Patents by Inventor Yoshio Terada
Yoshio Terada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11149171Abstract: A thermally-conductive pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 ?m.Type: GrantFiled: May 29, 2014Date of Patent: October 19, 2021Assignee: NITTO DENKO CORPORATIONInventors: Kenji Furuta, Yoshio Terada
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Patent number: 10525668Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.Type: GrantFiled: February 28, 2017Date of Patent: January 7, 2020Assignee: NITTO DENKO CORPORATIONInventors: Kenji Furuta, Yoshio Terada, Tadashi Takahashi, Mitsuhiro Kanada
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Patent number: 9982170Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 ?m or more to about 50 ?m or less and at least one further peak top existing in a particle size range from about 1 ?m or more to about 12 ?m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.Type: GrantFiled: November 25, 2014Date of Patent: May 29, 2018Assignee: NITTO DENKO CORPORATIONInventors: Shu Sasaki, Jyunichi Nakayama, Rie Yuto, Yoshio Terada
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Publication number: 20180066163Abstract: A magnetic disk drive includes a base having an opening, a cover configured to close the opening of the base, and a pressure-sensitive adhesive sheet configured to seal a gap between the base and the cover. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer, and a substrate layer configured to support the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1,680 N/cm to 3,000 N/cm. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm, the amount being the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the holding ability test is started. Helium gas is accommodated in a cavity defined by the base and the cover.Type: ApplicationFiled: November 13, 2017Publication date: March 8, 2018Inventors: Kenji FURUTA, Yoshio TERADA, Tadashi TAKAHASHI, Mitsuhiro KANADA
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Publication number: 20180016481Abstract: Provided are a graphite pressure-sensitive adhesive tape that is suitable for improving thermal efficiency; and a graphite pressure-sensitive adhesive tape with a release liner, which contains the pressure-sensitive adhesive tape. This graphite pressure-sensitive adhesive tape with a release liner is provided with a graphite pressure-sensitive adhesive tape, which has a first pressure-sensitive adhesive layer and a graphite layer in this order, and a release liner that protects the surface of the first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer has a single layer structure.Type: ApplicationFiled: December 27, 2016Publication date: January 18, 2018Applicants: NITTO DENKO CORPORATION, NITTO, Inc.Inventors: Yoshio TERADA, Kyle Robert BARNES, Midori SEGAWA
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Patent number: 9757780Abstract: Electric resistance welded steel pipe excellent in deformability and fatigue properties after quenching which enables working into complicated shapes without spheroidization and which improves the fatigue properties after cold working and quenching without carburization are provided. The electric resistance welded steel pipe is characterized by containing, by mass %, C: 0.15 to 0.55%, Si: 0.01 to 0.30%, Mn: 0.5 to 1.5%, Ca: 0.0010 to 0.0030%, S: 0.0005 to 0.0050%, and O: 0.0005 to 0.0050%, having contents of Ca, O, and S satisfying 0.10?[Ca](1?124[O])/1.25[S]?2.50, having Ca-based inclusions present at the base material and electric resistance weld zone with an average particle size of 1.0 to 10 ?m and a density of 3 to 300/mm2, and having a difference ?Hv of the maximum hardness of the electric resistance weld zone and the average hardness of the base material part satisfying 100 to 500.Type: GrantFiled: March 25, 2010Date of Patent: September 12, 2017Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Shinya Sakamoto, Takuya Hara, Yoshio Terada, Takafumi Sebayashi, Itsuroh Hiroshige
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Publication number: 20170253773Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.Type: ApplicationFiled: February 28, 2017Publication date: September 7, 2017Inventors: Kenji FURUTA, Yoshio TERADA, Tadashi TAKAHASHI, Mitsuhiro KANADA
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Patent number: 9719615Abstract: The present invention provides high strength steel pipe for line pipe superior in low temperature toughness suppressed in drop of toughness of the HAZ and a method of production of the same, more particularly high strength steel plate for line pipe used as a material for high strength steel pipe for line pipe and a method of production of the same, in particular high strength steel pipe for line pipe superior in low temperature toughness characterized in that the chemical compositions of the base metal is, by mass %, C: 0.020 to 0.080%, Si: 0.01 to 0.50%, Mo: 0.01 to 0.15%, Al: 0.0005 to 0.030%, and Nb: 0.0001 to 0.030% contained in a range of C+0.25Si+0.1Mo+Al+Nb: 0.100% or less and the mixture of austenite and martensite present along prior austenite grain boundaries of the reheated part of the heat affected zone has a width of 10 ?m or less and a length of 50 ?m or less.Type: GrantFiled: April 15, 2014Date of Patent: August 1, 2017Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Takuya Hara, Hitoshi Asahi, Yoshio Terada
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Patent number: 9683138Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left standing at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.Type: GrantFiled: June 17, 2016Date of Patent: June 20, 2017Assignee: NITTO DENKO CORPORATIONInventors: Kenji Furuta, Yoshio Terada, Kota Nakao, Akira Hirao, Ryo Morioka
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Publication number: 20160376473Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left stand at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.Type: ApplicationFiled: June 17, 2016Publication date: December 29, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kenji FURUTA, Yoshio TERADA, Kota NAKAO, Akira HIRAO, Ryo MORIOKA
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Publication number: 20160208142Abstract: A pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer including an acrylic polymer, and a release liner including a release layer made of a silicone release agent, the release layer being applied on the pressure-sensitive adhesive layer. The acrylic polymer includes at least one alkyl(meth)acrylate whose alkyl group being a linear or branched chain alkyl group with a carbon number of 1 to 18 as a monomer unit, and an amount of siloxane gas generated in a unit area of the pressure-sensitive adhesive layer where the release liner is removed is less than 20.0 ng/cm2 after heating at 120° C. for ten minutes.Type: ApplicationFiled: January 6, 2016Publication date: July 21, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kenji FURUTA, Yoshio TERADA, Kota NAKAO
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Publication number: 20160152872Abstract: A thermally-conductive pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 ?m.Type: ApplicationFiled: May 29, 2014Publication date: June 2, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kenji FURUTA, Yoshio TERADA
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Publication number: 20150299531Abstract: A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 ?m and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 ?m or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.Type: ApplicationFiled: January 31, 2013Publication date: October 22, 2015Applicant: NITTO DENKO CORPORATIONInventors: Midori TOJO, Yoshio TERADA, Kenji FURUTA
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Patent number: 9131829Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.Type: GrantFiled: June 30, 2014Date of Patent: September 15, 2015Assignee: NITTO DENKO CORPORATIONInventors: Makoto Namikawa, Yoshio Terada, Jirou Nukaga, Eiji Toyoda
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Publication number: 20150147556Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 ?m or more to about 50 ?m or less and at least one further peak top existing in a particle size range from about 1 ?m or more to about 12 ?m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.Type: ApplicationFiled: November 25, 2014Publication date: May 28, 2015Applicant: NITTO DENKO CORPORATIONInventors: Shu SASAKI, Jyunichi NAKAYAMA, Rie YUTO, Yoshio TERADA
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Patent number: 8974610Abstract: A high-strength welded steel pipe is obtained by welding a seam weld portion of a steel plate that are formed in a pipe shape. In the high-strength welded steel pipe, a base metal of the steel plate includes, by mass %, C: 0.010% to 0.080%, Si: 0.01% to 0.50%, Mn: 0.50% to 2.00%, S: 0.0001% to 0.0050%, Ti: 0.003% to 0.030%, Mo: 0.05% to 1.00%, B: 0.0003% to 0.0100%, O: 0.0001% to 0.0080%, N: 0.006% to 0.0118%, P: limited to 0.050% or less, Al: limited to 0.008% or less, and the balance of Fe and inevitable impurities, Ceq is 0.30 to 0.53, Pcm is 0.10 to 0.20, [N]?[Ti]/3.4 is less than 0.003, the average grain size of the prior ? grains in heat affected zones in the steel plate is 250 ?m or less, and the prior ? grains include bainite and intragranular bainite.Type: GrantFiled: February 4, 2011Date of Patent: March 10, 2015Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Taishi Fujishiro, Takuya Hara, Yoshio Terada, Shinya Sakamoto, Hitoshi Asahi
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Publication number: 20140311666Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Applicant: NITTO DENKO CORPORATIONInventors: Makoto NAMIKAWA, Yoshio TERADA, Jirou NUKAGA, Eiji TOYODA
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Publication number: 20140311525Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Applicant: NITTO DENKO CORPORATIONInventors: Makoto NAMIKAWA, Yoshio TERADA, Jirou NUKAGA, Eiji TOYODA
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Patent number: 8865334Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.Type: GrantFiled: July 17, 2013Date of Patent: October 21, 2014Assignee: Nitto Denko CorporationInventors: Yoshio Terada, Akira Shouji, Kouki Tomioka, Kenji Furuta, Midori Tojo, Kazunori Hayashi, Shoujirou Moriki
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Patent number: 8822058Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.Type: GrantFiled: July 17, 2013Date of Patent: September 2, 2014Assignee: Nitto Denko CorporationInventors: Yoshio Terada, Akira Shouji, Kouki Tomioka, Kenji Furuta, Midori Tojo, Kazunori Hayashi, Shoujirou Moriki