Patents by Inventor Yoshitaka Hashimoto
Yoshitaka Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240329891Abstract: An image forming apparatus includes an interface, a printer, and a processor. The interface acquires first printing data. The printer prints an image on a medium. The processor extracts content blocks from the first printing data, rearranges the content blocks to generate second printing data, and controls the printer to print an image on the medium based on the second printing data.Type: ApplicationFiled: March 27, 2023Publication date: October 3, 2024Applicant: Toshiba Tec Kabushiki KaishaInventors: Kazunori HIRABAYASHI, Yoshitaka HASHIMOTO
-
Publication number: 20240320458Abstract: An image processing apparatus includes an interface and a processor. The interface acquires printing data including an image. If length in a longitudinal direction of the image is larger than a printing width of a medium on which the image is printed, the processor rotates the image.Type: ApplicationFiled: March 22, 2023Publication date: September 26, 2024Applicant: Toshiba Tec Kabushiki KaishaInventors: Yoshitaka HASHIMOTO, Kazunori HIRABAYASHI
-
Patent number: 12096570Abstract: To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.Type: GrantFiled: March 2, 2020Date of Patent: September 17, 2024Assignee: FUJI CORPORATIONInventors: Ryojiro Tominaga, Yoshitaka Hashimoto
-
Patent number: 12056936Abstract: A model generation apparatus according to one aspect of the present invention acquires a plurality of learning datasets each constituted by a first sample of a first time of predetermined data obtained in time series and feature information included in a second sample of the predetermined data of a future second time relative to the first time, and trains a prediction model, by machine learning, to predict feature information of the second time from the first sample of the first time, for each learning dataset. In the model generation apparatus, a rarity degree for is set each learning dataset, and, in the machine learning, the model generation apparatus trains more preponderantly on learning datasets having a higher rarity degree.Type: GrantFiled: January 23, 2020Date of Patent: August 6, 2024Assignees: OMRON Corporation, KYOTO UNIVERSITYInventors: Atsushi Hashimoto, Yuta Kamikawa, Yoshitaka Ushiku, Masaaki Iiyama, Motoharu Sonogashira
-
Publication number: 20240236476Abstract: An electronic apparatus includes an operation member that is rotationally operable, a rotational operation detector configured to detect a rotational operation onto the operation member, a touch operation detector configured to detect a touch operation onto the operation member, a state detector configured to detect a state of the electronic apparatus, and a processor configured to execute the instructions to execute a function in accordance with the rotational operation and the touch operation, and change setting about the rotational operation and the touch operation in accordance with the state.Type: ApplicationFiled: January 3, 2024Publication date: July 11, 2024Inventors: Haruhisa UEDA, Nagisa YANAGIBASHI, Taro FUCHIGAMI, Takahiro AKIMOTO, Yoshitaka HASHIMOTO, Takayuki IWASA
-
Publication number: 20240143091Abstract: An electronic apparatus includes an operation member that is rotationally operable, a rotation detection substrate provided with a rotation detector configured to detect rotation of the operation member, a capacitance detector provided inside the operation member and configured to output a detection signal in accordance with capacitance, a signal transfer unit configured to transfer the detection signal to the rotation detection substrate, and a touch operation detector to which the detection signal is input through the rotation detection substrate, the touch operation detector being configured to detect a tap operation and a slide operation as a touch operation onto an outer surface of the operation member based on change in the detection signal due to the touch operation.Type: ApplicationFiled: January 3, 2024Publication date: May 2, 2024Inventors: Takahiro AKIMOTO, Yoshitaka HASHIMOTO, Taro FUCHIGAMI, Haruhisa UEDA, Nagisa YANAGIBASHI, Takayuki IWASA
-
Publication number: 20240137643Abstract: An electronic apparatus includes an operation member that is rotationally operable, a rotational operation detector configured to detect a rotational operation onto the operation member, a touch operation detector configured to detect a touch operation onto the operation member, a state detector configured to detect a state of the electronic apparatus, and a processor configured to execute the instructions to execute a function in accordance with the rotational operation and the touch operation, and change setting about the rotational operation and the touch operation in accordance with the state.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Haruhisa UEDA, Nagisa YANAGIBASHI, Taro FUCHIGAMI, Takahiro AKIMOTO, Yoshitaka HASHIMOTO, Takayuki IWASA
-
Publication number: 20240045513Abstract: An input apparatus includes an operation surface having a twill shape and configured to receive input through tilt operation and press operation, and a wall portion formed at an end of the operation surface. Each vertex of the twill shape is located on a spherical surface. The wall portion protrudes from the spherical surface.Type: ApplicationFiled: July 26, 2023Publication date: February 8, 2024Inventor: Yoshitaka HASHIMOTO
-
Patent number: 11882347Abstract: An image pickup apparatus includes a camera main body, an eyepiece portion for viewing an object image, and a frame member having an opening through which light of the object image passes, and the eyepiece portion includes a bone conduction speaker.Type: GrantFiled: October 12, 2021Date of Patent: January 23, 2024Assignee: CANON KABUSHIKI KAISHAInventors: Yoshitaka Hashimoto, Takafumi Iwasaki, Hiroaki Inukai
-
Publication number: 20230144493Abstract: A molding method includes a discharging step of discharging a resin material on a cured resin layer, a flattening step of transferring a part of the resin material discharged by the discharging step from the cured resin layer to a roller to flatten the resin material, and a curing step of irradiating the resin material flattened by the flattening step with light having a predetermined light amount to cure the resin material, and forming a new cured resin layer on the cured resin layer, in which the discharging step, the flattening step, and the curing step are repeatedly executed, and the cured resin layer is laminated, and the light amount is used in which a first contact angle of the resin material with respect to the cured resin layer is larger than a second contact angle of the resin material with respect to the roller.Type: ApplicationFiled: March 17, 2020Publication date: May 11, 2023Applicant: FUJI CORPORATIONInventor: Yoshitaka HASHIMOTO
-
Publication number: 20230112913Abstract: To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.Type: ApplicationFiled: March 2, 2020Publication date: April 13, 2023Applicant: FUJI CORPORATIONInventors: Ryojiro TOMINAGA, Yoshitaka HASHIMOTO
-
Patent number: 11470724Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.Type: GrantFiled: November 19, 2019Date of Patent: October 11, 2022Assignee: FUJI CORPORATIONInventors: Masato Suzuki, Akihiro Kawajiri, Masatoshi Fujita, Kenji Tsukada, Yoshitaka Hashimoto
-
Patent number: 11439025Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.Type: GrantFiled: June 8, 2016Date of Patent: September 6, 2022Assignee: FUJI CORPORATIONInventors: Yoshitaka Hashimoto, Masatoshi Fujita, Kenji Tsukada, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
-
Publication number: 20220279658Abstract: In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.Type: ApplicationFiled: July 31, 2019Publication date: September 1, 2022Applicant: FUJI CORPORATIONInventors: Ryojiro TOMINAGA, Ryo SAKAKIBARA, Tasuku TAKEUCHI, Yoshitaka HASHIMOTO, Kenji TSUKADA
-
Publication number: 20220234933Abstract: A screw-type separation device 1 includes a casing 10 including an object discharging port and discharging an object A having been dehydrated, and a separated liquid discharging port; a screw shaft provided inside the casing and extending in an extending direction that is a direction from the one end part to the other end part; a first screw blade extending spirally on an outer peripheral surface of the screw shaft; and a second screw blade extending spirally on the outer peripheral surface of the screw shaft such that a predetermined gap is formed with respect to the first screw blade in the extending direction. A groove is formed on an inner peripheral surface of the casing.Type: ApplicationFiled: June 18, 2020Publication date: July 28, 2022Applicant: METAWATER CO., LTD.Inventors: Satoshi INOUE, Yoshitaka HASHIMOTO, Yoshinori ANDO, Takuya YOSHIDA
-
Publication number: 20220030140Abstract: An image pickup apparatus includes a camera main body, an eyepiece portion for viewing an object image, and a frame member having an opening through which light of the object image passes, and the eyepiece portion includes a bone conduction speaker.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Inventors: Yoshitaka Hashimoto, Takafumi Iwasaki, Hiroaki Inukai
-
Publication number: 20210378997Abstract: The present invention provides a composition including citric acid, a pharmaceutically acceptable salt of citric acid, a hydrate of citric acid, a hydrate of the pharmaceutically acceptable salt of citric acid, or a mixture thereof. Administration or ingestion of the previous period composition inhibits renal fibrosis in diabetic nephropathy.Type: ApplicationFiled: October 17, 2019Publication date: December 9, 2021Applicants: KYOTO PREFECTURAL PUBLIC UNIVERSITY CORPORATION, NIPPON CHEMIPHAR CO., LTD.Inventors: Michiaki FUKUI, Yoshitaka HASHIMOTO, Toshiki NAKAI, Shigeki UEYAMA, Noboru YAMAUCHI
-
Patent number: 11006529Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.Type: GrantFiled: June 28, 2016Date of Patent: May 11, 2021Assignee: FUJI CORPORATIONInventors: Kenji Tsukada, Masatoshi Fujita, Yoshitaka Hashimoto, Tasuku Takeuchi, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
-
Patent number: 10933589Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.Type: GrantFiled: December 13, 2016Date of Patent: March 2, 2021Assignee: FUJI CORPORATIONInventors: Yoshitaka Hashimoto, Masatoshi Fujita, Kenji Tsukada, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
-
Patent number: 10667403Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.Type: GrantFiled: September 19, 2014Date of Patent: May 26, 2020Assignee: FUJI CORPORATIONInventors: Masato Suzuki, Akihiro Kawajiri, Masatoshi Fujita, Kenji Tsukada, Yoshitaka Hashimoto