Patents by Inventor Yoshiyuki Hirose

Yoshiyuki Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10445751
    Abstract: Provided is a server device (101) including: a transmitting/receiving section (201) for receiving, from a household electric appliance (102), an identifier for identifying the household electric appliance (102) and an operation status of the household electric appliance (102); an updating section (207) for estimating a consumption status of a consumer good using the received operation status so as to update the consumption status of the consumer good stored in a utilization information accumulating section (205) based on the estimated consumption status of the consumer good; and a determination section (206) for deciding whether or not to transmit a confirmation message for confirming the consumer good being used with the household electric appliance, based on the updated consumption status of the consumer good.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: October 15, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Toshihisa Nakano, Masayuki Kozuka, Motoji Ohmori, Takako Hirose, Tsuyoshi Sakata, Yoshiyuki Miyabe, Kazuo Okamura, Masayoshi Tojima
  • Patent number: 10447022
    Abstract: A conductive member includes an enclosure, a coolant, and a conductor. The enclosure includes a sheet and has liquid tightness. The coolant is enclosed in the enclosure. The conductor includes a cool section that is disposed in the enclosure and a projecting section that is liquid-tightly sealed with the sheet and projects from the enclosure.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: October 15, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Tomoharu Takeyama, Eiichi Kobayashi
  • Patent number: 10396412
    Abstract: A power storage module includes power storage elements and cooling members that are in contact with the power storage elements to transfer heat. The cooling member includes an enclosing member, refrigerant, and an absorbing member absorbing the refrigerant, and the enclosing member includes a first sheet member and a second sheet member that are connected in a liquid tight manner, and the refrigerant and the absorbing member are arranged within the enclosing member. The cooling member is arranged to be inclined with respect to a horizontal plane such that a section thereof being in contact with the power storage element to transfer heat is on a lower level.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: August 27, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Tomoharu Takeyama, Yoshiyuki Hirose
  • Patent number: 10380607
    Abstract: Provided is a server device (101) including: a transmitting/receiving section (201) for receiving, from a household electric appliance (102), an identifier for identifying the household electric appliance (102) and an operation status of the household electric appliance (102); an updating section (207) for estimating a consumption status of a consumer good using the received operation status so as to update the consumption status of the consumer good stored in a utilization information accumulating section (205) based on the estimated consumption status of the consumer good; and a determination section (206) for deciding whether or not to transmit a confirmation message for confirming the consumer good being used with the household electric appliance, based on the updated consumption status of the consumer good.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: August 13, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Toshihisa Nakano, Masayuki Kozuka, Motoji Ohmori, Takako Hirose, Tsuyoshi Sakata, Yoshiyuki Miyabe, Kazuo Okamura, Masayoshi Tojima
  • Publication number: 20190242008
    Abstract: A method of producing a semiconductor laminate film includes forming a semiconductor layer containing silicon and germanium on a silicon substrate by a sputtering method. In the sputtering method, a film formation temperature of the semiconductor layer is less than 500° C., and a film formation pressure of the semiconductor layer ranges from 1 mTorr to 11 mTorr, or, a film formation temperature of the semiconductor layer is less than 600° C., and a film formation pressure of the semiconductor layer is equal to or more than 2 mTorr and less than 5 mTorr. The sputtering method uses a sputtering gas having a volume ratio of a hydrogen gas of less than 0.1%, and the semiconductor layer satisfies a relationship of t?0.881×x?4.79, where t represents a thickness (nm) of the semiconductor layer, and x represents a ratio of the number of germanium atoms to a sum of the number of silicon atoms and the number of germanium atoms in the semiconductor layer.
    Type: Application
    Filed: July 12, 2017
    Publication date: August 8, 2019
    Inventors: Yoshiyuki SUDA, Takahiro TSUKAMOTO, Akira MOTOHASHI, Kyohei DEGURA, Katsumi OKUBO, Takuma YAGI, Akifumi KASAMATSU, Nobumitsu HIROSE, Toshiaki MATSUI
  • Publication number: 20190221902
    Abstract: A power storage module includes: a power storage element; a cooling member that is stacked on the power storage element and has a sealing body hermetically sealing a coolant and an absorption member disposed in the sealing body to absorb the coolant; and a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween. The heat transfer plate is provided with protrusion portions that protrude to the cooling member side.
    Type: Application
    Filed: September 13, 2017
    Publication date: July 18, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Patent number: 10355556
    Abstract: A motor drive device includes a stator, a rotor, a first output shaft being provided in the rotor shaft and integrally rotating with a first drive gear, a second output shaft being provided in the first output shaft and integrally rotating with a second drive gear, a first one-way clutch being provided between an inner periphery of the rotor shaft and an outer periphery of the first output shaft, the first one-way clutch transmitting only a driving force that operates in a first direction, a second one-way clutch being provided between the inner periphery of the rotor shaft and an outer periphery of the second output shaft, the second one-way clutch transmitting only a driving force that operates in a second direction that is opposite to the first direction, and a decelerator.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: July 16, 2019
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Yoshiyuki Komi, Takahiro Misu, Tomoyuki Toyama, Shota Hirose, Takeshi Tojo, Shinya Harada
  • Publication number: 20190214692
    Abstract: A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat transfer member that has a spacer portion disposed between the adjacent extension portions of the plurality of cooling members and configured to abut with the bulging portion.
    Type: Application
    Filed: July 28, 2017
    Publication date: July 11, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20190207278
    Abstract: A cooling member includes: a coolant; a sealing body in which a first sheet portion and a second sheet portion are opposed to each other and the coolant is hermetically sealed; absorption members that are disposed in the sealing body to absorb the coolant; and spacers that are disposed inside the sealing body to maintain a space between the first sheet portion and the second sheet portion.
    Type: Application
    Filed: July 31, 2017
    Publication date: July 4, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20190198950
    Abstract: A power storage module includes a cooling member that has a coolant and a sealing body hermetically sealing the coolant; a power storage element that is stacked on the cooling members; and a heat transfer plate that is stacked on the power storage elements with the cooling members therebetween. The sealing body is configured to form a bulging portion deformed by evaporation of the coolant in a region not overlapping the power storage element. The heat transfer plate has a folded portion with which the bulging portion is configured to abut.
    Type: Application
    Filed: July 20, 2017
    Publication date: June 27, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD, SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20190181515
    Abstract: A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat dissipation member that receives heat of the plurality of cooling members and dissipates the heat to an outside. The heat dissipation member has a spacer portion that is disposed between the adjacent extension portions of the plurality of cooling members and is configured to abut with the bulging portion.
    Type: Application
    Filed: July 31, 2017
    Publication date: June 13, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20190172639
    Abstract: A power storage module includes: a power storage element; a cooling member that has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant in a region not overlapping the power storage element; a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween; and an elastic member that abuts with the heat transfer plate and the bulging portion and is elastically deformable.
    Type: Application
    Filed: July 27, 2017
    Publication date: June 6, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20190165436
    Abstract: A cooling member includes a sealing member including a first sheet member and a second sheet member connected to each other in a liquid-tightly closed state, a refrigerant enclosed in the sealing member, and an absorbing member disposed in the sealing member and configured to absorb the refrigerant.
    Type: Application
    Filed: August 23, 2016
    Publication date: May 30, 2019
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Hisashi SAWADA, Akihisa HOSOE, Tomoharu TAKEYAMA, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Eiichi KOBAYASHI
  • Publication number: 20190120565
    Abstract: An enclosing member including a sheet member connected in a liquid tight manner, refrigerant enclosed in the enclosing member, and an absorbing member arranged in the enclosing member and absorbing the refrigerant. The enclosing member includes a condensation section where the refrigerant that is in a gaseous state is condensed, and in the condensation section, the absorbing member is attached on at least a lower section of an inner surface of the enclosing member with respect to a vertical direction.
    Type: Application
    Filed: March 8, 2017
    Publication date: April 25, 2019
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20190093958
    Abstract: A cooling member includes an enclosing member including sheet members connected in a liquid tight manner and including small compartments, refrigerant enclosed in each of the small compartments, and an absorbing member arranged in each of the small compartments and absorbing the refrigerant. Each of the small compartments includes a condensation section where the refrigerant that is in a gaseous state is condensed.
    Type: Application
    Filed: March 9, 2017
    Publication date: March 28, 2019
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20180366931
    Abstract: A conductive member includes an enclosure, a coolant, and a conductor. The enclosure includes a sheet and has liquid tightness. The coolant is enclosed in the enclosure. The conductor includes a cool section that is disposed in the enclosure and a projecting section that is liquid-tightly sealed with the sheet and projects from the enclosure.
    Type: Application
    Filed: January 31, 2017
    Publication date: December 20, 2018
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
  • Publication number: 20180351221
    Abstract: A power storage module includes power storage elements and cooling members that are in contact with the power storage elements to transfer heat. The cooling member includes an enclosing member, refrigerant, and an absorbing member absorbing the refrigerant, and the enclosing member includes a first sheet member and a second sheet member that are connected in a liquid tight manner, and the refrigerant and the absorbing member are arranged within the enclosing member. The cooling member is arranged to be inclined with respect to a horizontal plane such that a section thereof being in contact with the power storage element to transfer heat is on a lower level.
    Type: Application
    Filed: December 1, 2016
    Publication date: December 6, 2018
    Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Tomoharu TAKEYAMA, Yoshiyuki HIROSE
  • Publication number: 20170152425
    Abstract: An AlN sintered compact includes AlN crystal grains and a grain boundary phase, and the grain boundary phase is lower in Vickers hardness than the AlN crystal grains.
    Type: Application
    Filed: April 14, 2015
    Publication date: June 1, 2017
    Inventors: Hideaki Awata, Katsuhito Yoshida, Koichi Sogabe, Yoshiyuki Hirose, Yasushi Itoh, Noboru Uenishi, Yuka Kondo, Sadamu Ishidu, Takehisa Yamamoto
  • Publication number: 20150351241
    Abstract: A ceramic wiring substrate and method for manufacturing the same, the substrate having an up-and-down conduction body which is made by forming a porous structure body from a high melting point metal and then infiltrating a low-resistance metal in an up-and-down conduction hole subsequently formed in a substrate made in a plate shape through sintering a ceramic precursor, the conduction body having a normal composite structure without an abnormally grown particle, a void, a crack and the like and not having a problem of falling off from the substrate, as well as provided a semiconductor device using this substrate. An intermediate layer formed of at least one selected from a group of Mo, W, Co, Fe, Zr, Re, Os, Ta, Nb, Ir, Ru and Hf is formed on an inner surface of the up-and-down conduction hole of the substrate before being provided with the conduction body having the composite structure.
    Type: Application
    Filed: December 17, 2013
    Publication date: December 3, 2015
    Inventors: Yoshiyuki Hirose, Sachie Sugitani, Norihito Goma, Gouhei Toyoshima, Noboru Uenishi
  • Patent number: 7150612
    Abstract: A gear•rear shaft containing main body of a bottomed type is penetrated with a bearing hole and a rear face of the gear•rear shaft containing main body is coupled with a closing plate to form an airtight seal from an outside environment. Shafts extended from two gears to a side of the rear face are set to be shorter than a length of the bearing hole in an axis core direction. Bushes are also set to a length that is the same as that of the shafts. The gear•rear shaft containing main body is formed with a recess portion at the rear face and the bearing hole is penetrated to open to the recess portion. The gear•rear shaft containing main body is bored to penetrate with a low pressure port communicating with a low pressure region in an axis core direction.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: December 19, 2006
    Assignee: Shimadzu Corporation
    Inventors: Koji Komatsu, Nobuo Mukai, Takumi Ishihara, Yoshiyuki Hirose