Patents by Inventor Yoshiyuki Hirose
Yoshiyuki Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972947Abstract: A semiconductor laminate film includes a silicon substrate and a semiconductor layer formed on the silicon substrate and containing silicon and germanium. The semiconductor layer having a surface roughness Rms of 1 nm or less. Further, the semiconductor layer satisfies the following relationship t?0.881×x?4.79 where t represents a thickness (nm) of the semiconductor layer, and x represents a ratio of the number of germanium atoms to a sum of the number of silicon atoms and the number of germanium atoms in the semiconductor layer. Also, the semiconductor layer being a mixed crystal semiconductor layer containing silicon and germanium.Type: GrantFiled: March 10, 2021Date of Patent: April 30, 2024Assignees: National University Corporation Tokyo University Of Agriculture And Technology, National Institute of Information and Communications TechnologyInventors: Yoshiyuki Suda, Takahiro Tsukamoto, Akira Motohashi, Kyohei Degura, Katsumi Okubo, Takuma Yagi, Akifumi Kasamatsu, Nobumitsu Hirose, Toshiaki Matsui
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Publication number: 20240079832Abstract: A connector panel includes: a disc-shaped panel base that has a first screw portion on an outer circumferential surface of the panel base; an attachment that has a first cylindrical portion and a flange, the attachment having a second screw portion at a first-end portion of an inner circumferential surface of the first cylindrical portion; and an intermediate support whose inner circumferential surface has a third screw portion to which the first screw portion of the panel base is to be screwed, and whose outer circumferential surface has a fourth screw portion to which the second screw portion of the attachment is to be screwed, the intermediate support having a second cylindrical portion that is to be disposed coaxially with the first cylindrical portion of the attachment.Type: ApplicationFiled: October 30, 2023Publication date: March 7, 2024Applicant: Mitsubishi Electric CorporationInventors: Yoshiyuki KUSANO, Kenji HIROSE, Kyota OTSUKA
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Patent number: 11549759Abstract: A heat transfer device includes a bag and a working fluid. The bag includes a first sheet and a second sheet with edges that are sealed together. The working fluid is enclosed in the bag. The working fluid changes a phase thereof between gas and liquid. The bag includes a vaporizing portion in which the liquid-phase working fluid is vaporized and a condensing portion in which the gas-phase working fluid is condensed. The bag includes a two-phase flow channel in which liquid-gas two-phase slug flow including the liquid-phase working fluid and the gas-phase working fluid occurs from the vaporizing portion to the condensing portion. The two-phase flow channel is provided in an internal space of the bag.Type: GrantFiled: November 16, 2018Date of Patent: January 10, 2023Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Hiroomi Hiramitsu, Akihisa Hosoe, Yoshiyuki Hirose, Akihiro Nagafuchi, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 11322784Abstract: A cooling member includes refrigerant, an absorbing member absorbing the refrigerant, an enclosing member including flexible sheet members, that are connected to each other and enclosing the refrigerant and the absorbing member in a sealed state, and a heat releasing section configured to receive heat from the enclosing member and release the heat to an outside.Type: GrantFiled: December 1, 2016Date of Patent: May 3, 2022Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Tomoharu Takeyama, Yoshiyuki Hirose
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Patent number: 11158891Abstract: A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat dissipation member that receives heat of the plurality of cooling members and dissipates the heat to an outside. The heat dissipation member has a spacer portion that is disposed between the adjacent extension portions of the plurality of cooling members and is configured to abut with the bulging portion.Type: GrantFiled: July 31, 2017Date of Patent: October 26, 2021Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Akihiro Nagafuchi, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 10998588Abstract: A power storage module includes a cooling member that has a coolant and a sealing body hermetically sealing the coolant; a power storage element that is stacked on the cooling members; and a heat transfer plate that is stacked on the power storage elements with the cooling members therebetween. The sealing body is configured to form a bulging portion deformed by evaporation of the coolant in a region not overlapping the power storage element. The heat transfer plate has a folded portion with which the bulging portion is configured to abut.Type: GrantFiled: July 20, 2017Date of Patent: May 4, 2021Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Akihiro Nagafuchi, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 10985415Abstract: A power storage module includes: a power storage element; a cooling member that is stacked on the power storage element and has a sealing body hermetically sealing a coolant and an absorption member disposed in the sealing body to absorb the coolant; and a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween. The heat transfer plate is provided with protrusion portions that protrude to the cooling member side.Type: GrantFiled: September 13, 2017Date of Patent: April 20, 2021Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Akihiro Nagafuchi, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 10985414Abstract: A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat transfer member that has a spacer portion disposed between the adjacent extension portions of the plurality of cooling members and configured to abut with the bulging portion.Type: GrantFiled: July 28, 2017Date of Patent: April 20, 2021Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Akihiro Nagafuchi, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 10910156Abstract: A power storage module includes: a power storage element; a cooling member that has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant in a region not overlapping the power storage element; a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween; and an elastic member that abuts with the heat transfer plate and the bulging portion and is elastically deformable.Type: GrantFiled: July 27, 2017Date of Patent: February 2, 2021Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES. LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Akihiro Nagafuchi, Tomoharu Takeyama, Eiichi Kobayashi
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Publication number: 20200386487Abstract: A heat transfer device includes a bag and a working fluid. The bag includes a first sheet and a second sheet with edges that are sealed together. The working fluid is enclosed in the bag. The working fluid changes a phase thereof between gas and liquid. The bag includes a vaporizing portion in which the liquid-phase working fluid is vaporized and a condensing portion in which the gas-phase working fluid is condensed. The bag includes a two-phase flow channel in which liquid-gas two-phase slug flow including the liquid-phase working fluid and the gas-phase working fluid occurs from the vaporizing portion to the condensing portion. The two-phase flow channel is provided in an internal space of the bag.Type: ApplicationFiled: November 16, 2018Publication date: December 10, 2020Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Hiroomi HIRAMITSU, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
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Publication number: 20200295419Abstract: A cooling member includes an enclosing member including sheet members that are connected in a liquid tight manner, refrigerant enclosed in the enclosing member, and a medium where the refrigerant moves within the enclosing member. The medium includes an evaporation section where the refrigerant is evaporated and turned into gas, the enclosing member includes a condensation section in which the refrigerant that is in a gaseous state is condensed and turned into liquid. The medium includes acceleration means that accelerates movement of the refrigerant that is in a liquid state to the evaporation section.Type: ApplicationFiled: March 7, 2017Publication date: September 17, 2020Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
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Publication number: 20200251790Abstract: A cooling member includes refrigerant, an absorbing member absorbing the refrigerant, an enclosing member including flexible sheet members, that are connected to each other and enclosing the refrigerant and the absorbing member in a sealed state, and a heat releasing section configured to receive heat from the enclosing member and release the heat to an outside.Type: ApplicationFiled: December 1, 2016Publication date: August 6, 2020Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Tomoharu TAKEYAMA, Yoshiyuki HIROSE
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Patent number: 10714798Abstract: A cooling member includes a sealing member including a first sheet member and a second sheet member connected to each other in a liquid-tightly closed state, a refrigerant enclosed in the sealing member, and an absorbing member disposed in the sealing member and configured to absorb the refrigerant.Type: GrantFiled: August 23, 2016Date of Patent: July 14, 2020Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Hisashi Sawada, Akihisa Hosoe, Tomoharu Takeyama, Yoshiyuki Hirose, Akihiro Nagafuchi, Eiichi Kobayashi
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Patent number: 10655919Abstract: An enclosing member including a sheet member connected in a liquid tight manner, refrigerant enclosed in the enclosing member, and an absorbing member arranged in the enclosing member and absorbing the refrigerant. The enclosing member includes a condensation section where the refrigerant that is in a gaseous state is condensed, and in the condensation section, the absorbing member is attached on at least a lower section of an inner surface of the enclosing member with respect to a vertical direction.Type: GrantFiled: March 8, 2017Date of Patent: May 19, 2020Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 10447022Abstract: A conductive member includes an enclosure, a coolant, and a conductor. The enclosure includes a sheet and has liquid tightness. The coolant is enclosed in the enclosure. The conductor includes a cool section that is disposed in the enclosure and a projecting section that is liquid-tightly sealed with the sheet and projects from the enclosure.Type: GrantFiled: January 31, 2017Date of Patent: October 15, 2019Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Yoshiyuki Hirose, Tomoharu Takeyama, Eiichi Kobayashi
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Patent number: 10396412Abstract: A power storage module includes power storage elements and cooling members that are in contact with the power storage elements to transfer heat. The cooling member includes an enclosing member, refrigerant, and an absorbing member absorbing the refrigerant, and the enclosing member includes a first sheet member and a second sheet member that are connected in a liquid tight manner, and the refrigerant and the absorbing member are arranged within the enclosing member. The cooling member is arranged to be inclined with respect to a horizontal plane such that a section thereof being in contact with the power storage element to transfer heat is on a lower level.Type: GrantFiled: December 1, 2016Date of Patent: August 27, 2019Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Akihisa Hosoe, Tomoharu Takeyama, Yoshiyuki Hirose
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Publication number: 20190221902Abstract: A power storage module includes: a power storage element; a cooling member that is stacked on the power storage element and has a sealing body hermetically sealing a coolant and an absorption member disposed in the sealing body to absorb the coolant; and a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween. The heat transfer plate is provided with protrusion portions that protrude to the cooling member side.Type: ApplicationFiled: September 13, 2017Publication date: July 18, 2019Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
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Publication number: 20190214692Abstract: A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat transfer member that has a spacer portion disposed between the adjacent extension portions of the plurality of cooling members and configured to abut with the bulging portion.Type: ApplicationFiled: July 28, 2017Publication date: July 11, 2019Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
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Publication number: 20190207278Abstract: A cooling member includes: a coolant; a sealing body in which a first sheet portion and a second sheet portion are opposed to each other and the coolant is hermetically sealed; absorption members that are disposed in the sealing body to absorb the coolant; and spacers that are disposed inside the sealing body to maintain a space between the first sheet portion and the second sheet portion.Type: ApplicationFiled: July 31, 2017Publication date: July 4, 2019Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI
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Publication number: 20190198950Abstract: A power storage module includes a cooling member that has a coolant and a sealing body hermetically sealing the coolant; a power storage element that is stacked on the cooling members; and a heat transfer plate that is stacked on the power storage elements with the cooling members therebetween. The sealing body is configured to form a bulging portion deformed by evaporation of the coolant in a region not overlapping the power storage element. The heat transfer plate has a folded portion with which the bulging portion is configured to abut.Type: ApplicationFiled: July 20, 2017Publication date: June 27, 2019Applicants: AUTONETWORKS TECHNOLOGIES, LTD, SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hideyuki KUBOKI, Hiroki HIRAI, Makoto HIGASHIKOZONO, Akihisa HOSOE, Yoshiyuki HIROSE, Akihiro NAGAFUCHI, Tomoharu TAKEYAMA, Eiichi KOBAYASHI