Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.

Abstract: A linearity of a voltage change to a tuner insertion amount is verified for at least one of a plurality of tuners. Based on the voltage change linearity, individual voltage change data corresponding to respective insertion amounts are calculated for each of the plurality of tuners through a proportional calculation. A combination of auto-tuners and a combination of respective insertion amounts of the auto-tuners are determined using the individual voltage change data, and an adequacy of the determined combinations is verified through a direct three-dimensional electromagnetic field calculation. The combinations are determined on a condition that, when the individual voltage change data of nominated tuners are added together, respective voltage changes attributed to the nominated tuners are cancelled out to allow an entire voltage distribution to have substantially no change.

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: The present invention provides an electric vacuum cleaner which can reliably absorb vibration accompanying driving of an electric blowing part. An electric blowing part 11 which is driven to generate a negative pressure is housed in a main body case 5. An energizing means 29 which energizes the electric blowing part 11 from the front side toward the center of gravity G of the electric blowing part 11 in a side view, and an energizing means 30 which energizes the electric blowing part 11 from the rear side, are provided on the main body case 5. Vibration accompanying driving of the electric blowing part 11 can be reliably absorbed by energizing of springs of the energizing means 29 and 30, and vibration can be isolated from the main body case 5.

Abstract: The present invention intends to provide a novel printed wiring board manufacturing method by which printed wiring boards can be manufactured with efficiency. A method of manufacturing a printed wiring board (FIG. 1B) according to the present invention includes a step for preparing two sets of copper clad laminates (FIG. 2A), a step for bonding the copper clad laminates (FIG. 2B), steps for forming lands on both surfaces of a bonded laminate (FIGS. 2C to 2E), steps for forming respective resin layers on both surfaces of the bonded laminate and forming via hole openings to form respective via holes (FIGS. 2F to 2L), a step for forming a resin layer and forming a via hole opening to form a via hole (FIG. 2M), a step for separating the bonded laminate from each other (FIG. 2N) and steps for forming via hole openings from the bonded surface of the separated laminate to form via holes (FIGS. 2O to 2T).

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Abstract: A linearity of a voltage change to a tuner insertion amount is verified for at least one of a plurality of tuners. Based on the voltage change linearity, individual voltage change data corresponding to respective insertion amounts are calculated for each of the plurality of tuners through a proportional calculation. A combination of auto-tuners and a combination of respective insertion amounts of the auto-tuners are determined using the individual voltage change data, and an adequacy of the determined combinations is verified through a direct three-dimensional electromagnetic field calculation. The combinations are determined on a condition that, when the individual voltage change data of nominated tuners are added together, respective voltage changes attributed to the nominated tuners are cancelled out to allow an entire voltage distribution to have substantially no change.

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 ?m.

Abstract: A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.

Abstract: The present invention intends to provide a novel printed wiring board manufacturing method by which printed wiring boards can be manufactured with efficiency. A method of manufacturing a printed wiring board (FIG. 1B) according to the present invention includes a step for preparing two sets of copper clad laminates (FIG. 2A), a step for bonding the copper clad laminates (FIG. 2B), steps for forming lands on both surfaces of a bonded laminate (FIGS. 2C to 2E), steps for forming respective resin layers on both surfaces of the bonded laminate and forming via hole openings to form respective via holes (FIGS. 2F to 2L), a step for forming a resin layer and forming a via hole opening to form a via hole (FIG. 2M), a step for separating the bonded laminate from each other (FIG. 2N) and steps for forming via hole openings from the bonded surface of the separated laminate to form via holes (FIGS. 20 to 2T).

Abstract: A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.

Abstract: A massager including a shoulder massaging apparatus having a pair of massaging members and a first moving device for moving the pair of massaging members between a contacting position in which the pair of members contact with shoulders of a user and a retreated position in which the pair of massaging members are separated from the shoulders to massage the shoulders by disposing the pair of massaging members in the contacting position, a neck massaging apparatus having a second moving device for moving the pair of massaging members between a contacting position in which the pair of members contact with a neck of the user, and a retreated position in which the pair of massaging members are separated from the neck, to massage the neck by disposing the pair of massaging members in the contacting position, and a controlling apparatus for controlling operations of the shoulder and neck massaging apparatuses, the controlling apparatus being controllable independent, before and after, and simultaneous operations of t