Patents by Inventor Yoshio Terada

Yoshio Terada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11149171
    Abstract: A thermally-conductive pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 ?m.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: October 19, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Yoshio Terada
  • Patent number: 10525668
    Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 7, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Yoshio Terada, Tadashi Takahashi, Mitsuhiro Kanada
  • Patent number: 9982170
    Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 ?m or more to about 50 ?m or less and at least one further peak top existing in a particle size range from about 1 ?m or more to about 12 ?m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: May 29, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shu Sasaki, Jyunichi Nakayama, Rie Yuto, Yoshio Terada
  • Publication number: 20180066163
    Abstract: A magnetic disk drive includes a base having an opening, a cover configured to close the opening of the base, and a pressure-sensitive adhesive sheet configured to seal a gap between the base and the cover. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer, and a substrate layer configured to support the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1,680 N/cm to 3,000 N/cm. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm, the amount being the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the holding ability test is started. Helium gas is accommodated in a cavity defined by the base and the cover.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: Kenji FURUTA, Yoshio TERADA, Tadashi TAKAHASHI, Mitsuhiro KANADA
  • Publication number: 20180016481
    Abstract: Provided are a graphite pressure-sensitive adhesive tape that is suitable for improving thermal efficiency; and a graphite pressure-sensitive adhesive tape with a release liner, which contains the pressure-sensitive adhesive tape. This graphite pressure-sensitive adhesive tape with a release liner is provided with a graphite pressure-sensitive adhesive tape, which has a first pressure-sensitive adhesive layer and a graphite layer in this order, and a release liner that protects the surface of the first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer has a single layer structure.
    Type: Application
    Filed: December 27, 2016
    Publication date: January 18, 2018
    Applicants: NITTO DENKO CORPORATION, NITTO, Inc.
    Inventors: Yoshio TERADA, Kyle Robert BARNES, Midori SEGAWA
  • Patent number: 9757780
    Abstract: Electric resistance welded steel pipe excellent in deformability and fatigue properties after quenching which enables working into complicated shapes without spheroidization and which improves the fatigue properties after cold working and quenching without carburization are provided. The electric resistance welded steel pipe is characterized by containing, by mass %, C: 0.15 to 0.55%, Si: 0.01 to 0.30%, Mn: 0.5 to 1.5%, Ca: 0.0010 to 0.0030%, S: 0.0005 to 0.0050%, and O: 0.0005 to 0.0050%, having contents of Ca, O, and S satisfying 0.10?[Ca](1?124[O])/1.25[S]?2.50, having Ca-based inclusions present at the base material and electric resistance weld zone with an average particle size of 1.0 to 10 ?m and a density of 3 to 300/mm2, and having a difference ?Hv of the maximum hardness of the electric resistance weld zone and the average hardness of the base material part satisfying 100 to 500.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: September 12, 2017
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shinya Sakamoto, Takuya Hara, Yoshio Terada, Takafumi Sebayashi, Itsuroh Hiroshige
  • Publication number: 20170253773
    Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.
    Type: Application
    Filed: February 28, 2017
    Publication date: September 7, 2017
    Inventors: Kenji FURUTA, Yoshio TERADA, Tadashi TAKAHASHI, Mitsuhiro KANADA
  • Patent number: 9719615
    Abstract: The present invention provides high strength steel pipe for line pipe superior in low temperature toughness suppressed in drop of toughness of the HAZ and a method of production of the same, more particularly high strength steel plate for line pipe used as a material for high strength steel pipe for line pipe and a method of production of the same, in particular high strength steel pipe for line pipe superior in low temperature toughness characterized in that the chemical compositions of the base metal is, by mass %, C: 0.020 to 0.080%, Si: 0.01 to 0.50%, Mo: 0.01 to 0.15%, Al: 0.0005 to 0.030%, and Nb: 0.0001 to 0.030% contained in a range of C+0.25Si+0.1Mo+Al+Nb: 0.100% or less and the mixture of austenite and martensite present along prior austenite grain boundaries of the reheated part of the heat affected zone has a width of 10 ?m or less and a length of 50 ?m or less.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: August 1, 2017
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Takuya Hara, Hitoshi Asahi, Yoshio Terada
  • Patent number: 9683138
    Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left standing at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: June 20, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Yoshio Terada, Kota Nakao, Akira Hirao, Ryo Morioka
  • Publication number: 20160376473
    Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left stand at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 29, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenji FURUTA, Yoshio TERADA, Kota NAKAO, Akira HIRAO, Ryo MORIOKA
  • Publication number: 20160208142
    Abstract: A pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer including an acrylic polymer, and a release liner including a release layer made of a silicone release agent, the release layer being applied on the pressure-sensitive adhesive layer. The acrylic polymer includes at least one alkyl(meth)acrylate whose alkyl group being a linear or branched chain alkyl group with a carbon number of 1 to 18 as a monomer unit, and an amount of siloxane gas generated in a unit area of the pressure-sensitive adhesive layer where the release liner is removed is less than 20.0 ng/cm2 after heating at 120° C. for ten minutes.
    Type: Application
    Filed: January 6, 2016
    Publication date: July 21, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenji FURUTA, Yoshio TERADA, Kota NAKAO
  • Publication number: 20160152872
    Abstract: A thermally-conductive pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 ?m.
    Type: Application
    Filed: May 29, 2014
    Publication date: June 2, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenji FURUTA, Yoshio TERADA
  • Publication number: 20150299531
    Abstract: A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 ?m and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 ?m or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.
    Type: Application
    Filed: January 31, 2013
    Publication date: October 22, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Midori TOJO, Yoshio TERADA, Kenji FURUTA
  • Patent number: 9131829
    Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: September 15, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Makoto Namikawa, Yoshio Terada, Jirou Nukaga, Eiji Toyoda
  • Publication number: 20150147556
    Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 ?m or more to about 50 ?m or less and at least one further peak top existing in a particle size range from about 1 ?m or more to about 12 ?m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shu SASAKI, Jyunichi NAKAYAMA, Rie YUTO, Yoshio TERADA
  • Patent number: 8974610
    Abstract: A high-strength welded steel pipe is obtained by welding a seam weld portion of a steel plate that are formed in a pipe shape. In the high-strength welded steel pipe, a base metal of the steel plate includes, by mass %, C: 0.010% to 0.080%, Si: 0.01% to 0.50%, Mn: 0.50% to 2.00%, S: 0.0001% to 0.0050%, Ti: 0.003% to 0.030%, Mo: 0.05% to 1.00%, B: 0.0003% to 0.0100%, O: 0.0001% to 0.0080%, N: 0.006% to 0.0118%, P: limited to 0.050% or less, Al: limited to 0.008% or less, and the balance of Fe and inevitable impurities, Ceq is 0.30 to 0.53, Pcm is 0.10 to 0.20, [N]?[Ti]/3.4 is less than 0.003, the average grain size of the prior ? grains in heat affected zones in the steel plate is 250 ?m or less, and the prior ? grains include bainite and intragranular bainite.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: March 10, 2015
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Taishi Fujishiro, Takuya Hara, Yoshio Terada, Shinya Sakamoto, Hitoshi Asahi
  • Publication number: 20140311666
    Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.
    Type: Application
    Filed: June 30, 2014
    Publication date: October 23, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Makoto NAMIKAWA, Yoshio TERADA, Jirou NUKAGA, Eiji TOYODA
  • Publication number: 20140311525
    Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.
    Type: Application
    Filed: June 30, 2014
    Publication date: October 23, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Makoto NAMIKAWA, Yoshio TERADA, Jirou NUKAGA, Eiji TOYODA
  • Patent number: 8865334
    Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: October 21, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yoshio Terada, Akira Shouji, Kouki Tomioka, Kenji Furuta, Midori Tojo, Kazunori Hayashi, Shoujirou Moriki
  • Patent number: 8822058
    Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: September 2, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yoshio Terada, Akira Shouji, Kouki Tomioka, Kenji Furuta, Midori Tojo, Kazunori Hayashi, Shoujirou Moriki