Patents by Inventor Yoshiyuki Mukoyama
Yoshiyuki Mukoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5874518Abstract: An epoxy-modified polyamide resin obtained by reacting a diisocyanate(A) with at least one member selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid anhydride (B) in a nitrogen-containing aprotic solvent to form a polyamide resin intermediate and reacting this polyamide resin intermediate with an epoxy resin (C) in the nitrogen-containing aprotic solvent. This epoxy-modified polyamide resin has a high molecular weight and can provide a film with excellent heat resistance and flexibility, and its composition can be used as a coating material, adhesive or such in the form as it is.Type: GrantFiled: July 15, 1994Date of Patent: February 23, 1999Assignee: Hitachi Chemical Company, Ltd.Inventors: Kenji Suzuki, Yoshiyuki Mukoyama, Toshihiko Ito
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Patent number: 5625026Abstract: An amide group-containing epoxy resin obtained by reacting an epoxy resin with an amide group-containing diisocyanate obtained by reacting a diisocyanate with a dicarboxylic acid gives a uniform cured article showing high adhesiveness and is usable as an adhesive, a coating composition, and the like.Type: GrantFiled: May 18, 1994Date of Patent: April 29, 1997Assignee: Hitachi Chemical Company, Ltd.Inventors: Kenji Suzuki, Yoshiyuki Mukoyama, Toshihiko Ito
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Patent number: 5591813Abstract: An amide group-containing epoxy resin obtained by reacting an epoxy resin with an amide group-containing diisocyanate obtained by reacting a diisocyanate with a dicarboxylic acid gives a uniform cured article showing high adhesiveness and is usable as an adhesive, a coating composition, and the like.Type: GrantFiled: June 6, 1995Date of Patent: January 7, 1997Assignee: Hitachi Chemical Company, Ltd.Inventors: Kenji Suzuki, Yoshiyuki Mukoyama, Toshihiko Ito
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Patent number: 5164816Abstract: An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.Type: GrantFiled: August 2, 1991Date of Patent: November 17, 1992Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Nishizawa, Kenji Suzuki, Yoshiyuki Mukoyama, Tohru Kikuchi, Hidetaka Sato
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Patent number: 5087658Abstract: A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.Type: GrantFiled: December 18, 1989Date of Patent: February 11, 1992Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroshi Nishizawa, Kenji Suzuki, Yoshiyuki Mukoyama, Tohru Kikuchi, Hidetaka Sato
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Patent number: 5047499Abstract: High molecular weight polyamide-imides having a reduced viscosity of 0.3 dl/g or above and exhibiting excellent heat resistance and melt flowability are produced with good economic efficiency by a process, which process comprises the two reaction stages:(a) a first reaction stage which comprises reacting (I) a trimetallitic acid derivative and (II) an aromatic diamine in the presence of a polar solvent in the presence of a first dehydration catalyst until a polyamide-imide resin having a reduced viscisity of 0.2 to 0.5 dl/g as measured at a concentration of 0.5 g/dl in dimethylformamide at 30.degree. C. is produced; and(b) a second reaction stage which comprises adding a phosphorous triester as a second dehydration catalyst to the reaction mixture resulting from the first reaction stage and further reacting the reaction mixture until a high molecular weight polyamide-imide resin having a reduced viscosity of 0.3 dl/g or above as measured at a concentration of 0.5 g/dl in dimethylformaide at 30.degree. C.Type: GrantFiled: February 15, 1989Date of Patent: September 10, 1991Assignee: Hitachi Chemical Co., Ltd.Inventors: Toichi Sakata, Kenji Hattori, Yoshiyuki Mukoyama
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Patent number: 5037862Abstract: Disclosed is a polyamide-imide resin paste which comprises polyamide-imide resin solution dissolved in a non-nitrogen-containing solvent, wherein resin fine particles are dispersed in the solution in an amount of 1 to 50% by weight relative to the resulting polyamide-imide resin paste.According to the present invention, there can be provided a paste which does not cause any clogging of screen due to adhesion of the paste even in repeated printings over a long period of time and shows an excellent mechanical stability of a paste in printing.Type: GrantFiled: June 8, 1988Date of Patent: August 6, 1991Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroshi Nishizawa, Kenji Suzuki, Yoshiyuki Mukoyama
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Patent number: 5009949Abstract: A resin composition comprising a copolymer (A) having carbon-carbon unsaturated bonds in its side chains, particularly that obtained by reacting a copolymer of alkyl (meth)arylate (0-50 mole %), hydroxy (meth)acrylate (10-50 mole %) and ethylenic unsaturated monomer (0 to 90 mole %) with an unsaturated carboxylic acid or an anhydride thereof, and a monomer (B) copolymerizable with (A) is suitable for producing a laminate for electrical use.Type: GrantFiled: May 17, 1988Date of Patent: April 23, 1991Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazuyuki Tanaka, Etsuji Iwami, Jun Matsuzawa, Yoshiyuki Mukoyama, Norihiko Shibata, Akinori Hanawa, Mitsuo Yokota
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Patent number: 4954612Abstract: A solvent-soluble polyimide obtained from an exo-form dicarboxylic acid anhydride with an aromatic diamine, e.g. 2,2,-bis[4-(4-aminophenoxy)phenyl]propane is improved in film-forming properties and transparency, and particularly suitable for producing an orientation controlling film in a liquid crystal display device.Type: GrantFiled: February 14, 1989Date of Patent: September 4, 1990Assignee: Hitachi Chemical Co., Ltd.Inventors: Yoshihiro Nomura, Kazuhito Hanabusa, Hiroshi Minamisawa, Takashi Morinaga, Toichi Sakata, Yoshiyuki Mukoyama, Hiroshi Nishizawa, Hiromu Miyajima
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Patent number: 4791157Abstract: A polyetheramide-imide polymer composition comprising an aromatic polyetheramide-imide polymer obtained by reacting trimellitic acid or a derivative thereof with a special aromatic diamine having ether linkages, and an ether compound and/or an alicyclic ketone compound as a solvent is excellent in film-forming properties at low temperatures.Type: GrantFiled: March 2, 1987Date of Patent: December 13, 1988Assignee: Hitachi Chemical Co.Inventors: Hiroshi Nishizawa, Touichi Sakata, Yoshiyuki Mukoyama
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Patent number: 4614782Abstract: A heat resistant resin composition comprising (A) a polyamideimide resin soluble in a cresol type solvent obtained by using a lactam as a reactant, and (B) at least one member selected from the group consisting of a polyester resin, a polyesteramide resin, a polyesterimide resin and a polyesteramideimide resin, preferably heated for conducting a reaction, gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, crazing resistance, etc., suitable for enamelled wire.Type: GrantFiled: November 23, 1984Date of Patent: September 30, 1986Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroshi Nishizawa, Shozo Kasai, Yasunori Okada, Yuichi Osada, Yoshiyuki Mukoyama
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Patent number: 4530975Abstract: A polyamide-imide resin composition comprising (A) a polyamide-imide resin modified with a polyisocyanate containing one or more isocyanurate rings and a lactam and (B) at least one member selected from the group consisting of (i) an alkoxy modified amino resin, (ii) a polyisocyanate containing one or more isocyanurate rings, (iii) a phenol-formaldehyde resin, (iv) an epoxy resin, (v) a polyester resin having one or more hydroxyl groups obtained by using terephthalic acid and/or isophthalic acid as an acid component, and (vi) a metal salt of Sn, Mn, Co or Zn, can give fast curing properties to the resin composition without lowering heat resistance, flexibility, abrasion resistance and also giving good surface appearance to the coating.Type: GrantFiled: September 30, 1982Date of Patent: July 23, 1985Assignee: Hitachi Chemical Company, Ltd.Inventors: Yoshiyuki Mukoyama, Touichi Sakata, Yuichi Osada
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Patent number: 4505980Abstract: An insulated wire having excellent heat resistance, abrasion resistance and flexibility can be prepared by coating on an electric conductor directly or via another insulating material a polyamide-imide resin composition prepared by reacting an aromatic diisocyanate and a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding to the reaction system a lactam in an amount of 0.1 to 1.0 mole per mole of the aromatic diisocyanate, and if necessary, an alcohol and/or an oxime in an amount of 0.01 to 0.5 mole per mole of the aromatic diisocyanate before, during or after the above-mentioned reaction to mask terminal functional groups and to make the reduced viscosity of the composition 0.1 to 0.27, and baking the resin composition.Type: GrantFiled: November 4, 1982Date of Patent: March 19, 1985Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Nishizawa, Yoshiyuki Mukoyama, Shozo Kasai, Yasunori Okada
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Patent number: 4505818Abstract: A liquid chromatographic column packing material comprising porous styrene-divinylbenzene copolymer particles having --SO.sub.3.sup.- groups and, as counterion thereof, ions represented by the formula: .sup.+ NH.sub.n X.sub.m wherein X is --CH.sub.2 OH, --CH.sub.2 CH.sub.2 O--.sub.p H or --CR'.sub.q (CH.sub.2 OH).sub.r group; R' is hydrogen or a lower alkyl group; q and r are independently zero or an integer of 1 to 3, and q+r=3; p is an integer of 1 to 10; n is zero or an integer of 1; and m is an integer of 3 or 4, but m+n=4, is suited for separating sugars or sugaralcohols by liquid chromatography.Type: GrantFiled: September 20, 1983Date of Patent: March 19, 1985Assignee: Hitachi Chemical Co., Ltd.Inventors: Yoshiyuki Mukoyama, Osamu Hirai, Tetsuya Aoyama
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Patent number: 4497944Abstract: A polyamide-imide resin which can give a varnish having a high resin content, excellent in storage stability and heat resistant final products such as insulated wire can be produced by reacting an aromatic diisocyanate with a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding a compound having one active hydrogen atom before, during or after the above-mentioned reaction so as to adjust the reduced viscosity of the resin to 0.27 or lower.Type: GrantFiled: November 4, 1982Date of Patent: February 5, 1985Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroshi Nishizawa, Yoshiyuki Mukoyama
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Patent number: 4486308Abstract: Porous styrene-divinylbenzene copolymer particles having SO.sub.3.sup.- groups and counter ions for SO.sub.3.sup.- groups, said counter ions being (a) at least one of Ca.sup.++ and Sr.sup.++ and (b) at least one of Pb.sup.++ and Ba.sup.++ and the equivalent ratio of (a)/(b) being 1/2 to 2/1, are an excellent liquid chromatographic column packing material suited for separating sugars different in kind but the same in molecular weight.Type: GrantFiled: September 19, 1983Date of Patent: December 4, 1984Assignee: Hitachi Chemical Company, Ltd.Inventors: Osamu Hirai, Tetsuya Aoyama, Yoshiyuki Mukoyama
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Patent number: 4448844Abstract: A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.Type: GrantFiled: July 28, 1983Date of Patent: May 15, 1984Assignee: Hitachi Chemical Co., Ltd.Inventors: Yuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima, Yoshiyuki Mukoyama, Hiroshi Nishizawa
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Patent number: 4447589Abstract: A polyamide-imide resin which can give a varnish having a high resin content, excellent in storage stability and heat resistant final products can be produced by reacting an aromatic diisocyanate with a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding a specific amount of lactam and a specific amount of an alcohol and/or an oxime separately before, during or after the above-mentioned reaction so as to adjust the reduced viscosity of the resin to 0.10 to 0.27.Type: GrantFiled: November 4, 1982Date of Patent: May 8, 1984Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Nishizawa, Yoshiyuki Mukoyama, Shozo Kasai
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Patent number: 4431758Abstract: A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.Type: GrantFiled: March 31, 1982Date of Patent: February 14, 1984Assignee: Hitachi Chemical Company, Ltd.Inventors: Yuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima, Yoshiyuki Mukoyama, Hiroshi Nishizawa
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Patent number: 4427822Abstract: A particulate polymer which has imide groups and may be in gelled state can be produced by reacting a polyisocyanate with a polycarboxylic acid having at least one acid anhydride group, and if necessary together with a polycarboxylic acid other than that mentioned above in the presence of a liquid medium containing at least one non-aqueous organic liquid, and thereby obtaining the particulate polymer having imide groups dispersed in the non-aqueous organic liquid.Type: GrantFiled: November 10, 1982Date of Patent: January 24, 1984Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Nishizawa, Yoshiyuki Mukoyama, Osamu Hirai