Patents by Inventor Yoshio Yamada
Yoshio Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8671709Abstract: The invention provides a method and an apparatus for producing frozen products using a liquid cooling freezing method, enabling the number of times for replenishing a freezing solvent to be reduced and completely preventing alcoholic odor from occurring. The apparatus 1 for producing frozen products according to the invention includes, in a freezing chamber 2, a freezing tank 3 having a freezing solvent 30 stored therein for immersing therein products and freezing them, gas jetting units 4 for jetting a gas having a temperature of 0° C. or below against the products frozen in the freezing tank 3 to remove the freezing solvent adhering to the products, and a transferring device 5 for transferring the products to be frozen in the freezing chamber 2 in a manner that the products to be frozen are immersed in the freezing solvent 30 in the freezing tank 3 and then lifted from the freezing tank 3 and further the freezing solvent adhering to the products is removed by the gas jetting units 4.Type: GrantFiled: August 11, 2008Date of Patent: March 18, 2014Assignee: Technican Co., Ltd.Inventor: Yoshio Yamada
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Patent number: 8518172Abstract: An aqueous inorganic zinc-rich coating composition employs zinc powder and a vehicle containing an aqueous solution containing a specific alkali silicate, an ammonium ion, and a halide ion at specific concentrations; a vehicle containing an aqueous solution containing the above ingredients at specific concentrations and additionally an alkali halide at a specific concentration; or a vehicle containing an aqueous solution containing a specific alkali silicate and an alkali halide at specific concentrations, wherein the vehicle and zinc powder are contained at a specific ratio.Type: GrantFiled: March 30, 2009Date of Patent: August 27, 2013Assignee: DAI Nippon Toryo Co., Ltd.Inventors: Toshinori Morizane, Yoshio Yamada, Junichi Takagishi, Hidenori Matsuno, Masaki Ohshiba
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Patent number: 8456184Abstract: A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring (17) that presses a portion near an edge portion of a surface of a probe head (15) from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head (15) is positioned inside of an outer edge of the probe head (15), and a point (P) of application of force applied from the retainer (16) that presses a portion near an edge portion of a space transformer (14) over an entire circumference in the direction of the substrate to the space transformer (14) is positioned inside of an outer edge of the space transformer (14).Type: GrantFiled: March 12, 2008Date of Patent: June 4, 2013Assignee: NHK Spring Co., Ltd.Inventors: Yoshio Yamada, Hiroshi Nakayama, Mitsuhiro Nagaya, Tsuyoshi Inuma, Takashi Akao
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Publication number: 20120258321Abstract: The object of the present invention is to provide a silicone-based copolymer which has excellent long-term antifouling property even in a dry-wet alternate portion of a ship and the like or a portion thereof near the surface of water, is excellent also in mechanical strength and recoatability and exhibits high antifouling performance even if an antifouling agent is not added, and an antifouling coating composition containing the copolymer.Type: ApplicationFiled: December 16, 2010Publication date: October 11, 2012Applicant: CHUGOKU MARINE PAINTS, LTD.Inventors: Takaharu Doumae, Yoshio Yamada, Masaaki Oya, Fumio Hamazu, Makoto Tsuboi
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Publication number: 20120137709Abstract: Provided is an apparatus and a method for freezing the foods at a high quality without reducing the freezing process efficiency.Type: ApplicationFiled: June 17, 2010Publication date: June 7, 2012Inventor: Yoshio Yamada
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Patent number: 8149008Abstract: A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.Type: GrantFiled: July 16, 2008Date of Patent: April 3, 2012Assignee: NHK Spring Co., Ltd.Inventors: Yoshio Yamada, Hiroshi Nakayama, Tsuyoshi Inuma, Takashi Akao
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Patent number: 8149006Abstract: A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires.Type: GrantFiled: December 4, 2006Date of Patent: April 3, 2012Assignee: NHK Spring Co., Ltd.Inventors: Hiroshi Nakayama, Mitsuhiro Nagaya, Yoshio Yamada
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Patent number: 8049525Abstract: A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card (101) that holds a plurality of probes (1) for electrically connecting a wafer (31) as a test object and a circuitry for generating a signal for a test with respect to the wafer (31), adjusting screws (22) as at least part of an inclination changing unit are provided. The inclination changing unit changes a degree of inclination of the probe card (101) with respect to a mounting reference surface (S1) of a prober (202) for mounting the probe card (101) thereon.Type: GrantFiled: July 26, 2007Date of Patent: November 1, 2011Assignee: NHK Spring Co., Ltd.Inventors: Yoshio Yamada, Hiroshi Nakayama, Mitsuhiro Nagaya, Tsuyoshi Inuma, Takashi Akao
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Patent number: 8018242Abstract: A probe card includes probes that are made of a conductive material and come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate for connection of wires of the substrate; a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires; and a plurality of first post members that have a height greater than the thickness of the substrate, and are embedded in a portion of the substrate on which the interposer is stacked.Type: GrantFiled: December 4, 2006Date of Patent: September 13, 2011Assignee: NHK Spring Co., Ltd.Inventors: Hiroshi Nakayama, Mitsuhiro Nagaya, Yoshio Yamada
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Publication number: 20110091619Abstract: The invention provides a method and an apparatus for producing frozen products using a liquid cooling freezing method, enabling the number of times for replenishing a freezing solvent to be reduced and completely preventing alcoholic odor from occurring. The apparatus 1 for producing frozen products according to the invention includes, in a freezing chamber 2, a freezing tank 3 having a freezing solvent 30 stored therein for immersing therein products and freezing them, gas jetting units 4 for jetting a gas having a temperature of 0° C. or below against the products frozen in the freezing tank 3 to remove the freezing solvent adhering to the products, and a transferring device 5 for transferring the products to be frozen in the freezing chamber 2 in a manner that the products to be frozen are immersed in the freezing solvent 30 in the freezing tank 3 and then lifted from the freezing tank 3 and further the freezing solvent adhering to the products is removed by the gas jetting units 4.Type: ApplicationFiled: August 11, 2008Publication date: April 21, 2011Inventor: Yoshio Yamada
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Patent number: 7898272Abstract: A probe card includes a flat wiring board having a wiring pattern corresponding to a circuit structure for generating a signal for a test, an interposer that is stacked on the wiring board and relays wirings of the wiring board, a space transformer that is stacked on the interposer and fastened thereto by an adhesive, transforms a space between the wirings relayed by the interposer, and leads the wirings out to a surface opposite a surface facing the interposer, and a probe head that is stacked on the space transformer and houses and holds a plurality of probes.Type: GrantFiled: June 4, 2007Date of Patent: March 1, 2011Assignee: NHK Spring Co., Ltd.Inventors: Shunsuke Sasaki, Tsuyoshi Inuma, Yoshio Yamada, Mitsuhiro Nagaya, Takashi Akao, Hiroshi Nakayama
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Publication number: 20110030584Abstract: An aqueous inorganic zinc-rich coating composition employs zinc powder and a vehicle containing an aqueous solution containing a specific alkali silicate, an ammonium ion, and a halide ion at specific concentrations; a vehicle containing an aqueous solution containing the above ingredients at specific concentrations and additionally an alkali halide at a specific concentration; or a vehicle containing an aqueous solution containing a specific alkali silicate and an alkali halide at specific concentrations, wherein the vehicle and zinc powder are contained at a specific ratio.Type: ApplicationFiled: March 30, 2009Publication date: February 10, 2011Applicant: DAI NIPPON TORYO CO., LTD.Inventors: Toshinori Morizane, Yoshio Yamada, Junichi Takagishi, Hidenori Matsuno, Masaki Ohshiba
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Patent number: 7795892Abstract: Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.Type: GrantFiled: December 20, 2006Date of Patent: September 14, 2010Assignee: NHK Spring Co., Ltd.Inventors: Yoshio Yamada, Hiroshi Nakayama, Mitsuhiro Nagaya, Shogo Imuta
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Publication number: 20100219852Abstract: A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.Type: ApplicationFiled: July 16, 2008Publication date: September 2, 2010Applicant: NHK Spring Co., LtdInventors: Yoshio Yamada, Hiroshi Nakayama, Tsuyoshi Inuma, Takashi Akao
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Publication number: 20100164518Abstract: A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring (17) that presses a portion near an edge portion of a surface of a probe head (15) from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head (15) is positioned inside of an outer edge of the probe head (15), and a point (P) of application of force applied from the retainer (16) that presses a portion near an edge portion of a space transformer (14) over an entire circumference in the direction of the substrate to the space transformer (14) is positioned inside of an outer edge of the space transformer (14).Type: ApplicationFiled: March 12, 2008Publication date: July 1, 2010Applicant: NHK Spring Co., LtdInventors: Yoshio Yamada, Hiroshi Nakayama, Mitsuhiro Nagaya, Tsuyoshi Inuma, Takashi Akao
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Publication number: 20100052707Abstract: A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires.Type: ApplicationFiled: December 4, 2006Publication date: March 4, 2010Applicant: NHK Spring Co.,LtdInventors: Hiroshi Nakayama, Mitsuhiro Nagaya, Yoshio Yamada
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Publication number: 20100001748Abstract: A probe card includes a flat wiring board having a wiring pattern corresponding to a circuit structure for generating a signal for a test, an interposer that is stacked on the wiring board and relays wirings of the wiring board, a space transformer that is stacked on the interposer and fastened thereto by an adhesive, transforms a space between the wirings relayed by the interposer, and leads the wirings out to a surface opposite a surface facing the interposer, and a probe head that is stacked on the space transformer and houses and holds a plurality of probes.Type: ApplicationFiled: June 4, 2007Publication date: January 7, 2010Applicant: NHK SPRING CO., LTD.Inventors: Shunsuke Sasaki, Tsuyoshi Inuma, Yoshio Yamada, Mitsuhiro Nagaya, Takashi Akao, Hiroshi Nakayama
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Publication number: 20100001752Abstract: A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card (101) that holds a plurality of probes (1) for electrically connecting a wafer (31) as a test object and a circuitry for generating a signal for a test with respect to the wafer (31), adjusting screws (22) as at least part of an inclination changing unit are provided. The inclination changing unit changes a degree of inclination of the probe card (101) with respect to a mounting reference surface (S1) of a prober (202) for mounting the probe card (101) thereon.Type: ApplicationFiled: July 26, 2007Publication date: January 7, 2010Applicant: NHK SPRING CO., LTD.Inventors: Yoshio Yamada, Hiroshi Nakayama, Mitsuhiro Nagaya, Tsuyoshi Inuma, Takashi Akao
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Patent number: 7628029Abstract: A nonfreezing liquid is hermetically enclosed in one or more brine bags of a flexible plastic material. In the case using an existing refrigerator equipped with a freezer compartment, the brine bags are placed in a brine bag receiving vessel adapted to be located in the freezer compartment, and a cooling plate is provided at a location at the uppermost one of the brine bags. In freezing, food to be frozen is inserted between the cooling plate and the brine bags or between the brine bags so that at least the greater part of outer peripheries of the food is surrounded by a low temperature environment to substantially the same extent as immersion of the food in the nonfreezing liquid, thereby substantially realizing the liquid surface contact freezing. In the case of a newly fabricated refrigerator, the brine bags are directly placed in an exclusive freezer compartment and further cold air is forced against the cooling plate, thereby obtaining more complete frozen food.Type: GrantFiled: August 27, 2004Date of Patent: December 8, 2009Assignee: Technican Company Ltd.Inventor: Yoshio Yamada
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Publication number: 20090219043Abstract: A probe card includes probes that are made of a conductive material and come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate for connection of wires of the substrate; a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires; and a plurality of first post members that have a height greater than the thickness of the substrate, and are embedded in a portion of the substrate on which the interposer is stacked.Type: ApplicationFiled: December 4, 2006Publication date: September 3, 2009Applicant: NHK SPRING CO., LTD.Inventors: Hiroshi Nakayama, Mitsuhiro Nagaya, Yoshio Yamada