Abstract: Provided is a thermally-conductive double-sided adhesive sheet capable of improving the workability when adherends are bonded to or detached from each other. The thermally-conductive double-sided adhesive sheet includes an adhesive agent layer formed of a thermally-conductive adhesive agent composition formed into a sheet, which composition including a thermally-conductive material and an acrylic polymer component, wherein a strong adhesive agent layer forming one side and a weak adhesive agent layer forming the other side of the thermally-conductive double-sided adhesive sheet are laminated in such a way that the adhesive force of the one side of the thermally-conductive double-sided adhesive sheet to an adherend is stronger than the adhesive force of the other side of the thermally-conductive double-sided adhesive sheet to the adherend.

Abstract: A high-strength welded steel pipe is obtained by welding a seam weld portion of a steel plate that are formed in a pipe shape. In the high-strength welded steel pipe, a base metal of the steel plate includes, by mass %, C: 0.010% to 0.080%, Si: 0.01% to 0.50%, Mn: 0.50% to 2.00%, S: 0.0001% to 0.0050%, Ti: 0.003% to 0.030%, Mo: 0.05% to 1.00%, B: 0.0003% to 0.0100%, O: 0.0001% to 0.0080%, N: 0.006% to 0.0118%, P: limited to 0.050% or less, Al: limited to 0.008% or less, and the balance of Fe and inevitable impurities, Ceq is 0.30 to 0.53, Pcm is 0.10 to 0.20, [N]—[Ti]/3.4 is less than 0.003, the average grain size of the prior ? grains in heat affected zones in the steel plate is 250 ?m or less, and the prior ? grains include bainite and intragranular bainite.

Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.

Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Abstract: Electric resistance welded steel pipe excellent in deformability and fatigue properties after quenching which enables working into complicated shapes without spheroidization and which improves the fatigue properties after cold working and quenching without carburization are provided. The electric resistance welded steel pipe is characterized by containing, by mass %, C: 0.15 to 0.55%, Si: 0.01 to 0.30%, Mn: 0.5 to 1.5%, Ca: 0.0010 to 0.0030%, S: 0.0005 to 0.0050%, and O: 0.0005 to 0.0050%, having contents of Ca, O, and S satisfying 0.10?[Ca](1?124[O])/1.25[S]?2.50, having Ca-based inclusions present at the base material and electric resistance weld zone with an average particle size of 1.0 to 10 ?m and a density of 3 to 300/mm2, and having a difference ?Hv of the maximum hardness of the electric resistance weld zone and the average hardness of the base material part satisfying 100 to 500.

Abstract: An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 ?m or more and 300 ?m or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 ?m or more and 20 ?m or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 ?m and 60 ?m or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 ?m and 300 ?m or less.

Abstract: A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

Abstract: A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

Abstract: Provided is a hydrophilic sheet which has high wettability by water, from which an adherent fouling substance or adherent foreign matter can be easily removed by washing with water, and which can be prevented from fogging due to water-drop adhesion. Also provided is a method of imparting high wettability by water to the surface of any appropriate base material. A hydrophilic sheet of the present invention includes, on a surface of a support, an assembly layer of oblique columnar structures each protruding at an elevation angle from the surface of less than 90°, and the surface of the assembly layer has a water contact angle of 10° or less.

Abstract: A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.

Abstract: Disclosed is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a base material sheet, a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the pressure-sensitive adhesive composition, in which pieces of the layered clay mineral are arranged substantially perpendicular to the base material sheet.

Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Abstract: A cleaning sheet comprises a cleaning layer provided on one side of a base material, from which cleaning layer F?, Cl?, Br?, NO2?, NO3?, PO43?, SO42?, Na+, NH4+ and K+ are extractable with pure water each in an amount of not greater than 20 ppm, when extracted under boiling at 120° C. for 1 hour, and a pressure-sensitive adhesive layer provided on the other side of the base material, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer. The present disclosure also relates to a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment.

Abstract: The present invention provides high strength steel pipe for line pipe superior in low temperature toughness suppressed in drop of toughness of the HAZ and a method of production of the same, more particularly high strength steel plate for line pipe used as a material for high strength steel pipe for line pipe and a method of production of the same, in particular high strength steel pipe for line pipe superior in low temperature toughness characterized in that the chemical compositions of the base metal is, by mass %, C: 0.020 to 0.080%, Si: 0.01 to 0.50%, Mo: 0.01 to 0.15%, Al: 0.0005 to 0.030%, and Nb: 0.0001 to 0.030% contained in a range of C+0.25Si+0.1Mo+Al+Nb: 0.100% or less and the mixture of austenite and martensite present along prior austenite grain boundaries of the reheated part of the heat affected zone has a width of 10 ?m or less and a length of 50 ?m or less.

Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Abstract: Provided are a pressure-sensitive adhesive tape, which has a needed pressure-sensitive adhesive force for an adherend, can remove even foreign matter at a submicron level without contaminating a cleaning site, is excellent in heat resistance, exerts a sufficient pressure-sensitive adhesive force and a sufficient cohesive force even at a high temperature, and can be easily peeled without generating any adhesive residue on the adherend upon peeling from the adherend after its use, and a method of producing the tape. The pressure-sensitive adhesive tape of the present invention includes, on a surface of a support, an assembly layer of oblique columnar structures each protruding at an elevation angle of less than 90° from the surface of the support, the oblique columnar structures each having an aspect ratio of 1 or more.