate, a metallic layer formed on at least one surface of the substrate and imparting metallic luster, and a transparent inorganic compound layer formed on surfaces of the substrate and the metallic layer. Thereby, the pigment produces color by light interference of a ray reflected on a surface of the transparent inorganic compound layer and a ray passed through the transparent inorganic compound layer and reflected on a surface of the metallic layer. Thus, the pigment is excellent in coloring power and hiding power, and particularly useful for an automotive finishing paint.

Abstract: A pigment comprises a substrate, a metallic layer formed on at least one surface of the substrate and imparting metallic luster, and a transparent inorganic compound layer formed on surfaces of the substrate and the metallic layer. Thereby, the pigment produces color by light interference of a ray reflected on a surface of the transparent inorganic compound layer and a ray passed through the transparent inorganic compound layer and reflected on a surface of the metallic layer. Thus, the pigment is excellent in coloring power and hiding power, and particularly useful for an automotive finishing paint.

Abstract: A pigment of this invention comprises a ceramic scaly substrate, and metal dots or alloy dots formed on the surfaces of ceramic scaly substrate in the ratio of from 0.05 to 95% of the total surface area of ceramic scaly substrate. An inorganic compound coating film may further be formed on all over the surfaces of ceramic scaly substrate, and metal dots or alloy dots may be formed on the surfaces of inorganic compound coating film instead of on the surfaces of ceramic scaly substrate in the same ratio. Thus, this pigment gives various hues with metallic gloss feelings due to combined effect of light reflection and light scattering with metal dots or alloy dots and even light interference with two pairs of reflecting surfaces when the inorganic compound coating film is employed.

Abstract: The invention is concerned with the method of compression molding a metallic or ceramic powders. The method includes the step of maintaining a negative pressure within a first mold of noncompactable powders for intimately contacting on its inner surface a pouch-like member of thin-walled resilient material for producing a second mold, and the step of compactly charging starting powders into the second mold and exhausting air from and sealing the second mold, taking out a pre-molded body of the metallis or ceramic powders together with the second mold and the step of processing the pre-molded body by a cold or hot isostatic press.