Patents by Inventor Yoshiyuki Iwata
Yoshiyuki Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096534Abstract: According to one embodiment, a superconducting coil apparatus comprising at least one superconducting coil formed of a plurality of turns under a definition that one turn is a portion of a superconducting wire annularly wound for one round, wherein: the superconducting coil has a shape along an outer peripheral surface of a tubular structure having a tubular shape; each of the plurality of turns has a coil longitudinal portion extending along an axial direction of the tubular structure; arrangement form of the coil longitudinal portion is different between a main magnetic field generation region configured to generate a main magnetic field and a magnetic field correction region configured to generate a correction magnetic field.Type: ApplicationFiled: July 14, 2023Publication date: March 21, 2024Applicants: TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION, National Institutes for Quantum Science and TechnologyInventors: Shigeki TAKAYAMA, Tomofumi ORIKASA, Kota MIZUSHIMA, Yoshiyuki IWATA, Yasushi ABE, Tetsuya FUJIMOTO
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Publication number: 20230360831Abstract: According to one embodiment, a superconducting coil apparatus comprising at least one superconducting coil formed of a plurality of turns under a definition that one turn is a portion of a superconducting wire annularly wound for one round, wherein: the superconducting coil has a shape along an outer peripheral surface of a tubular structure having a tubular shape; each of the plurality of turns has a coil longitudinal portion extending along an axial direction of the tubular structure and a coil end portion extending from the coil longitudinal portion along a circumferential direction of the tubular structure; and a boundary line indicating a border between the coil longitudinal portion and the coil end portion at each of the plurality of turns is inclined with respect to a reference line extending in the circumferential direction of the tubular structure in a side view of the tubular structure.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Applicants: TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION, National Institutes for Quantum Science and TechnologyInventors: Shigeki TAKAYAMA, Tomofumi ORIKASA, Kota MIZUSHIMA, Yoshiyuki IWATA, Yasushi ABE, Tetsuya FUJIMOTO
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Publication number: 20230187988Abstract: According to one embodiment, a rotor includes a rotor core which includes magnetic poles, magnet holding slots for each of the magnetic poles, and permanent magnets arranged in the magnet holding slots, respectively. The magnet holding slot includes a magnet loading area, a magnetic cavity, and an opening which opens to the magnetic cavity and an outer circumference of the rotor core. The rotor core includes a protruding portion having an outer surface which extends to the opening continuously with the outer circumferential surface of the rotor core, an end surface which intersects the outer surface at angle 90±10° to face the opening, and an inner surface which intersects the end surface to form an edge of the magnetic cavity.Type: ApplicationFiled: December 15, 2022Publication date: June 15, 2023Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATIONInventors: Hideki HISADA, Masaru KANO, Hiroaki MAKINO, Yoshiyuki IWATA
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Publication number: 20210299462Abstract: Provided is a particle beam therapeutic device, a particle beam therapeutic system, an irradiation planning device, and a particle beam irradiation method. In a particle beam therapeutic system 1, while a magnetic field generation device 9 generates a magnetic field that affects a particle beam in the vicinity of a target of a subject, a particle beam extracted from an ion source 2 is accelerated by an accelerator 4, transported by a beam transport system 5, and applied from an irradiation device 6. In the irradiation of the particle beam, an irradiation planning device 20 creates an irradiation plan of the particle beam in consideration of the influence of the magnetic field, and applies the particle beam based on this irradiation plan.Type: ApplicationFiled: December 6, 2017Publication date: September 30, 2021Inventors: Taku INANIWA, Koji NODA, Yoshiyuki IWATA
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Patent number: 10870500Abstract: Provided is a lock checking tool for a luggage compartment door that, when checking and correcting an incomplete locked state of the luggage compartment door, makes it possible to work without taking an unnatural posture, and is made to be easy to carry and not obstruct other work. The a lock checking tool is for a luggage compartment door in which a main body is formed into a telescopic structure by a plurality of tube materials of different diameters, a grip section is provided to the tube material on the outermost side of the main body, a pressure contact part is provided at a tip end section of the tube material on the innermost side, and the length of the main body can be fixed by a fixing means.Type: GrantFiled: March 28, 2016Date of Patent: December 22, 2020Assignee: Komy Co., Ltd.Inventors: Yoshiyuki Iwata, Tsuyoshi Watanabe
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Publication number: 20180237166Abstract: Provided is a lock checking tool for a luggage compartment door that, when checking and correcting an incomplete locked state of the luggage compartment door, makes it possible to work without taking an unnatural posture, and is made to be easy to carry and not obstruct other work. The present invention is a lock checking tool 1 for a luggage compartment door 11 in which a main body 2 is formed into a telescopic structure by a plurality of tube materials 2a, 2b, 2c of different diameters, a grip section 5 is provided to the tube material 2a on the outermost side of the main body 2, a pressure contact part 4 is provided at a tip end section of the tube material 2c on the innermost side, and the length of the main body 2 can be fixed by a fixing means 6.Type: ApplicationFiled: March 28, 2016Publication date: August 23, 2018Applicant: Komy Co., Ltd.Inventors: Yoshiyuki IWATA, Tsuyoshi WATANABE
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Patent number: 9481302Abstract: Provided is a mirror for checking blind spot that achieves further thickness reduction while being provided with flame resistance. A single double-sided adhesive tape 2 in which both surfaces of a base sheet 7 are coated with adhesives 8, 9 is attached to a back surface of a Fresnel mirror 1 formed of a planar transparent resin plate 3. The base sheet 7 is formed of a resin into which a flame retardant is blended.Type: GrantFiled: October 19, 2010Date of Patent: November 1, 2016Assignee: Komy Co., Ltd.Inventors: Sakae Komiyama, Yoshinori Koyama, Hisanaga Takeda, Yoshiyuki Iwata
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Patent number: 9420697Abstract: A method for manufacturing a printed wiring board includes forming an interlayer insulation layer on a conductive circuit, applying laser to a portion of the interlayer insulation layer such that an opening reaching to the conductive circuit is formed for a via conductor, subjecting the opening to a plasma treatment using a processing gas which includes a reactive gas including a fluorovinyl ether gas having a double bond of two carbon atoms and a fluoroalkyl ether group, forming an upper conductive circuit on the interlayer insulation layer, and forming a via conductor in the opening such that the via conductor connects the conductive circuit and the upper conductive circuit.Type: GrantFiled: June 28, 2012Date of Patent: August 16, 2016Assignees: IBIDEN Co., Ltd., National University Corporation Nagoya UniversityInventors: Yoshiyuki Iwata, Masaru Hori, Hajime Sakamoto
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Patent number: 9201177Abstract: Provided is a safety confirmation mirror whereby a blind spot near a corner of a passageway can be easily seen more clearly. The safety confirmation mirror includes, as a reflective surface (2), a portion of a Fresnel mirror (3) offset to one side of the widthwise center (C1). Accordingly, when the safety confirmation mirror is installed on a wall surface of a passageway at a T-shaped, L-shaped, or cross intersection, the reflective surface 2 reflects the blind spot of a passageway in one direction that a person is going to turn, and the person can see the conditions thereof. Moreover, the reflective surface 2 does not reflect the conditions in the unnecessary direction. Accordingly, the person looking at the safety confirmation mirror (1) is not confused by the unnecessary image and can easily see the blind spot near the corner of the passageway more clearly.Type: GrantFiled: October 13, 2011Date of Patent: December 1, 2015Assignee: KOMY CO., LTD.Inventors: Sakae Komiyama, Hiroshi Nishiyama, Katsumi Machida, Hisanaga Takeda, Yoshiyuki Iwata
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Publication number: 20150293276Abstract: A mirror, when attached along a curved surface, facilitates recognition of an image in a blind spot by reducing a feeling of strangeness caused by the aspect ratio of the image. Many linearly-extending strip reflective surfaces 5a are arranged on a surface of a sheet 2 to be parallel and adjacent to one another. An inclination angle A formed between a width direction of each of the strip reflective surfaces 5a and a surface direction of the sheet 2 is sequentially changed with an increase in a distance in a direction transverse to an extension direction of the strip reflective surfaces 5a. An aggregate of the strip reflective surfaces 5a has a cylindrical convex mirror function, and the mirror 1 is bendable in a cylindrical shape about an axis parallel to the direction transverse to the extension direction of the strip reflective surfaces 5a.Type: ApplicationFiled: May 10, 2013Publication date: October 15, 2015Inventors: Tetsuo Yokota, Yoshiyuki Iwata, Hisanaga Takeda, Yoshinori Koyama, Masaki Shinozaki
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Patent number: 8536696Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.Type: GrantFiled: August 25, 2009Date of Patent: September 17, 2013Assignee: Ibiden Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Publication number: 20130194686Abstract: Provided is a safety confirmation mirror whereby a blind spot near a corner of a passageway can be easily seen more clearly. The safety confirmation mirror includes, as a reflective surface (2), a portion of a Fresnel mirror (3) offset to one side of the widthwise center (C1). Accordingly, when the safety confirmation mirror is installed on a wall surface of a passageway at a T-shaped, L-shaped, or cross intersection, the reflective surface 2 reflects the blind spot of a passageway in one direction that a person is going to turn, and the person can see the conditions thereof. Moreover, the reflective surface 2 does not reflect the conditions in the unnecessary direction. Accordingly, the person looking at the safety confirmation mirror (1) is not confused by the unnecessary image and can easily see the blind spot near the corner of the passageway more clearly.Type: ApplicationFiled: October 13, 2011Publication date: August 1, 2013Applicant: KOMY CO., LTD.Inventors: Sakae Komiyama, Hiroshi Nishiyama, Katsumi Machida, Hisanaga Takeda, Yoshiyuki Iwata
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Publication number: 20130177714Abstract: A method for manufacturing a printed wiring board includes forming an interlayer insulation layer on a conductive circuit, applying laser to a portion of the interlayer insulation layer such that an opening reaching to the conductive circuit is formed for a via conductor, subjecting the opening to a plasma treatment using a processing gas which includes a reactive gas including a fluorovinyl ether gas having a double bond of two carbon atoms and a fluoroalkyl ether group, forming an upper conductive circuit on the interlayer insulation layer, and forming a via conductor in the opening such that the via conductor connects the conductive circuit and the upper conductive circuit.Type: ApplicationFiled: June 28, 2012Publication date: July 11, 2013Applicants: National University Corporation Nagoya University, IBIDEN CO., Ltd.Inventors: Yoshiyuki IWATA, Masaru HORI, Hajime SAKAMOTO
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Patent number: 8464392Abstract: The present invention provides an electric vacuum cleaner which can reliably absorb vibration accompanying driving of an electric blowing part. An electric blowing part 11 which is driven to generate a negative pressure is housed in a main body case 5. An energizing means 29 which energizes the electric blowing part 11 from the front side toward the center of gravity G of the electric blowing part 11 in a side view, and an energizing means 30 which energizes the electric blowing part 11 from the rear side, are provided on the main body case 5. Vibration accompanying driving of the electric blowing part 11 can be reliably absorbed by energizing of springs of the energizing means 29 and 30, and vibration can be isolated from the main body case 5.Type: GrantFiled: November 25, 2008Date of Patent: June 18, 2013Assignees: Kabushiki Kaisha Toshiba, Toshiba Consumer Electronics Holdings Corporation, Toshiba Home Appliances CorporationInventors: Tsuyoshi Sato, Masatoshi Tanaka, Yoshiyuki Iwata
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Patent number: 8383956Abstract: A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 ?m.Type: GrantFiled: December 23, 2008Date of Patent: February 26, 2013Assignee: IBIDEN Co., Ltd.Inventors: Toru Nakai, Satoru Kawai, Hiroshi Niwa, Yoshiyuki Iwata
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Patent number: 8197659Abstract: A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.Type: GrantFiled: September 22, 2011Date of Patent: June 12, 2012Assignee: IBIDEN Co., Ltd.Inventors: Toru Nakai, Satoru Kawai, Hiroshi Niwa, Yoshiyuki Iwata
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Publication number: 20120092785Abstract: Provided is a mirror for checking blind spot that achieves further thickness reduction while being provided with flame resistance. A single double-sided adhesive tape 2 in which both surfaces of a base sheet 7 are coated with adhesives 8, 9 is attached to a back surface of a Fresnel mirror 1 formed of a planar transparent resin plate 3. The base sheet 7 is formed of a resin into which a flame retardant is blended.Type: ApplicationFiled: October 19, 2010Publication date: April 19, 2012Applicant: KOMY CO., LTD.Inventors: Sakae Komiyama, Yoshinori Koyama, Hisanaga Takeda, Yoshiyuki Iwata
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Patent number: 8110917Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: GrantFiled: October 19, 2009Date of Patent: February 7, 2012Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Publication number: 20120005888Abstract: A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.Type: ApplicationFiled: September 22, 2011Publication date: January 12, 2012Applicant: IBIDEN CO., LTD.Inventors: Toru Nakai, Satoru Kawai, Hiroshi Niwa, Yoshiyuki Iwata
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Patent number: 8035214Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: GrantFiled: November 17, 1999Date of Patent: October 11, 2011Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu