Abstract: An IC unit includes a scale increment reading module that is configured to: detect, when an indicator in an instrument rotates, rotation of the indicator, and convert the rotation into rotation data; and an antenna that is configured to transmit the rotation data wirelessly from the IC tag unit to a reader. The instrument includes a scale plate, scale increments on the scale plate remain viewable when the IC tag unit is affixed to the instrument. The instrument includes a transparent cover plate, the IC tag unit is affixed to the transparent cover plate when the IC tag unit is affixed to an instrument. The IC tag unit is calibrated by rotating the IC tag unit until an indicating portion of the indicator overlaps a first pointer on the scale plate.

Abstract: To provide an IC tag unit, for an instrument, that can be retrofitted to an analog instrument, that does not impair the calibration state of the instrument, and that can read the value indicated by an indicator and take out the value to outside in a contactless manner. The IC tag unit includes a scale increment reading module 20 which reads operation of an indicator 55. An IC tag 11 performs wireless communication with a wireless reader 70 via an antenna 13? and includes a power module which extracts and supplies drive power for the IC tag by electromagnetic wave of the wireless communication. A sheet which holds the IC tag and an attachment layer which attaches the sheet to the transparent cover plate are provided. The IC tag is provided on the sheet at a position where the IC tag is not overlapped, in a viewing direction, with any of scale increments 56a and an indicating portion of the indicator at a time of mounting the IC tag to a transparent cover plate 53.

Abstract: An IC tag unit, for an instrument, which allows an IC tag into and from which instrument information, calibration information, inspection information, and the like can be written and read to be mounted to an instrument without affecting the IC tag by a metal portion of an instrument body, hindering visibility of a scale of the instrument, and further causing degradation due to dust, raindrops, or the like, and an instrument with the IC tag, are provided. An IC tag 11 having an IC chip 12 and an antenna 13, and mounting means configured to mount the IC tag to an instrument, are provided, and the instrument has scale increments and a pointer, and a transparent cover plate 53 that covers the scale increments 56a and the pointer.

Abstract: An IC tag unit, for an instrument, which allows an IC tag into and from which instrument information, calibration information, inspection information, and the like can be written and read to be mounted to an instrument without affecting the IC tag by a metal portion of an instrument body, hindering visibility of a scale of the instrument, and further causing degradation due to dust, raindrops, or the like, and an instrument with the IC tag, are provided. An IC tag 11 having an IC chip 12 and an antenna 13, and mounting means configured to mount the IC tag to an instrument, are provided, and the instrument has scale increments and a pointer, and a transparent cover plate 53 that covers the scale increments 56a and the pointer.

Abstract: A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.

Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Abstract: An object of the present invention is to provide a polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption though it has high water absorption property and which hardly causes scratches on the surface to be polished of an object to be polished, and a method for producing the same.

Abstract: A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

Abstract: A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Abstract: A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.

Abstract: As provided with a first reading section and a second reading section for reading both surfaces of a document, an image reading apparatus respectively calculates gamma correction values in gamma correcting sections and correction factors in color correcting sections, and corrects colors of criteria images being read by the first reading section and the second reading section in accordance with sample data stored on a storing section in order to substantially match the colors of both criteria images. In addition, the image reading apparatus utilizes an distinctive color range common for the both surfaces which defines a color about a distinguishing pattern, in order to determine whether images of both surfaces contain the distinguishing pattern or not.

Abstract: A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.

Abstract: A printer control processing device manages a result of the image capturing of the symbol pattern indicating information based on which a print process is controlled. The printer control processing device includes: a recording/retrieving section for obtaining reference pattern data and pattern printing data from an information storage section; a matching level determining section for determining a matching level between reference pattern data and the result of the image capturing by an image capturing device of a symbol pattern printed based on the pattern printing data; and a pattern modifying section modifying the pattern printing data corresponding to a captured symbol pattern if the matching level determining section determines that the matching level is less than a predetermined threshold. Therefore, pattern printing data can be provided which results in a reliably identifiable symbol pattern in the result the image capturing by the image capturing device.

Abstract: A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

Abstract: The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

Abstract: A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

Abstract: When an image based on RGB image data accepted by the image processing section and the ICU is to be enlarged by the zoom process section of the ICU (or when specification of an area in an image is accepted by the operation section), the leak-preventing identification mark detecting section, the positional relation calculating section and the forgery-preventing identification mark detecting section respectively determine whether patterns respectively representing a leak-preventing identification mark and a forgery-preventing identification mark are included separately in the entire area of the image and in an area to be enlarged (or an area whose specification has been accepted) or not.