Abstract: A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.

Abstract: A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.

Abstract: A fetal state estimation apparatus estimates a state of a fetus in a maternal body based on a potential signal indicating a change in potential on a surface of the maternal body. The fetal state estimation apparatus is configured to include a rotation angle estimation unit which estimates a rotation angle of the fetus with respect to the maternal body at every beating of a heart of the fetus based on the potential signal and a fetal movement estimation unit which estimates a fetal movement which is a movement of the fetus based on the potential signal and the estimated rotation angle.

Abstract: A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.

Abstract: A solenoid valve driving apparatus includes switching means for ON/OFF-controlling application of a direct current voltage to a solenoid of a solenoid valve, and signal outputting means. A first period and a consecutive second period are set as a valve opening operation period of the solenoid valve. When the signal outputting means outputs the PWM signal to the switching means, a duty ratio of the output signal is set to be higher in the second period than in the first period so that a power supplied to the solenoid is larger in the second period than in the first period. As a result, a valve opening operation is performed in the solenoid valve reliably, and loud noise generation during the valve opening operation is suppressed.

Abstract: According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.

Abstract: A semiconductor device includes: a base plate including a metallic base plate and an insulating film provided on the metallic base plate; a semiconductor chip provided on the base plate; a control board disposed above the semiconductor chip; and a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board, wherein the relay terminal is directly fixed to the insulating film of the base plate.

Abstract: A semiconductor device includes a multilayer wiring structure on a substrate. The multilayer wiring structure includes: a top wiring; a fuse element, which is located on a lower layer-side of the top wiring, and is made of metal having a melting point that is higher than that of the top wiring; and a lower-layer wiring, which is connected to each of ends of the fuse element. Provided is a semiconductor device in which fuse elements made of the high-melting point metal are arranged at high density.

Abstract: A semiconductor device includes a base plate, a case, a power semiconductor element, and a control semiconductor element. Case is provided on base plate. Power semiconductor element is disposed over base plate in case. Control semiconductor element is disposed in case. Case has an opening formed therein opposite to base plate. The semiconductor device further includes a cover to close opening in case. Cover has a hole formed in at least a portion of a region overlapping control semiconductor element in plan view.

Abstract: A semiconductor device includes: a base plate including a metallic base plate and an insulating film provided on the metallic base plate; a semiconductor chip provided on the base plate; a control board disposed above the semiconductor chip; and a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board, wherein the relay terminal is directly fixed to the insulating film of the base plate.

Abstract: Provided is a semiconductor device preventing readhesion of conductive body which forms fuse elements and breakage of the fuse elements. The semiconductor device includes a first insulating film formed on a semiconductor substrate, a plurality of fuse elements formed on the first insulating film adjacent to one another, a protective insulating film covering at least side surfaces of the fuse elements, and a second insulating film formed of one of a BPSG film and a PSG film to cover the fuse elements and the protective insulating film. The protective insulating film is higher in mechanical strength than the second insulating film.

Abstract: A sensor control device which controls: a first sensor which detects, based on a captured image, whether a person is present in a first detection range, and detects, for each of regions into which the first detection range is divided, whether a person is present in the region, based on a captured image; and a plurality of second sensors which detect, based on infrared radiation, whether a person is present in respective second detection ranges includes a determiner which matches, for each of the regions, an on or off state of a detection function of the first sensor in the region with an on or off state of a detection function of a second sensor whose second detection range overlaps the region, among the plurality of second sensors, by controlling the first sensor and the plurality of second sensors.

Abstract: A corrosion-resistant semiconductor device includes fuse elements that can be cut by laser light. An upper portion of the fuse elements is covered with a porous insulating film so that, when laser light irradiated from a rear surface of a semiconductor substrate is collected at selected fuse elements, the fuse elements generate heat, expand, and rupture. An array of intersecting metal lines forming windows is disposed over the fuse elements to permit rapid expansion of the fuse elements when irradiated with the laser light. A silicon nitride film having a uniform thickness is formed on a front surface of the semiconductor device to prevent entry of moisture.

Abstract: An apparatus for imaging an object is equipped with an image sensor comprising a plurality of pixels; a charge-reading processor that reads out accumulated charges in a given pixel via a pixel circuit of the charge accumulated pixel; and a noise-reading processor that reads out noise signals from a pixel circuit for a given pixel. The noise-reading processor reads noise signals from a pixel circuit for a pixel that is an object of noise acquisition, in parallel with the reading of accumulated charges by the charge-reading processor.

Abstract: A detection device includes: a first sensor which detects, based on a captured image, whether a person is present in a first detection range; a plurality of second sensors which are disposed around the first sensor, and detect, based on infrared radiation, whether a person is present in respective second detection ranges each of which overlaps at least a portion of the first detection range; and at least one hood which blocks part of infrared radiation directed to at least one of the plurality of second sensors, to reduce a non-overlapping portion of a combined detection range of the first detection range of the first sensor and the second detection ranges of the plurality of second sensors, the non-overlapping portion being a portion in which the first detection range and the second detection ranges do not overlap.

Abstract: A hydrothermal decomposition apparatus 17 as a biomass processing apparatus that decomposes a biomass material 11 into cellulose, hemicellulose, and lignin under a high temperature and high pressure condition to remove a lignin component and a hemicellulose component, a biomass solid discharging unit 18 that discharges a biomass solid (a hot-water insoluble component) 20 processed in the hydrothermal decomposition apparatus 17, and a slurrying vessel 21 communicating with the biomass solid discharging unit 18, into which water 19 is injected and the discharged biomass solid 20 is added to make it slurried are provided to an apparatus body 13, which is a processing vessel having a gas-liquid interface 13a.

Abstract: A corrosion resistant semiconductor device includes fuse elements that can be cut by laser light. An upper portion of the fuse elements is covered with a porous insulating film so that, when laser light irradiated from a rear surface of a semiconductor substrate is collected at selected fuse elements, the fuse elements generate heat, expand, and rupture. A metal lattice having a plurality of windows is disposed over the fuse elements to permit rapid expansion of the fuse elements when irradiated with the laser light. Alternatively, a metal array having a plurality of independent light-shielding portions may be disposed over the fuse elements to prevent the laser light from adversely affecting circuitry on the front surface side of the semiconductor device.

Abstract: A semiconductor device includes a base plate, a case, a power semiconductor element, and a control semiconductor element. Case is provided on base plate. Power semiconductor element is disposed over base plate in case. Control semiconductor element is disposed in case. Case has an opening formed therein opposite to base plate. The semiconductor device further includes a cover to close opening in case. Cover has a hole formed in at least a portion of a region overlapping control semiconductor element in plan view.

Abstract: A sensor control device includes: a determiner which has a first determination mode for determining whether a person is present, based on a result of detection by a first sensor and a result of detection by a second sensor, and a second determination mode for determining whether a person is present, based on a result of detection by the second sensor, wherein the determiner suspends determination as to whether a person is present in the first determination mode, if a brightness change value indicating a change in brightness in a first detection range during a certain time period is greater than a predetermined value in the first determination mode, and determines whether a person is present in the first determination mode, if the brightness change value in the first detection range is less than the predetermined value in the first determination mode.

Abstract: A semiconductor device includes a case, a circuit substrate set in the case and having an electric circuit formed thereon, and a plurality of terminals arranged in the case by being spaced apart from each other, each terminal having a base portion electrically connected to the electric circuit in the case, and a trunk portion bent by forming a fold between the base portion and the trunk portion so as to rise from the base portion at the end of the base portion, the trunk portion having a press-fit portion formed at its distal end, wherein the fold is inclined relative to a longitudinal axis of the base portion, and wherein restitution directions in which the press-fit portions restitute from their contractions caused by press fitting are turned aside one from another between each adjacent pair of the terminals.