Abstract: A twin-screw extruder is provided in which screws have different rotational speeds depending on the process of treating the raw material and in which degradation of the raw material is less likely to occur. Twin-screw extruder 1 has two screws 3, 5 that extend in parallel to each other. Each screw 3, 5 has cylindrical upstream screw 31 and downstream screw 35, wherein upstream screw 31 has shaft hole 315 that extends in longitudinal direction X and screw flight 316 on an outer circumferential surface thereof, and downstream screw 35 includes large diameter portion 353 having screw flight 357 on an outer circumferential surface thereof and small diameter shaft portion 351 that has a smaller diameter than large diameter portion 353, wherein small diameter shaft portion 351 of downstream screw 35 is inserted into shaft hole 315 of upstream screw 31. Upstream screw 31 and downstream screw 35 can be independently rotated.

Abstract: Methods of normalizing two or more nucleic acid samples are provided. Aspects of the methods include contacting each of the two or more nucleic acid samples with a limiting amount of a target binding moiety that specifically binds to a common target in each of the two or more nucleic acid samples to produce binding complexes in each of the two or more nucleic acid samples; and separating the binding complexes from unbound nucleic acids in each of the two or more nucleic acid samples to normalize the two or more nucleic acid samples. Compositions and kits for use in performing the methods are also provided.

Abstract: A semiconductor module includes: a dissipating metal plate including a recess provided on an upper surface; an insulating substrate provided on a bottom surface of the recess and including a circuit pattern; a semiconductor device provided on the insulating substrate and connected to the circuit pattern; a case bonded to a peripheral portion on the upper surface of the dissipating metal plate and surrounding the insulating substrate and the semiconductor device; a case electrode provided on the case; a wire connecting the semiconductor device and the case electrode; and a sealant provided in the case and sealing the insulating substrate, the semiconductor device, and the wire, wherein a sidewall of the recess has a taper.

Abstract: A semiconductor device includes: an insulating substrate including a circuit pattern; a semiconductor chip mounted on the insulating substrate and connected to the circuit pattern; and an overcurrent interruption mechanism constituted with a same material as material of the circuit pattern, connected to the circuit pattern in series, wherein when an overcurrent flows, the overcurrent interruption mechanism melts and is cut.

Abstract: A twin screw extruder (10) for producing a fiber-reinforced resin composition, which is obtained by charging the extruder with a thermoplastic resin and reinforcing fibers in roving form and the reinforcing fibers being fibrillated/cut and being dispersed/kneaded into the thermoplastic resin, comprises: a plate-shaped blade (15), which protrudes from the inner surface of a cylinder (11) and faces a screw (20) and the longitudinal direction of which faces the axial direction of the cylinder; and a height adjustment means (16) for adjusting the gap between the blade (15) and the screw (20).

Abstract: An electronic device electrically connectable to an external device includes: circuitry configured to: accept, from a user, a selection of one of: a first state that enables the electronic device to supply electric power to the external device; and a second state that enables the electronic device to receive electric power from the external device; and switch a state of the electronic device to the selected one of the first state and the second state and fix the selected one of the first state and the second state as the state of the electronic device in response to power off of the electronic device.

Abstract: A power supply device includes a battery and processing circuitry. The processing circuitry is configured to estimate a tendency of consumption of the battery and put the power supply device into one of a first state in which the power supply device can supply electric power to another device and a second state in which the power supply device can receive electric power from said another device, in accordance with the tendency of consumption of the battery estimated.

Abstract: A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.

Abstract: A power supply device includes a battery and processing circuitry. The processing circuitry is configured to estimate a tendency of consumption of the battery and put the power supply device into one of a first state in which the power supply device can supply electric power to another device and a second state in which the power supply device can receive electric power from said another device, in accordance with the tendency of consumption of the battery estimated.

Abstract: An electronic device electrically connectable to an external device includes: circuitry configured to: accept, from a user, a selection of one of: a first state that enables the electronic device to supply electric power to the external device; and a second state that enables the electronic device to receive electric power from the external device; and switch a state of the electronic device to the selected one of the first state and the second state and fix the selected one of the first state and the second state as the state of the electronic device in response to power off of the electronic device.

Abstract: Detecting different mutations in the same sample is essential, especially where the sample is limited in quantity and where high-throughput methods are desired for rapid detection of mutations. Methods routinely used in the art require separate assays for detecting different mutations or mutation types (e.g. single nucleotide polymorphisms (SNPs) or copy number variations (CNVs)) in a sample. The present disclosure provides methods for detecting different mutations, such as SNPs and CNVs in the same sample.

Abstract: A signal processing method includes: obtaining signals of two systems, the signals being a measuring system signal being a measurable time-series signal expressed in a real space, and a referring system signal being referred in a process of the measuring system signal and being expressed in the real space; extracting, based on a process using the signals of the two systems obtained in the obtaining and being performed in the real space, a time-series-feature expressing a feature of the measuring system signal in the real space; and converting the time-series-feature extracted in the extracting into a feature real-expression-feature being an expression of an information space dual with the real space.

Abstract: An electronic device includes a power supply and a power supply circuit. The power supply circuit is configured to alternately switch a state of the electronic device between a first state to supply power to another device and a second state to receive power from said another device, and stop a switching operation of the state of the electronic device when the electronic device is off, to fix the state of the electronic device to one of the first state and the second state.

Abstract: A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.

Abstract: A twin screw extruder (10) for producing a fiber-reinforced resin composition, which is obtained by charging the extruder with a thermoplastic resin and reinforcing fibers in roving form and the reinforcing fibers being fibrillated/cut and being dispersed/kneaded into the thermoplastic resin, comprises: a plate-shaped blade (15), which protrudes from the inner surface of a cylinder (11) and faces a screw (20) and the longitudinal direction of which faces the axial direction of the cylinder; and a height adjustment means (16) for adjusting the gap between the blade (15) and the screw (20).

Abstract: A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.

Abstract: An electronic device includes a power supply, a connector, a detector, and a switch. The connector is configured to be alternatively connectable in a first direction and in a second direction. The detector is configured to detect which of the first direction and the second direction the connector has been connected in. The switch is configured to switch a state of the electronic device between a first state to supply power to another device and to a second state to receive power from said another device. The switch is configured to switch the state of the electronic device to the first state or the second state according to a connection direction of the connector detected by the detector.

Abstract: A twin-screw extruder is provided in which screws have different rotational speeds depending on the process of treating the raw material and in which degradation of the raw material is less likely to occur. Twin-screw extruder 1 has two screws 3, 5 that extend in parallel to each other. Each screw 3, 5 has cylindrical upstream screw 31 and downstream screw 35, wherein upstream screw 31 has shaft hole 315 that extends in longitudinal direction X and screw flight 316 on an outer circumferential surface thereof, and downstream screw 35 includes large diameter portion 353 having screw flight 357 on an outer circumferential surface thereof and small diameter shaft portion 351 that has a smaller diameter than large diameter portion 353, wherein small diameter shaft portion 351 of downstream screw 35 is inserted into shaft hole 315 of upstream screw 31. Upstream screw 31 and downstream screw 35 can be independently rotated.

Abstract: Disclosed is an electronic key system which comprises a vehicle-mounted device and a plurality of electronic keys, and is configured to have: a normal mode in which a given processing is permitted to be executed by the vehicle-mounted device when a given wireless communication processing between the vehicle-mounted device and any one of the plurality of electronic keys is successfully completed; and a deactivated mode in which the given processing is inhibited from being executed by the vehicle-mounted device. The vehicle-mounted device is configured not to execute, in the deactivated mode, the given processing even when receiving an RF signal after transmitting an LF signal, during the given wireless communication processing, and the one electronic key is configured not to transmit, in the deactivated mode, the RF signal even when receiving the LF signal, during the given wireless communication processing.

Abstract: A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.