Patents by Inventor Yoshitaka Kimura

Yoshitaka Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11312056
    Abstract: A twin screw extruder (10) for producing a fiber-reinforced resin composition, which is obtained by charging the extruder with a thermoplastic resin and reinforcing fibers in roving form and the reinforcing fibers being fibrillated/cut and being dispersed/kneaded into the thermoplastic resin, comprises: a plate-shaped blade (15), which protrudes from the inner surface of a cylinder (11) and faces a screw (20) and the longitudinal direction of which faces the axial direction of the cylinder; and a height adjustment means (16) for adjusting the gap between the blade (15) and the screw (20).
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: April 26, 2022
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Yoshitaka Kimura, Makoto Tojo, Daigo Saga
  • Patent number: 11307630
    Abstract: An electronic device electrically connectable to an external device includes: circuitry configured to: accept, from a user, a selection of one of: a first state that enables the electronic device to supply electric power to the external device; and a second state that enables the electronic device to receive electric power from the external device; and switch a state of the electronic device to the selected one of the first state and the second state and fix the selected one of the first state and the second state as the state of the electronic device in response to power off of the electronic device.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: April 19, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Teruyuki Takei, Yoshitaka Kimura, Takahiro Suzuki
  • Patent number: 11258286
    Abstract: A power supply device includes a battery and processing circuitry. The processing circuitry is configured to estimate a tendency of consumption of the battery and put the power supply device into one of a first state in which the power supply device can supply electric power to another device and a second state in which the power supply device can receive electric power from said another device, in accordance with the tendency of consumption of the battery estimated.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: February 22, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Teruyuki Takei, Yoshitaka Kimura, Takahiro Suzuki, Naoto Asakura
  • Patent number: 11251137
    Abstract: A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 15, 2022
    Assignee: ABLIC INC.
    Inventors: Satoshi Suzuki, Yoshitaka Kimura
  • Patent number: 11218010
    Abstract: A power supply device includes a battery and processing circuitry. The processing circuitry is configured to estimate a tendency of consumption of the battery and put the power supply device into one of a first state in which the power supply device can supply electric power to another device and a second state in which the power supply device can receive electric power from said another device, in accordance with the tendency of consumption of the battery estimated.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: January 4, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Teruyuki Takei, Yoshitaka Kimura, Takahiro Suzuki, Naoto Asakura
  • Publication number: 20210397241
    Abstract: An electronic device electrically connectable to an external device includes: circuitry configured to: accept, from a user, a selection of one of: a first state that enables the electronic device to supply electric power to the external device; and a second state that enables the electronic device to receive electric power from the external device; and switch a state of the electronic device to the selected one of the first state and the second state and fix the selected one of the first state and the second state as the state of the electronic device in response to power off of the electronic device.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 23, 2021
    Applicant: RICOH COMPANY, LTD.
    Inventors: Teruyuki TAKEI, Yoshitaka KIMURA, Takahiro SUZUKI
  • Publication number: 20210381035
    Abstract: Detecting different mutations in the same sample is essential, especially where the sample is limited in quantity and where high-throughput methods are desired for rapid detection of mutations. Methods routinely used in the art require separate assays for detecting different mutations or mutation types (e.g. single nucleotide polymorphisms (SNPs) or copy number variations (CNVs)) in a sample. The present disclosure provides methods for detecting different mutations, such as SNPs and CNVs in the same sample.
    Type: Application
    Filed: February 14, 2020
    Publication date: December 9, 2021
    Inventors: Emmanuel Kamberov, Yoshitaka Kimura, Julie Catherine Laliberté, Patrick Kevin Martin, Jacob Meyers
  • Publication number: 20210342695
    Abstract: A signal processing method includes: obtaining signals of two systems, the signals being a measuring system signal being a measurable time-series signal expressed in a real space, and a referring system signal being referred in a process of the measuring system signal and being expressed in the real space; extracting, based on a process using the signals of the two systems obtained in the obtaining and being performed in the real space, a time-series-feature expressing a feature of the measuring system signal in the real space; and converting the time-series-feature extracted in the extracting into a feature real-expression-feature being an expression of an information space dual with the real space.
    Type: Application
    Filed: July 12, 2021
    Publication date: November 4, 2021
    Applicant: TOHOKU UNIVERSITY
    Inventor: Yoshitaka KIMURA
  • Patent number: 11082617
    Abstract: An electronic device includes a power supply and a power supply circuit. The power supply circuit is configured to alternately switch a state of the electronic device between a first state to supply power to another device and a second state to receive power from said another device, and stop a switching operation of the state of the electronic device when the electronic device is off, to fix the state of the electronic device to one of the first state and the second state.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: August 3, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Naoto Asakura, Yoshitaka Kimura, Teruyuki Takei, Takahiro Suzuki
  • Patent number: 11037858
    Abstract: A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: June 15, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yoshitaka Kimura
  • Publication number: 20210138711
    Abstract: A twin screw extruder (10) for producing a fiber-reinforced resin composition, which is obtained by charging the extruder with a thermoplastic resin and reinforcing fibers in roving form and the reinforcing fibers being fibrillated/cut and being dispersed/kneaded into the thermoplastic resin, comprises: a plate-shaped blade (15), which protrudes from the inner surface of a cylinder (11) and faces a screw (20) and the longitudinal direction of which faces the axial direction of the cylinder; and a height adjustment means (16) for adjusting the gap between the blade (15) and the screw (20).
    Type: Application
    Filed: August 4, 2017
    Publication date: May 13, 2021
    Applicant: THE JAPAN STEEL WORKS, LTD.
    Inventors: Yoshitaka KIMURA, Makoto TOJO, Daigo SAGA
  • Publication number: 20210134686
    Abstract: A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.
    Type: Application
    Filed: August 14, 2020
    Publication date: May 6, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetoshi Ishibashi, Yoshitaka Kimura, Minoru Egusa, Nobuhiro Asaji, Kazunari Teshigawara
  • Patent number: 10996730
    Abstract: An electronic device includes a power supply, a connector, a detector, and a switch. The connector is configured to be alternatively connectable in a first direction and in a second direction. The detector is configured to detect which of the first direction and the second direction the connector has been connected in. The switch is configured to switch a state of the electronic device between a first state to supply power to another device and to a second state to receive power from said another device. The switch is configured to switch the state of the electronic device to the first state or the second state according to a connection direction of the connector detected by the detector.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: May 4, 2021
    Assignee: Ricoh Company, Ltd.
    Inventor: Yoshitaka Kimura
  • Publication number: 20200398474
    Abstract: A twin-screw extruder is provided in which screws have different rotational speeds depending on the process of treating the raw material and in which degradation of the raw material is less likely to occur. Twin-screw extruder 1 has two screws 3, 5 that extend in parallel to each other. Each screw 3, 5 has cylindrical upstream screw 31 and downstream screw 35, wherein upstream screw 31 has shaft hole 315 that extends in longitudinal direction X and screw flight 316 on an outer circumferential surface thereof, and downstream screw 35 includes large diameter portion 353 having screw flight 357 on an outer circumferential surface thereof and small diameter shaft portion 351 that has a smaller diameter than large diameter portion 353, wherein small diameter shaft portion 351 of downstream screw 35 is inserted into shaft hole 315 of upstream screw 31. Upstream screw 31 and downstream screw 35 can be independently rotated.
    Type: Application
    Filed: February 13, 2019
    Publication date: December 24, 2020
    Applicants: The Japan Steel Works, Ltd., Tokyo Printing Ink Mfg. Co., Ltd.
    Inventors: Kazutoshi IZUMIYA, Katsumi SUMIDA, Yoshitaka KIMURA, Masashi TANIMOTO, Hiroyuki OKUMA, Katsuyuki KANEKO, Shizuo UESHIGE, Nobuaki TANAKA, Takahiro NAKAMARU
  • Patent number: 10773687
    Abstract: Disclosed is an electronic key system which comprises a vehicle-mounted device and a plurality of electronic keys, and is configured to have: a normal mode in which a given processing is permitted to be executed by the vehicle-mounted device when a given wireless communication processing between the vehicle-mounted device and any one of the plurality of electronic keys is successfully completed; and a deactivated mode in which the given processing is inhibited from being executed by the vehicle-mounted device. The vehicle-mounted device is configured not to execute, in the deactivated mode, the given processing even when receiving an RF signal after transmitting an LF signal, during the given wireless communication processing, and the one electronic key is configured not to transmit, in the deactivated mode, the RF signal even when receiving the LF signal, during the given wireless communication processing.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: September 15, 2020
    Assignee: Mazda Motor Corporation
    Inventors: Yasuhiro Ohi, Yoshitaka Kimura, Shotaro Hirosue
  • Publication number: 20200266154
    Abstract: A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Inventors: Satoshi SUZUKI, Yoshitaka KIMURA
  • Patent number: 10714447
    Abstract: An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: July 14, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Yoshitaka Kimura, Akihiko Yamashita
  • Publication number: 20200211921
    Abstract: A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.
    Type: Application
    Filed: June 27, 2019
    Publication date: July 2, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yoshitaka KIMURA
  • Patent number: 10672706
    Abstract: A semiconductor device includes a multilayer wiring structure on a substrate. The multilayer wiring structure includes: a top wiring; a fuse element, which is located on a lower layer-side of the top wiring, and is made of metal having a melting point that is higher than that of the top wiring; and a lower-layer wiring, which is connected to each of ends of the fuse element. Provided is a semiconductor device in which fuse elements made of the high-melting point metal are arranged at high density.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: June 2, 2020
    Assignee: ABLIC INC.
    Inventor: Yoshitaka Kimura
  • Patent number: 10643922
    Abstract: A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 5, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshitaka Otsubo, Yoshitaka Kimura