Patents by Inventor Yoshio Uematsu
Yoshio Uematsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7168154Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: October 13, 2004Date of Patent: January 30, 2007Assignee: Hitachi Global Storage Technologies Netherlands BVInventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Patent number: 7161766Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. The base plate structure comprises a band portion having conveying holes and positioning holes formed at a predetermined pith respectively in a longitudinal direction. A plurality of the base plates are disposed via connecting portions integrally formed at a predetermined pitch at edges on one side of the band portion.Type: GrantFiled: August 30, 2004Date of Patent: January 9, 2007Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Takao Kidachi, Tadaaki Tomiyama, Yoshio Uematsu, Hiromi Ishikawa Ishikawa, Tatsushi Yoshida, Hiroyoshi Yokome, Yukihiro Nakamura, Hisashi Ohyama, Tatsumi Tsuchiya
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Patent number: 7137189Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: October 13, 2004Date of Patent: November 21, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Patent number: 7137188Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: October 13, 2004Date of Patent: November 21, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20060238921Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2?4S.Type: ApplicationFiled: April 21, 2005Publication date: October 26, 2006Applicant: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Yuhsuke Matsumoto, Tatsushi Yoshida, Takaaki Murokawa, Tatsumi Tsuchiya, Yoshio Uematsu, Nobuyuki Hashi
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Publication number: 20060193084Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.Type: ApplicationFiled: February 15, 2006Publication date: August 31, 2006Applicant: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Takuya Satoh, Tatsushi Yoshida, Tatsumi Tsuchiya, Yoshio Uematsu
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Publication number: 20060053621Abstract: Embodiments of the invention correct the static attitude of a head gimbal assembly (HGA) with high accuracy. In one embodiment, a vector group that constitutes the shortest path from the initial attitude of the HGA to the final anticipatory attitude is formed. The vector group is formed of the plural displacement vectors that give a variety of variations in static attitude when unit shots of laser light are performed on the HGA. Displacement vectors are synthesized while the displacement vectors each giving the anticipatory attitude closest to a target attitude are being selected in order from the initial attitude, toward the target attitude. Unit shots equivalent to the number of displacement vectors are performed on irradiating positions related to the displacement vectors included in the vector group. The static attitude existing after the unit shots is measured, then the displacement vectors are corrected, and a vector group constituting the new shortest path is formed.Type: ApplicationFiled: September 15, 2005Publication date: March 16, 2006Applicant: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Yohtaroh Ichimura, Kohichiroh Naka, Yoshio Uematsu, Tatsushi Yoshida
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Patent number: 6989969Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: October 13, 2004Date of Patent: January 24, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Patent number: 6985335Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: October 13, 2004Date of Patent: January 10, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20050199680Abstract: Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.Type: ApplicationFiled: February 25, 2005Publication date: September 15, 2005Applicant: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Takaaki Murokawa, Yoshio Uematsu, Tatsushi Yoshida, Nobuyuki Hashi, Hiroyasu Tsuchida, Takuma Muraki
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Publication number: 20050195529Abstract: Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.Type: ApplicationFiled: March 2, 2005Publication date: September 8, 2005Applicant: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: Hiroyasu Tsuchida, Tatsumi Tsuchiya, Takaaki Murokawa, Yuhsuke Matsumoto, Yoshio Uematsu, Tatsuya Tanaka
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Publication number: 20050078415Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: ApplicationFiled: October 13, 2004Publication date: April 14, 2005Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Patent number: 6879465Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: June 11, 2003Date of Patent: April 12, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Patent number: 6871392Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: GrantFiled: September 26, 2002Date of Patent: March 29, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20050063096Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: ApplicationFiled: October 13, 2004Publication date: March 24, 2005Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20050047020Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: ApplicationFiled: October 13, 2004Publication date: March 3, 2005Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20050047009Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: ApplicationFiled: October 13, 2004Publication date: March 3, 2005Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20050047022Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.Type: ApplicationFiled: October 13, 2004Publication date: March 3, 2005Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu
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Publication number: 20050028353Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.Type: ApplicationFiled: August 30, 2004Publication date: February 10, 2005Inventors: Takao Kidachi, Tadaaki Tomiyama, Yoshio Uematsu, Hiromi Ishikawa, Tatsushi Yoshida, Hiroyoshi Yokome, Yukihiro Nakamura, Hisashi Ohyama, Tatsumi Tsuchiya
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Publication number: 20050022372Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.Type: ApplicationFiled: August 30, 2004Publication date: February 3, 2005Inventors: Takao Kidachi, Tadaaki Tomiyama, Yoshio Uematsu, Hiromi Ishikawa, Tatsushi Yoshida, Hiroyoshi Yokome, Yukihiro Nakamura, Hisashi Ohyama, Tatsumi Tsuchiya