Patents by Inventor Yoshitaka Hashimoto

Yoshitaka Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143091
    Abstract: An electronic apparatus includes an operation member that is rotationally operable, a rotation detection substrate provided with a rotation detector configured to detect rotation of the operation member, a capacitance detector provided inside the operation member and configured to output a detection signal in accordance with capacitance, a signal transfer unit configured to transfer the detection signal to the rotation detection substrate, and a touch operation detector to which the detection signal is input through the rotation detection substrate, the touch operation detector being configured to detect a tap operation and a slide operation as a touch operation onto an outer surface of the operation member based on change in the detection signal due to the touch operation.
    Type: Application
    Filed: January 3, 2024
    Publication date: May 2, 2024
    Inventors: Takahiro AKIMOTO, Yoshitaka HASHIMOTO, Taro FUCHIGAMI, Haruhisa UEDA, Nagisa YANAGIBASHI, Takayuki IWASA
  • Publication number: 20240137643
    Abstract: An electronic apparatus includes an operation member that is rotationally operable, a rotational operation detector configured to detect a rotational operation onto the operation member, a touch operation detector configured to detect a touch operation onto the operation member, a state detector configured to detect a state of the electronic apparatus, and a processor configured to execute the instructions to execute a function in accordance with the rotational operation and the touch operation, and change setting about the rotational operation and the touch operation in accordance with the state.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Haruhisa UEDA, Nagisa YANAGIBASHI, Taro FUCHIGAMI, Takahiro AKIMOTO, Yoshitaka HASHIMOTO, Takayuki IWASA
  • Patent number: 11935673
    Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 19, 2024
    Assignee: NAMICS CORPORATION
    Inventors: Pawel Czubarow, Daisuke Hashimoto, Yoshitaka Kamata, Toshiyuki Sato
  • Patent number: 11912225
    Abstract: A side airbag device capable of restricting an occupant from moving to the inner side in the vehicle width direction while restraining the head of the occupant is inflatable and deployable in a space beside an occupant seated in a vehicle seat. The side airbag device includes an inflator configured to generate a gas and a bag-shaped airbag inflatable and deployable in response to the gas upon activation of the inflator to protect a lateral portion of the occupant. The airbag includes a torso protection portion, and a head protection portion configured to be provided above the torso protection portion and inflatable and deployable between an upper portion of a shoulder of the occupant and a lateral portion of a head of the occupant. The head protection portion is bendable at an acute angle relative to the torso protection portion in an inflated and deployed state of the airbag.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: February 27, 2024
    Assignee: ASHIMORI INDUSTRY CO., LTD.
    Inventors: Hidetaka Azuma, Yuta Minami, Yoshitaka Okagami, Kazuya Hashimoto
  • Publication number: 20240045513
    Abstract: An input apparatus includes an operation surface having a twill shape and configured to receive input through tilt operation and press operation, and a wall portion formed at an end of the operation surface. Each vertex of the twill shape is located on a spherical surface. The wall portion protrudes from the spherical surface.
    Type: Application
    Filed: July 26, 2023
    Publication date: February 8, 2024
    Inventor: Yoshitaka HASHIMOTO
  • Patent number: 11882347
    Abstract: An image pickup apparatus includes a camera main body, an eyepiece portion for viewing an object image, and a frame member having an opening through which light of the object image passes, and the eyepiece portion includes a bone conduction speaker.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: January 23, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yoshitaka Hashimoto, Takafumi Iwasaki, Hiroaki Inukai
  • Publication number: 20230144493
    Abstract: A molding method includes a discharging step of discharging a resin material on a cured resin layer, a flattening step of transferring a part of the resin material discharged by the discharging step from the cured resin layer to a roller to flatten the resin material, and a curing step of irradiating the resin material flattened by the flattening step with light having a predetermined light amount to cure the resin material, and forming a new cured resin layer on the cured resin layer, in which the discharging step, the flattening step, and the curing step are repeatedly executed, and the cured resin layer is laminated, and the light amount is used in which a first contact angle of the resin material with respect to the cured resin layer is larger than a second contact angle of the resin material with respect to the roller.
    Type: Application
    Filed: March 17, 2020
    Publication date: May 11, 2023
    Applicant: FUJI CORPORATION
    Inventor: Yoshitaka HASHIMOTO
  • Publication number: 20230112913
    Abstract: To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.
    Type: Application
    Filed: March 2, 2020
    Publication date: April 13, 2023
    Applicant: FUJI CORPORATION
    Inventors: Ryojiro TOMINAGA, Yoshitaka HASHIMOTO
  • Patent number: 11470724
    Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: October 11, 2022
    Assignee: FUJI CORPORATION
    Inventors: Masato Suzuki, Akihiro Kawajiri, Masatoshi Fujita, Kenji Tsukada, Yoshitaka Hashimoto
  • Patent number: 11439025
    Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: September 6, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yoshitaka Hashimoto, Masatoshi Fujita, Kenji Tsukada, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
  • Publication number: 20220279658
    Abstract: In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.
    Type: Application
    Filed: July 31, 2019
    Publication date: September 1, 2022
    Applicant: FUJI CORPORATION
    Inventors: Ryojiro TOMINAGA, Ryo SAKAKIBARA, Tasuku TAKEUCHI, Yoshitaka HASHIMOTO, Kenji TSUKADA
  • Publication number: 20220234933
    Abstract: A screw-type separation device 1 includes a casing 10 including an object discharging port and discharging an object A having been dehydrated, and a separated liquid discharging port; a screw shaft provided inside the casing and extending in an extending direction that is a direction from the one end part to the other end part; a first screw blade extending spirally on an outer peripheral surface of the screw shaft; and a second screw blade extending spirally on the outer peripheral surface of the screw shaft such that a predetermined gap is formed with respect to the first screw blade in the extending direction. A groove is formed on an inner peripheral surface of the casing.
    Type: Application
    Filed: June 18, 2020
    Publication date: July 28, 2022
    Applicant: METAWATER CO., LTD.
    Inventors: Satoshi INOUE, Yoshitaka HASHIMOTO, Yoshinori ANDO, Takuya YOSHIDA
  • Publication number: 20220030140
    Abstract: An image pickup apparatus includes a camera main body, an eyepiece portion for viewing an object image, and a frame member having an opening through which light of the object image passes, and the eyepiece portion includes a bone conduction speaker.
    Type: Application
    Filed: October 12, 2021
    Publication date: January 27, 2022
    Inventors: Yoshitaka Hashimoto, Takafumi Iwasaki, Hiroaki Inukai
  • Publication number: 20210378997
    Abstract: The present invention provides a composition including citric acid, a pharmaceutically acceptable salt of citric acid, a hydrate of citric acid, a hydrate of the pharmaceutically acceptable salt of citric acid, or a mixture thereof. Administration or ingestion of the previous period composition inhibits renal fibrosis in diabetic nephropathy.
    Type: Application
    Filed: October 17, 2019
    Publication date: December 9, 2021
    Applicants: KYOTO PREFECTURAL PUBLIC UNIVERSITY CORPORATION, NIPPON CHEMIPHAR CO., LTD.
    Inventors: Michiaki FUKUI, Yoshitaka HASHIMOTO, Toshiki NAKAI, Shigeki UEYAMA, Noboru YAMAUCHI
  • Patent number: 11006529
    Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: May 11, 2021
    Assignee: FUJI CORPORATION
    Inventors: Kenji Tsukada, Masatoshi Fujita, Yoshitaka Hashimoto, Tasuku Takeuchi, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
  • Patent number: 10933589
    Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: March 2, 2021
    Assignee: FUJI CORPORATION
    Inventors: Yoshitaka Hashimoto, Masatoshi Fujita, Kenji Tsukada, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
  • Patent number: 10667403
    Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Masato Suzuki, Akihiro Kawajiri, Masatoshi Fujita, Kenji Tsukada, Yoshitaka Hashimoto
  • Publication number: 20200163217
    Abstract: In a circuit forming device, resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into cavity of the resin laminated body, and electronic component is placed on ultraviolet curable resin. Then, electronic component is cured and electronic component is fixed. In addition, since the ultraviolet curable resin is cured by only irradiating the ultraviolet curable resin with ultraviolet rays, it is possible to reduce the time required for fixing the component. In addition, by causing the ejection amount of the ultraviolet curable resin for fixing the component to correspond with at least one of the size and the weight of the electronic component, it is possible to properly mount the component at a planned mounting position by a self-alignment effect.
    Type: Application
    Filed: June 8, 2016
    Publication date: May 21, 2020
    Applicant: Fuji Corporation
    Inventors: Yoshitaka HASHIMOTO, Masatoshi FUJITA, Kenji TSUKADA, Akihiro KAWAJIRI, Masato SUZUKI, Katsuaki MAKIHARA
  • Publication number: 20200093000
    Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: FUJI CORPORATION
    Inventors: Masato SUZUKI, Akihiro KAWAJIRI, Masatoshi FUJITA, Kenji TSUKADA, Yoshitaka HASHIMOTO
  • Publication number: 20190337234
    Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.
    Type: Application
    Filed: December 13, 2016
    Publication date: November 7, 2019
    Applicant: FUJI CORPORATION
    Inventors: Yoshitaka HASHIMOTO, Masatoshi FUJITA, Kenji TSUKADA, Akihiro KAWAJIRI, Masato SUZUKI, Katsuaki MAKIHARA