Abstract: Provided is an active pen used with electronic equipment including a touch sensor that is of a capacitive system and that includes sensor electrodes, the active pen including a receiving circuit that receives an uplink signal from the electronic equipment, a transmitting circuit that transmits a downlink signal to the electronic equipment, an attendant function circuit that performs an attendant function different from reception of the uplink signal and transmission of the downlink signal, and a controller that controls operation of the receiving circuit, the transmitting circuit, or the attendant function circuit according to a plurality of kinds of operation modes including a normal mode and a low power consumption mode.

Abstract: A wafer processing method includes: a resin film coating step of coating an upper surface of a wafer with a water-soluble resin and coating a dicing tape exposed between the wafer and a frame with a water-soluble resin, and solidifying the water-soluble resin to form a resin film, a partial resin film removing step of removing the resin film from regions to be divided of the wafer to partially expose the upper surface of the wafer, an etching step of subjecting the regions to be divided of the wafer to plasma etching to divide the wafer into individual device chips, and a whole resin film removing step of cleaning a frame unit to remove wholly the resin film.

Abstract: A processing method of a workpiece in which the workpiece with a plate shape is processed by using a vacuum chamber is provided. In the processing method of a workpiece, a negative pressure is caused to act on a holding surface from a suction path, and suction holding of the workpiece is executed by a chuck table. Then, the gas pressure in the vacuum chamber is reduced to at least 50 Pa and at most 5000 Pa. Then, while the suction holding of the workpiece is executed, an inert gas in a plasma state is supplied to the workpiece, and voltages are applied to electrodes disposed in the chuck table to execute electrostatic adhesion of the workpiece by the chuck table. Then, a processing gas in a plasma state is supplied, and dry etching of the workpiece is executed.

Abstract: A wafer processing method includes: a resin film coating step of coating an upper surface of a wafer with a water-soluble resin and coating a dicing tape exposed between the wafer and a frame with a water-soluble resin, and solidifying the water-soluble resin to form a resin film, a partial resin film removing step of removing the resin film from regions to be divided of the wafer to partially expose the upper surface of the wafer, an etching step of subjecting the regions to be divided of the wafer to plasma etching to divide the wafer into individual device chips, and a whole resin film removing step of cleaning a frame unit to remove wholly the resin film.

Abstract: There is provided a processing method of a wafer. The processing method includes a frame unit preparation step of fixing the wafer in an opening of an annular frame by an adhesion tape to prepare a frame unit and a frame unit holding step of attracting and holding the wafer of the frame unit by an chuck table in an etching chamber with the intermediary of the adhesion tape. The processing method includes also a shielding step of covering the annular frame and (or) an annular region of the adhesion tape by a cover member to shield the annular frame and (or) the annular region from an external space and a dry etching step of supplying a gas to the etching chamber and executing dry etching for the wafer after execution of the frame unit holding step and the shielding step.

Abstract: A processing method of a workpiece in which the workpiece with a plate shape is processed by using a vacuum chamber is provided. In the processing method of a workpiece, a negative pressure is caused to act on a holding surface from a suction path, and suction holding of the workpiece is executed by a chuck table. Then, the gas pressure in the vacuum chamber is reduced to at least 50 Pa and at most 5000 Pa. Then, while the suction holding of the workpiece is executed, an inert gas in a plasma state is supplied to the workpiece, and voltages are applied to electrodes disposed in the chuck table to execute electrostatic adhesion of the workpiece by the chuck table. Then, a processing gas in a plasma state is supplied, and dry etching of the workpiece is executed.

Abstract: There is provided a processing method of a wafer. The processing method includes a frame unit preparation step of fixing the wafer in an opening of an annular frame by an adhesion tape to prepare a frame unit and a frame unit holding step of attracting and holding the wafer of the frame unit by an chuck table in an etching chamber with the intermediary of the adhesion tape. The processing method includes also a shielding step of covering the annular frame and (or) an annular region of the adhesion tape by a cover member to shield the annular frame and (or) the annular region from an external space and a dry etching step of supplying a gas to the etching chamber and executing dry etching for the wafer after execution of the frame unit holding step and the shielding step.

Abstract: To provide a novel expanded polystyrene-based resin formed product that is excellent in expandability, mechanical strength, hardness, antistatic property, heat resistance and flame retardancy and does not generate squeak noises, and a production method thereof. Provided is expandable polystyrene-based resin particles having rubber and melamine cyanurate on the surfaces thereof.

Abstract: A linear encoder includes a scale disposed within a housing and a scanning unit that is displaceable in a measuring direction relative to the scale. The scanning unit includes a scanning head disposed inside of the housing opposite to the scale such that the scale is scannable by the scanning head, as well as a mount to which the scanning head is fastened, and a driving component, via which the mount is coupled to a mounting base disposed outside of the housing. A vibration damper suppresses vibrations transversely to the measuring direction. The vibration damper is disposed on the mount or on the scanning head, and includes a damping mass and an elastic element. The damping mass is fastened by the elastic element to an attachment surface of the mount or of the scanning head.

Abstract: A plasma etching apparatus includes: a vacuum chamber; a rotatable electrostatic chuck table for holding a workpiece in the vacuum chamber; a nozzle for supplying a plasma etching gas to part of the workpiece held on the electrostatic chuck table; a nozzle oscillating unit for oscillating the nozzle in such a manner as to describe a horizontal arcuate locus between a region corresponding to the center of the electrostatic chuck table and a region corresponding to the outer periphery of the electrostatic chuck table; and a control unit that controls the rotation amount of the electrostatic chuck table and the position of the nozzle to thereby position the nozzle into a region corresponding to an arbitrary part of the workpiece held on the electrostatic chuck table.

Abstract: A method of processing a wafer includes a plasma etching step of supplying an etching gas in a plasma state to the wafer to remove processing strains, debris, or modified layers. The plasma etching step includes turning an etching gas into a plasma state outside of a vacuum chamber which houses the wafer therein and delivering the etching gas in the plasma state into the vacuum chamber through a supply nozzle connected to the vacuum chamber.

Abstract: A method of processing a wafer includes a plasma etching step of supplying an etching gas in a plasma state to the wafer to remove processing strains, debris, or modified layers. The plasma etching step includes turning an etching gas into a plasma state outside of a vacuum chamber which houses the wafer therein and delivering the etching gas in the plasma state into the vacuum chamber through a supply nozzle connected to the vacuum chamber.

Abstract: A linear encoder includes a scale disposed within a housing and a scanning unit that is displaceable in a measuring direction relative to the scale. The scanning unit includes a scanning head disposed inside of the housing opposite to the scale such that the scale is scannable by the scanning head, as well as a mount to which the scanning head is fastened, and a driving component, via which the mount is coupled to a mounting base disposed outside of the housing. A vibration damper suppresses vibrations transversely to the measuring direction. The vibration damper is disposed on the mount or on the scanning head, and includes a damping mass and an elastic element. The damping mass is fastened by the elastic element to an attachment surface of the mount or of the scanning head.

Abstract: A plasma etching apparatus includes: a vacuum chamber; a rotatable electrostatic chuck table for holding a workpiece in the vacuum chamber; a nozzle for supplying a plasma etching gas to part of the workpiece held on the electrostatic chuck table; a nozzle oscillating unit for oscillating the nozzle in such a manner as to describe a horizontal arcuate locus between a region corresponding to the center of the electrostatic chuck table and a region corresponding to the outer periphery of the electrostatic chuck table; and a control unit that controls the rotation amount of the electrostatic chuck table and the position of the nozzle to thereby position the nozzle into a region corresponding to an arbitrary part of the workpiece held on the electrostatic chuck table.

Abstract: To provide a novel expanded polystyrene-based resin formed product that is excellent in expandability, mechanical strength, hardness, antistatic property, heat resistance and flame retardancy and does not generate squeak noises, and a production method thereof. Provided is expandable polystyrene-based resin particles having rubber and melamine cyanurate on the surfaces thereof.

Abstract: This microlens array comprises hexagonal field diaphragms in inverted-image-forming positions, i.e., microlenses, a plurality of which are arranged in the direction perpendicular to a direction of scanning, and from which rows of microlenses are configured. Further, for three rows of microlenses, microlens rows are arranged with offset by (a length S) in a direction perpendicular to the direction of scanning such that triangular portions of the hexagonal field diaphragms overlap in the direction of scanning. Furthermore, microlens row groups, which are configured from three microlens rows, are arranged with offset in the direction perpendicular to the direction of scanning in increments of a minute amount of shifting F (for example, 2 ?m). Thereby, this scanning exposure device using a microlens array is capable of preventing exposure ununiformity even in the direction perpendicular to the direction of scanning.

Abstract: This microlens array comprises hexagonal field diaphragms in inverted-image-forming positions, i.e., microlenses, a plurality of which are arranged in the direction perpendicular to a direction of scanning, and from which rows of microlenses are configured. Further, for three rows of microlenses, microlens rows are arranged with offset by (a length S) in a direction perpendicular to the direction of scanning such that triangular portions of the hexagonal field diaphragms overlap in the direction of scanning. Furthermore, microlens row groups, which are configured from three microlens rows, are arranged with offset in the direction perpendicular to the direction of scanning in increments of a minute amount of shifting F (for example, 2 ?m). Thereby, this scanning exposure device using a microlens array is capable of preventing exposure ununiformity even in the direction perpendicular to the direction of scanning.

Abstract: A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the conductive pattern to outside; a second substrate having a conductive pattern formed on a face opposed to the other face of first substrate and a conductive bump on the conductive pattern integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes.

Abstract: An engine of the present invention comprises a valve body configured to open and close ports and formed in a cylinder head, a drive cam mechanism operable in association with a crankshaft by a driving power transmission mechanism, a pivot cam mechanism which is configured to be pivoted according to movement of the drive cam mechanism to cause the valve body to open and close and is configured to change a pivot state to change a lift characteristic of the valve; and a servo motor configured to change the pivot state of the pivot cam mechanism, wherein the servo motor is positioned at one end portion of the pivot cam mechanism such that the servo motor is distant from the driving power transmission mechanism.

Abstract: A pivot cam mechanism included in a valve operating system is configured such that a coupling pin is supported at a pivot member in a position closer to a camshaft than a control shaft, and the pivot member and the driven member are integrally pivotable according to the rotation of the drive cam while changing relative attitudes of the driven member and the pivot member. Positions and shapes of the drive cam, the driven member, and the pivot member are designed so that a valve maximum acceleration point at which an acceleration of a valve body is at a maximum is located in a front part of a valve acceleration period in which the acceleration of the valve body has a positive value while the drive cam is rotating once.